Sustained Immersion Tin Deposition on Copper from Choline Chloride Based Aqueous Solution without Reducing Agent
- 作者：Yurong WangJiawei HeWenchang WangMitsuzaki NaotoshiZhidong Chen
- 会议时间：2014-04-21
- 作者单位：Yurong Wang,Jiawei He,Wenchang Wang,Zhidong Chen(School of Petrochemical Engineering, Jiangsu Province Key Laboratory of Fine Petrochemical Engineering, Changzhou University, Changzhou 213164, China)Mitsuzaki Naotoshi(Taiyo Techno Service Co., Ltd, Osaka 554-0052, Japan)
- 母体文献：2014(重庆)国际表面工程论坛暨第十二届全国表面工程·电镀与精饰年会论文集
- 会议名称：2014(重庆)国际表面工程论坛暨第十二届全国表面工程·电镀与精饰年会
- 会议地点：重庆
- 主办单位：中国表面工程协会
- 语种：chi
摘要
Sustained immersion tin (Sn) deposition onto a copper (Cu) surface was achieved from choline chloride aqueous (ChCl-H2O) solution free of reducing agents.The electrode potentials of Cu and Sn were investigated by open-circuit potential (OCP) to reveal the driving force of Sn deposition process in ChCl-H2O solution.Thiourea reversed the electrode potentials of Cu and Sn, causing the replacement reaction between Sn2+ and Cu occurring.The replacement reaction is significantly influenced by the concentration of ChCl, SnCl2, and thiourea.The phenomenon of sustained Sn deposition was mainly facilitated by diffusing of Cu into the Sn coating and the reaction between Sn2+ and Cu+.Furthermore, Sn coating got in ChCl-H2O solution had fairly good performance such as solderability.