机械合金化制备Sn-1.0Ag-0.5Cu高硼中间合金的组织演变
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  • 英文篇名:Microstructure Evolution of High Boron Doped Sn-1.0Ag-0.5Cu Master Alloys Prepared by Mechanical Alloying
  • 作者:王若达 ; 胡强 ; 张少明 ; 张富文 ; 卢彩涛
  • 英文作者:Wang Ruoda;Hu Qiang;Zhang Shaoming;Zhang Fuwen;Lu Caitao;General Research Institute for Nonferrous Metals;Beijing COMPO Advanced Technology Co.,Ltd.;
  • 关键词:机械合金化 ; Sn-1.0Ag-0.5Cu ; 高硼中间合金 ; 过饱和固溶 ; 晶粒细化
  • 英文关键词:mechanical alloying;;Sn-1.0Ag-0.5Cu;;high boron master alloy;;supersaturated solution;;grain refinement
  • 中文刊名:ZXJS
  • 英文刊名:Chinese Journal of Rare Metals
  • 机构:北京有色金属研究总院;北京康普锡威科技有限公司;
  • 出版日期:2018-09-07 06:11
  • 出版单位:稀有金属
  • 年:2019
  • 期:v.43;No.277
  • 基金:国家重点研发计划项目(2017YFB0305700);; 中山市协同创新专项项目(170718211701535)资助
  • 语种:中文;
  • 页:ZXJS201904004
  • 页数:8
  • CN:04
  • ISSN:11-2111/TF
  • 分类号:26-33
摘要
制订了合适的机械合金化方案,利用行星式高能球磨机,制备了一种Sn-1.0Ag-0.5Cu高硼新型中间合金,并以此作为配比微量硼掺杂的Sn-1.0Ag-0.5Cu低银无铅钎料合金的原料。发现随球磨时间的增加,样品颗粒尺寸先增大后减小,与机械合金化"破碎—冷焊—破碎"循环过程相符。结合物相分析与计算,锡的晶格畸变程度不断增加,球磨72 h后达到最大值0.1375%,表明硼在合金基体中的过饱和固溶度逐渐增大。同时晶粒显著细化至纳米晶,并在48 h达到临界值(57.9 nm)。结合电子显微观察与能谱(EDS)分析,合金基体中硼含量呈不断上升的趋势,且分布形态逐渐变得细小而弥散。可见在机械合金化过程中,样品的合金化程度随球磨时间的增加而变高。此外,合金粉体的显微硬度与其球磨过程中晶粒的大小呈负相关关系。以此中间合金制备的钎料合金组织得到了显著细化。
        For proportioning the trace-boron doped Sn-1.0 Ag-0.5 Cu low-silver lead-free solder, a novel high-boron doped Sn-1.0 Ag-0.5 Cu master alloys were prepared by mechanical alloying using the planetary high energy ball mill with the suitable scheme. The results showed with the increase of milling time, the particle size increased first and then decreased, which was consistent with the cycle process of mechanical alloying(crushing—welding—crushing). Combined with the phase analysis and calculation, the lattice distortion of tin increased continuously, peaking at 72 h(0.1375%), indicating the supersaturated solid solubility increased. Meanwhile, the grain refined to nanocrystalline and reached critical value at 48 h(57.9 nm). Through electron microscopy and energy dispersive spectroscope(EDS) analysis, the samples′ alloying degree became higher as the milling time increased. Furthermore, the solidus of alloying powder gradually decreased, and microhardness values were negatively correlated with the grain size. The microstructure of the solder alloys prepared by this master alloys was remarkably refined.
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