In this paper, we compare the electrical characteristics of MOS capacitors and lateral MOSFETs with oxidized Ta<sub>2sub>Si (O-Ta<sub>2sub>Si) as a high-k dielectric on silicon carbide or stacked on thermally grown SiO<sub>2sub> on SiC. MOS capacitors are used to determine the dielectric and interfacial properties of these insulators. We demonstrate that stacked SiO<sub>2sub>/O-Ta<sub>2sub>Si is an attractive solution for passivation of innovative SiC devices. Ta<sub>2sub>Si deposition and oxidation is totally compatible with standard SiC MOSFET fabrication materials and processing. We demonstrate correct transistor operation for stacked O-Ta<sub>2sub>Si on thin thermally grown SiO<sub>2sub> oxides. However the channel mobility of such high-k MOSFETs must be improved investigating the interface properties further.