荧光法测量光学元件亚表面损伤深度的实验研究（英文）
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摘要
本文利用纳米级荧光量子点对光学元件亚表面缺陷进行标记,采用共聚焦荧光显微镜对聚焦表面进行逐层扫描,得到被测样品不同深度处的切片图像。通过特征点荧光强度的变化,定量表征了熔石英光学元件的亚表面损伤深度。结果表明,当扫描深度超过临界值时,最大荧光强度急剧下降,光学元件亚表面损伤深度可以通过量子点实际嵌入深度确定。考虑到破坏性检测方法能有效验证的无损检测方法,角度抛光、磁流变抛光实验在相同的条件下进行。结果表明,纳米级量子点对光学元件的表面缺陷具有良好的标注能力。此外,无损检测方法可以有效地评估熔石英元件的亚表面损伤深度。
Subsurface defects were fluorescently tagged with nanoscale quantum dots and scanned layer by layer using confocal fluorescence microscopy to obtain images at various depths.Subsurface damage depths of fused silica optics were characterized quantitatively by changes in the fluorescence intensity of feature points.The fluorescence intensity vs scan depth revealed that the maximum fluorescence intensity decreases sharply when the scan depth exceeds a critical value.The subsurface damage depth could be determined by the actual embedded depth of the quantum dots.Taper polishing and magnetorheological finishing were performed under the same conditions to verify the effectiveness of the nondestructive fluorescence method.The results indicated that the quantum dots effectively tagged subsurface defects of fused-silica optics,and that the nondestructive detection method could effectively evaluate subsurface damage depths.
Subsurface defects were fluorescently tagged with nanoscale quantum dots and scanned layer by layer using confocal fluorescence microscopy to obtain images at various depths.Subsurface damage depths of fused silica optics were characterized quantitatively by changes in the fluorescence intensity of feature points.The fluorescence intensity vs scan depth revealed that the maximum fluorescence intensity decreases sharply when the scan depth exceeds a critical value.The subsurface damage depth could be determined by the actual embedded depth of the quantum dots.Taper polishing and magnetorheological finishing were performed under the same conditions to verify the effectiveness of the nondestructive fluorescence method.The results indicated that the quantum dots effectively tagged subsurface defects of fused-silica optics,and that the nondestructive detection method could effectively evaluate subsurface damage depths.
引文
[1]LI Hao-nan,YU Tian-biao,ZHU Li-da,WANG Wan-shan.Evaluation of grinding-induced subsurface damage in optical glass BK7[J].Journal of Materials Processing Technology,2016,229:785-794.
[2]BIFANO T G,FAWCETT S C.Specific grinding energy as an in-process control variable for ductile-regime grinding[J].Precision Engineering-Journal of the American Society for Precision Engineering,1991,13:256-262.
[3]BUIJS M,KORPELVANHOUTEN K.3-body abrasion of brittle materials as studied by lapping[J].Wear,1993,166:237-245.
[4]LI Sheng-yi,WANG Zhuo,WU Yu-lie.Relationship between subsurface damage and surface roughness of optical materials in grinding and lapping processes[J].Journal of Materials Processing Technology,2008,205:34-41.
[5]ZHANG C,RENTSCH R,BRINKSMEIER E.Advances in micro ultrasonic assisted lapping of microstructures in hard-brittle materials:A brief review and outlook[J].International Journal of Machine Tools&Manufacture,2005,45:881-890.
[6]LI Ya-guo,WU Yong-bo,WANG Jian,GUO Yin-biao,XUQiao.Tentative investigation towards precision polishing of optical components with ultrasonically vibrating boundabrasive pellets[J].Optics Express,2012,20:568-575.
[7]LI Ya-guo,ZHENG Nan,LI Hai-bo,HOU Jing,LEIXiang-yang,CHEN Xian-hua,YUAN Zhi-gang,GUOZhao-zhou,WANG Jian,GUO Yin-biao,XU Qiao.Morphology and distribution of subsurface damage in optical fused silica parts:Bound-abrasive grinding[J].Appl Surf Sci,2011,257:2066-2073.
[8]WILLIAMS W B,MULLANY B A,PARKER W C,MOYER P J,RANDLES M H.Using quantum dots to tag subsurface damage in lapped and polished glass samples[J].Applied Optics,2009,48:5155-5163.
[9]BIFANO T G,DEPIERO D K,GOLINI D.Chemomechanical effects in ductile-regime machining of glass[J].Precision Engineering-Journal of the American Society for Precision Engineering,1993,15:238-247.
[10]BERCEGOL H,GRUA P,HEBERT D,MORREEUW J P.Progress in the understanding of fracture related laser damage of fused silica[C]//Proceedings of SPIE-The International for Optical Engineering.Boulder,CO,USA,2007:672003.
[11]WANG Chu,WANG Hong-xiang,SHEN Lu,HOU Jing,XU Qiao,WANG Jian,CHEN Xian-hua.Numerical simulation and experimental study on crack self-healing in BK7 glass[J].Ceramics International,2018,44(2):1850-1858.
[12]MILLER P E,BUDE J D,SURATWALA T I,SHEN N,LAURANCE T A,STEELE W A,MENAPACE J,FEIT MD,WONG L L.Fracture-induced subbandgap absorption as a precursor to optical damage on fused silica surfaces[J].Opt Lett,2010,35:2702-2704.
[13]DONG Zhi-chao,CHENG Hao-bo,XU Ye,TAM H Y.Subsurface damage of fused silica lapped by fixed-abrasive diamond pellets[J].Applied Optics,2014,53:5841-5849.
[14]BIAN Yan-fei,ZHAI Wen-jie,CHENG Yuan-yuan,ZHUBao-quan.Scratching by pad asperities in copper electrochemical-mechanical polishing[J].Journal of Central South University,2014,21(11):4157-4162.
[15]NEAUPORT J,AMBARD C,CORMONT P,DARBOIS N,DESTRIBATS J,LUITOT C,RONDEAU O.Subsurface damage measurement of ground fused silica parts by hf etching techniques[J].Optics Express,2009,17:20448-20456.
[16]HED P P,EDWARDS D F.Optical glass fabrication technology.2:Relationship between surface roughness and subsurface damage[J].Applied Optics,1987,26:4677-4680.
[17]MENAPACE J A,DAVIS P J,STEELE W A,WONG L L,SURATWALA T I,MILLER P E.MRF applications:Measurement of process-dependent subsurface damage in optical materials using the MRF wedge technique[R].Livermore,CA:Lawrence Livermore National Laboratory(LLNL),2005.
[18]ZHOU Y Y,FUNKENBUSCH P D,QUESNEL D J,GOLINI D,LINDQUIST A.Effect of etching and imaging mode on the measurement of subsurface damage in microground optical-glasses[J].J Am Ceram Soc,1994,77:3277-3280.
[19]MEEDER M,MAURET T,BOOIJ S M,BRAAT J J M,FAEHNLE O W.In Optimization of polishing processes by using itirm for in situ monitoring of surface quality[C]//Proceedings of SPIE-Optical Manufacturing and Testing V.Bellingham,WA,2003,5180:40-46.
[20]ELLINGSON W A,TODD J A,SUN J.Optical method and apparatus for detection of defects and microstructural changes in ceramics and ceramic coatings[P].Google Patents:2001.
[21]NEAUPORT J,CORMONT P,LEGROS P,AMBARD C,DESTRIBATS J.Imaging subsurface damage of grinded fused silica optics by confocal fluorescence microscopy[J].Optics Express,2009,17:3543-3554.
[22]CATRIN R,NEAUPORT J,LEGROS P,TAROUX D,CORBINEAU T,CORMONT P,MAUNIER C.Using sted and elsm confocal microscopy for a better knowledge of fused silica polished glass interface[J].Optics Express,2013,21:29769-29779.
[23]WANG Zhuo,WANG Lin,YANG Jun-hong,PENGWen-qiang,HU Hao.Detection of subsurface trace impurity in polished fused silica with biological method[J].Optics Express,2014,22:21292-21301.
[24]WILLIAMS W,MULLANY B,PARKER W,MOYER P,RANDLES M.Using quantum dots to evaluate subsurface damage depths and formation mechanisms in glass[J].CIRPAnnals-Manufacturing Technology,2010,59:569-572.
[25]ZAN Feng,DONG Chao-qing,LIU Heng,REN Ji-cun.Experimental studies on blinking behavior of single Inp/Zns quantum dots:Effects of synthetic conditions and uv irradiation[J].The Journal of Physical Chemistry C,2012,116:3944-3950.
[26]LIN Yi,XIE Hai-yan,ZHANG Zhi-ling,TIAN Zhi-quan,PANG Dai-wen.Fluorescent semiconductor quantum dots for biolabeling[J].Progress in Chemistry 2007,19:1861-1865.
[27]HOCKEN R J,CHAKRABORTY N,BROWN C.Optical metrology of surfaces[J].CIRP Annals-Manufacturing Technology,2005,54:169-183.
[28]RüTTINGER S,BUSCHMANN V,KR?MER B,ERDMANN R,MACDONALD R,KOBERLING F.Comparison and accuracy of methods to determine the confocal volume for quantitative fluorescence correlation spectroscopy[J].Journal of Microscopy,2008,232:343-352.
[29]RüTTINGER S,BUSCHMANN V,KR?MER B,ERDMANN R,MACDONALD R,KOBERLING F.In Determination of the confocal volume for quantitative fluorescence correlation spectroscopy[C]//Confocal,Multiphoton,and Nonlinear Microscopic Imaging III.Munich:Optical Society of America,2007:6612-6630.
[30]LAMBROPOULOS J.From abrasive size to subsurface damage in grinding[C]//Optical Fabrication and Testing.Québec City:Optical Society of America,2000:17-18.(Edited by HE Yun-bin)
[2]BIFANO T G,FAWCETT S C.Specific grinding energy as an in-process control variable for ductile-regime grinding[J].Precision Engineering-Journal of the American Society for Precision Engineering,1991,13:256-262.
[3]BUIJS M,KORPELVANHOUTEN K.3-body abrasion of brittle materials as studied by lapping[J].Wear,1993,166:237-245.
[4]LI Sheng-yi,WANG Zhuo,WU Yu-lie.Relationship between subsurface damage and surface roughness of optical materials in grinding and lapping processes[J].Journal of Materials Processing Technology,2008,205:34-41.
[5]ZHANG C,RENTSCH R,BRINKSMEIER E.Advances in micro ultrasonic assisted lapping of microstructures in hard-brittle materials:A brief review and outlook[J].International Journal of Machine Tools&Manufacture,2005,45:881-890.
[6]LI Ya-guo,WU Yong-bo,WANG Jian,GUO Yin-biao,XUQiao.Tentative investigation towards precision polishing of optical components with ultrasonically vibrating boundabrasive pellets[J].Optics Express,2012,20:568-575.
[7]LI Ya-guo,ZHENG Nan,LI Hai-bo,HOU Jing,LEIXiang-yang,CHEN Xian-hua,YUAN Zhi-gang,GUOZhao-zhou,WANG Jian,GUO Yin-biao,XU Qiao.Morphology and distribution of subsurface damage in optical fused silica parts:Bound-abrasive grinding[J].Appl Surf Sci,2011,257:2066-2073.
[8]WILLIAMS W B,MULLANY B A,PARKER W C,MOYER P J,RANDLES M H.Using quantum dots to tag subsurface damage in lapped and polished glass samples[J].Applied Optics,2009,48:5155-5163.
[9]BIFANO T G,DEPIERO D K,GOLINI D.Chemomechanical effects in ductile-regime machining of glass[J].Precision Engineering-Journal of the American Society for Precision Engineering,1993,15:238-247.
[10]BERCEGOL H,GRUA P,HEBERT D,MORREEUW J P.Progress in the understanding of fracture related laser damage of fused silica[C]//Proceedings of SPIE-The International for Optical Engineering.Boulder,CO,USA,2007:672003.
[11]WANG Chu,WANG Hong-xiang,SHEN Lu,HOU Jing,XU Qiao,WANG Jian,CHEN Xian-hua.Numerical simulation and experimental study on crack self-healing in BK7 glass[J].Ceramics International,2018,44(2):1850-1858.
[12]MILLER P E,BUDE J D,SURATWALA T I,SHEN N,LAURANCE T A,STEELE W A,MENAPACE J,FEIT MD,WONG L L.Fracture-induced subbandgap absorption as a precursor to optical damage on fused silica surfaces[J].Opt Lett,2010,35:2702-2704.
[13]DONG Zhi-chao,CHENG Hao-bo,XU Ye,TAM H Y.Subsurface damage of fused silica lapped by fixed-abrasive diamond pellets[J].Applied Optics,2014,53:5841-5849.
[14]BIAN Yan-fei,ZHAI Wen-jie,CHENG Yuan-yuan,ZHUBao-quan.Scratching by pad asperities in copper electrochemical-mechanical polishing[J].Journal of Central South University,2014,21(11):4157-4162.
[15]NEAUPORT J,AMBARD C,CORMONT P,DARBOIS N,DESTRIBATS J,LUITOT C,RONDEAU O.Subsurface damage measurement of ground fused silica parts by hf etching techniques[J].Optics Express,2009,17:20448-20456.
[16]HED P P,EDWARDS D F.Optical glass fabrication technology.2:Relationship between surface roughness and subsurface damage[J].Applied Optics,1987,26:4677-4680.
[17]MENAPACE J A,DAVIS P J,STEELE W A,WONG L L,SURATWALA T I,MILLER P E.MRF applications:Measurement of process-dependent subsurface damage in optical materials using the MRF wedge technique[R].Livermore,CA:Lawrence Livermore National Laboratory(LLNL),2005.
[18]ZHOU Y Y,FUNKENBUSCH P D,QUESNEL D J,GOLINI D,LINDQUIST A.Effect of etching and imaging mode on the measurement of subsurface damage in microground optical-glasses[J].J Am Ceram Soc,1994,77:3277-3280.
[19]MEEDER M,MAURET T,BOOIJ S M,BRAAT J J M,FAEHNLE O W.In Optimization of polishing processes by using itirm for in situ monitoring of surface quality[C]//Proceedings of SPIE-Optical Manufacturing and Testing V.Bellingham,WA,2003,5180:40-46.
[20]ELLINGSON W A,TODD J A,SUN J.Optical method and apparatus for detection of defects and microstructural changes in ceramics and ceramic coatings[P].Google Patents:2001.
[21]NEAUPORT J,CORMONT P,LEGROS P,AMBARD C,DESTRIBATS J.Imaging subsurface damage of grinded fused silica optics by confocal fluorescence microscopy[J].Optics Express,2009,17:3543-3554.
[22]CATRIN R,NEAUPORT J,LEGROS P,TAROUX D,CORBINEAU T,CORMONT P,MAUNIER C.Using sted and elsm confocal microscopy for a better knowledge of fused silica polished glass interface[J].Optics Express,2013,21:29769-29779.
[23]WANG Zhuo,WANG Lin,YANG Jun-hong,PENGWen-qiang,HU Hao.Detection of subsurface trace impurity in polished fused silica with biological method[J].Optics Express,2014,22:21292-21301.
[24]WILLIAMS W,MULLANY B,PARKER W,MOYER P,RANDLES M.Using quantum dots to evaluate subsurface damage depths and formation mechanisms in glass[J].CIRPAnnals-Manufacturing Technology,2010,59:569-572.
[25]ZAN Feng,DONG Chao-qing,LIU Heng,REN Ji-cun.Experimental studies on blinking behavior of single Inp/Zns quantum dots:Effects of synthetic conditions and uv irradiation[J].The Journal of Physical Chemistry C,2012,116:3944-3950.
[26]LIN Yi,XIE Hai-yan,ZHANG Zhi-ling,TIAN Zhi-quan,PANG Dai-wen.Fluorescent semiconductor quantum dots for biolabeling[J].Progress in Chemistry 2007,19:1861-1865.
[27]HOCKEN R J,CHAKRABORTY N,BROWN C.Optical metrology of surfaces[J].CIRP Annals-Manufacturing Technology,2005,54:169-183.
[28]RüTTINGER S,BUSCHMANN V,KR?MER B,ERDMANN R,MACDONALD R,KOBERLING F.Comparison and accuracy of methods to determine the confocal volume for quantitative fluorescence correlation spectroscopy[J].Journal of Microscopy,2008,232:343-352.
[29]RüTTINGER S,BUSCHMANN V,KR?MER B,ERDMANN R,MACDONALD R,KOBERLING F.In Determination of the confocal volume for quantitative fluorescence correlation spectroscopy[C]//Confocal,Multiphoton,and Nonlinear Microscopic Imaging III.Munich:Optical Society of America,2007:6612-6630.
[30]LAMBROPOULOS J.From abrasive size to subsurface damage in grinding[C]//Optical Fabrication and Testing.Québec City:Optical Society of America,2000:17-18.(Edited by HE Yun-bin)