一种盐基胶体钯活化剂研究
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摘要
文章介绍了胶体钯活化剂的结构、活化原理以及配制的反应机理,详细介绍了盐基胶体钯主要成分的作用和制备过程中每一步的作用。盐基胶体钯活化剂CS-22-H在低钯浓度工作时沉铜起发时间短、背光等级高、沉铜速率稳定、沉铜层附着力强,各项性能达到印制电路板的技术指标,与酸基胶体钯活化剂相比环境友好,降低了沉铜成本,应用前景良好。
This paper introduces the structure of colloidal palladium activator, the principle of activation and the reaction mechanism of the colloidal palladium activator. The function of the main components of the colloidal palladium salt and the action of each step in the process of preparation are introduced in detail. Salt-based colloidal palladium activator CS-22-H works in the low concentration of palladium, copper starting time is short, the backlight level is high, copper deposition thickness is stable, adhesion layer copper is strong, the performance can meet the technical parameters of the printed circuit board. Compared with the acid-based colloidal palladium activator, the invention is environment-friendly, low cost with good application prospect.
This paper introduces the structure of colloidal palladium activator, the principle of activation and the reaction mechanism of the colloidal palladium activator. The function of the main components of the colloidal palladium salt and the action of each step in the process of preparation are introduced in detail. Salt-based colloidal palladium activator CS-22-H works in the low concentration of palladium, copper starting time is short, the backlight level is high, copper deposition thickness is stable, adhesion layer copper is strong, the performance can meet the technical parameters of the printed circuit board. Compared with the acid-based colloidal palladium activator, the invention is environment-friendly, low cost with good application prospect.
引文
[1]金鸿,陈森.印制电路技术[M].北京:化学工业出版社,2003.
[2]龚凡,王滨生.浅谈化学镀前活化工艺的发展[J].应用科技,2002,29(3):59~60.
[3]郑雅杰,龚竹青,陈白珍.印制电路板孔金属化及其工艺改进途径[J].材料导报,2003,17(4):11~13.
[4]张永锋,马玲俊,郭为民等。非金属化学镀的活化工艺[J].材料开发与应用,2004,15(2):30~34.
[5]姜晓霞,沈伟.化学镀理论与实践[M].北京:国防工业出版社.
[6]伍学高.塑料电镀技术[M].成都,四川科学技术出版社,1983.90~205.
[7]刘仁志.非金属电镀[M].沈阳,东北工学院出版社,1989.
[2]龚凡,王滨生.浅谈化学镀前活化工艺的发展[J].应用科技,2002,29(3):59~60.
[3]郑雅杰,龚竹青,陈白珍.印制电路板孔金属化及其工艺改进途径[J].材料导报,2003,17(4):11~13.
[4]张永锋,马玲俊,郭为民等。非金属化学镀的活化工艺[J].材料开发与应用,2004,15(2):30~34.
[5]姜晓霞,沈伟.化学镀理论与实践[M].北京:国防工业出版社.
[6]伍学高.塑料电镀技术[M].成都,四川科学技术出版社,1983.90~205.
[7]刘仁志.非金属电镀[M].沈阳,东北工学院出版社,1989.