光纤激光器电源模块有限元热分析研究
|
摘要
电源模块作为光纤激光器的重要部件,其工作性能受温度影响很大。为解决电源模块过热和温度分布不均匀的问题,提高其热可靠性,采用有限元法对某型光纤激光器的电源模块进行了热仿真分析。试验测试数据与软件仿真结果具有高度的一致性,整体趋势吻合,最大误差不超过5%,验证了仿真模型的正确性和可行性。在此基础上提出了优化元件布局的散热改进方案,并进行了仿真计算。改进后最高温度降低了3.8℃,且整场温度分布更加均匀。结果表明,合理优化元件布局,可有效改善电源模块的散热状况。
The power module is an important component for the fiber laser and temperature has a significant impact on its performance. In order to solve the problem of overheating and non-uniform temperature distribution and to improve the thermal reliability, the power module of fiber laser is analyzed using finite element method for its thermal properties and temperature field. A good agreement between simulation results and experimental data is obtained. The variation trends are similar and the maximum error is less than 5%, which proves the correction and feasibility of the simulation model. A scheme to improve the heat distribution based on optimization of electronic components placement is proposed. The simulation results show that the maximum temperature is decreased by 3.8 ℃ and the temperature uniformity is better than the original design. As a conclusion, the heat distribution condition of the power module can be improved effectively by arranging the electronic components reasonably.
The power module is an important component for the fiber laser and temperature has a significant impact on its performance. In order to solve the problem of overheating and non-uniform temperature distribution and to improve the thermal reliability, the power module of fiber laser is analyzed using finite element method for its thermal properties and temperature field. A good agreement between simulation results and experimental data is obtained. The variation trends are similar and the maximum error is less than 5%, which proves the correction and feasibility of the simulation model. A scheme to improve the heat distribution based on optimization of electronic components placement is proposed. The simulation results show that the maximum temperature is decreased by 3.8 ℃ and the temperature uniformity is better than the original design. As a conclusion, the heat distribution condition of the power module can be improved effectively by arranging the electronic components reasonably.
引文
[1] 戴夫·S·斯坦伯格.电子设备冷却技术[M]. 北京: 航空工业出版社, 2012.
[2] 崔昊杨, 许永鹏, 曾俊冬, 等. 多电子元件及芯片组布局的热分析[J]. 上海电力学院学报, 2013, 29(5): 459-462.
[3] 谢德仁. 电子设备热设计工作点评[J]. 电子机械工程, 1999(1): 27-28.
[4] 朱国玺, 刘贵喜, 赵地. 基于遗传算法的电子元器件优化布局[J]. 计算机工程与应用, 2007, 43(17): 100-103.
[5] 张小军, 胡欲立, 王耀霆. 电子元件位置优化设计[J]. 机械与电子, 2006(3): 19-21.
[6] 李跟宝, 王扬, 汪熙,等. 多芯片PCB板热布局优化试验研究及数值模拟[J]. 电子器件, 2017, 40(4): 800-805.
[7] 阎德劲, 周德俭, 黄春跃, 等. 基于遗传算法的表面组装电子元件热布局优化[J]. 电子机械工程, 2007, 23(2): 12-17.
[8] 刘文广, 吴凡. 基于APDL的PCB元件布局优化[J]. 电子工艺技术, 2009, 30(3): 151-153.
[9] 赵春林. 电子设备的热分析[J]. 电子机械工程, 2002, 18(5): 40-42.
[10] 魏顺宇, 李志国, 程尧海, 等. 多芯片组件的三维温度场有限元模拟与分析[J]. 微电子学, 2005, 35(4): 371-374.
[2] 崔昊杨, 许永鹏, 曾俊冬, 等. 多电子元件及芯片组布局的热分析[J]. 上海电力学院学报, 2013, 29(5): 459-462.
[3] 谢德仁. 电子设备热设计工作点评[J]. 电子机械工程, 1999(1): 27-28.
[4] 朱国玺, 刘贵喜, 赵地. 基于遗传算法的电子元器件优化布局[J]. 计算机工程与应用, 2007, 43(17): 100-103.
[5] 张小军, 胡欲立, 王耀霆. 电子元件位置优化设计[J]. 机械与电子, 2006(3): 19-21.
[6] 李跟宝, 王扬, 汪熙,等. 多芯片PCB板热布局优化试验研究及数值模拟[J]. 电子器件, 2017, 40(4): 800-805.
[7] 阎德劲, 周德俭, 黄春跃, 等. 基于遗传算法的表面组装电子元件热布局优化[J]. 电子机械工程, 2007, 23(2): 12-17.
[8] 刘文广, 吴凡. 基于APDL的PCB元件布局优化[J]. 电子工艺技术, 2009, 30(3): 151-153.
[9] 赵春林. 电子设备的热分析[J]. 电子机械工程, 2002, 18(5): 40-42.
[10] 魏顺宇, 李志国, 程尧海, 等. 多芯片组件的三维温度场有限元模拟与分析[J]. 微电子学, 2005, 35(4): 371-374.