协同创新,推动中国集成电路封测业发展
|
摘要
2017年,中国半导体行业协会集成电路分会秘书长、国家集成电路封测产业链技术创新战略联盟秘书长于燮康在第十一届中国半导体行业协会半导体分立器件年会暨2017中国半导体器件创新产品与应用及产业发展论坛做了主旨报告。论述封装技术需求越来越高,封装和设计、制造、装备、材料、系统厂商、科研院所、大学的合作越来越紧密,经过市场化检验,自发形成的五大协同创新模式。
In 2017, YU Xiekang, Secretary General of China Semiconductor Industry Association and the national integrated circuit and IC packaging and testing industry chain technology innovation strategic alliance, made a keynote report in the 11 th session of the China Semiconductor Industry Association Annual Conference of the 2017 China discrete semiconductor devices semiconductor device product innovation and application and industry development forum. He discussed packaging and design, manufacturing, materials, equipment, system manufacturers, research institutes, universities increasingly close cooperation, through the market test with the packaging technology being more and more high demand, and the spontaneous formation of five collaborative innovation mode.
In 2017, YU Xiekang, Secretary General of China Semiconductor Industry Association and the national integrated circuit and IC packaging and testing industry chain technology innovation strategic alliance, made a keynote report in the 11 th session of the China Semiconductor Industry Association Annual Conference of the 2017 China discrete semiconductor devices semiconductor device product innovation and application and industry development forum. He discussed packaging and design, manufacturing, materials, equipment, system manufacturers, research institutes, universities increasingly close cooperation, through the market test with the packaging technology being more and more high demand, and the spontaneous formation of five collaborative innovation mode.
引文
[1]于燮康.集成电路产业技术发展趋势与突破路径[J].中国工业评论,2015(08).
[2]于燮康.协同创新成为IC产业发展重中之重[N].中国电子报,2015-12-01.
[3]于燮康.我国集成电路发展以应用为牵头,以系统厂商为龙头[J].中国战略新兴产业,2016(8).
[4]丁菲.牵手中芯国际长电科技打造IC产业链[N].中国证券报,2014-02-21.
[5]许诺.中芯国际与长电科技联手打造中国IC制造产业链[J].集成电路应用,2014(03).
[6]中芯长电半导体(江阴)有限公司[EB/OL].http://www.yjbys.com.
[7]于燮康.协同创新成为产业发展的重中之重[J].集成电路应用,2016,33(2).
[2]于燮康.协同创新成为IC产业发展重中之重[N].中国电子报,2015-12-01.
[3]于燮康.我国集成电路发展以应用为牵头,以系统厂商为龙头[J].中国战略新兴产业,2016(8).
[4]丁菲.牵手中芯国际长电科技打造IC产业链[N].中国证券报,2014-02-21.
[5]许诺.中芯国际与长电科技联手打造中国IC制造产业链[J].集成电路应用,2014(03).
[6]中芯长电半导体(江阴)有限公司[EB/OL].http://www.yjbys.com.
[7]于燮康.协同创新成为产业发展的重中之重[J].集成电路应用,2016,33(2).