Preparation and characterization of metallic Cu spiral based on spirulina bioscaffold
- 作者：Jianhua Liu ; liujh@buaa.edu.cn ; Xiaoliang Zhang ; Songmei Li ; Mei Yu
- 关键词：Biomaterials ; Microstructure ; Cu spiral ; Bioscaffold ; Electroless deposition
- 刊名：Materials Letters
- 出版年：2012
- 期刊代码：59_0167577x
- 类别：ms
- 出版时间：15 June, 2012
- 卷：77
- 期：Complete
- 页码：51-53
- 文件大小：395 K
摘要
The metallic Cu spiral with length of 200-300 渭m was prepared based on spirulina bioscaffold. The electroless deposition approach was applied to cover the catalyzed spirulina forming the spiral. The morphology, composition and structure of the resulting spiral were characterized by using scanning electron microscopy (SEM), energy dispersive analysis (EDS) and X-ray diffraction (XRD). It was found that the spirulina was successfully covered with uniform Cu coating with face-centered cubic (FCC) structure, and the obtained spiral maintained the original shape of spirulina. It was suggested that this approach could be also utilized to prepare other metallic spiral such as Co, Ag or other alloys to vary the magnetic, electrical or physical properties, and the obtained spiral could be promising material as functional micro-springs and micro-devices for microelectromechanical systems (MEMS) studying.