Effect of molybdenum as interfacial element on the thermal conductivity of diamond/Cu composites

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• 作者：Xiao-Yu Shen^a ; Xin-Bo He^a ; ^{xb_he@163.com} ; ^{xyshen.ustb@gmail.com} ; Shu-Bin Ren^a ; Hao-Ming Zhang^a ; Xuan-Hui Qu^a ; ^b
• 关键词：Composite materials ; Liquid&ndash ; solid reactions ; Heat conduction ; Microstructure
• 刊名：Journal of Alloys and Compounds
• 出版年：2012
• 期刊代码：45_09258388
• 类别：ms
• 出版时间：15 July, 2012
• 卷：529
• 期：Complete
• 页码：134-139
• 文件大小：1616 K

摘要

As a carbide forming additive, molybdenum gets maximum benefit of high thermal conductivities of diamond and copper. Coating Mo on the diamond surface can promote the interfacial bonding in diamond/Cu composites. A Mo coated diamond/Cu composite with high thermal conductivity of 726 W/mK is obtained, which is achieved by a thin nano-sized Mo₂C layer. Mo coated diamond or un-coated diamond reinforced copper composites have been made by pressure assisted liquid copper infiltration method. The interfacial configuration, the bulk thermal conductivity and the evolution of interfacial thermal resistance are presented, indicating that the good adhesion at the interface can decrease the thermal boundary resistance and thus increase the thermal conductivity of the composites.