空心微球上Al-W多层涂层的制备与表征
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摘要
在惯性约束聚变研究中,高-低Z金属涂层对提高靶丸的性能具有重要的作用。本实验采用直流磁控溅射技术和驱动微球运动的倾斜旋转托盘与敲击装置,在GDP空心微球表面溅射了不同工作气压的Al-W多层涂层,利用扫描电镜(SEM)、原子力显微镜(AFM)、X射线衍射仪(XRD)研究气压变化对多层涂层质量的影响规律。结果表明:多层涂层的厚度均匀性好,达90%以上,涂层均呈致密的柱状晶生长,残余应力小,涂层质量受工作气压影响显著。涂层结构的致密度随气压增大而下降,涂层的形貌与颗粒尺寸发生相应的变化,致使多层涂层的表面粗糙度随气压增大呈现出先减小后增大的变化趋势。当工作气压为0.5Pa时,Al-W涂层的综合性能最好,表面颗粒形貌为细小均匀的塔形,表面粗糙度值低至331.1nm,残余应力小。
In the research of inertial confinement fusion,high-low Z metal coating is vital to the performance of target.Tilt rotating tray and knocking device were applied in this experiment by DC magnetron sputtering technology.The Al-W multilayer coatings with different working pressure were deposited on GDP hollow microspheres.And using scanning electron microscopy,atomic force microscopy and X-ray diffractometer to study the effect of working pressure on the quality of the multilayer coatings.The results show that the uniformity of thickness of the multilayer coating is better which is more than 90%.And the coating has a compact columnar crystal growth model with small residual stress.The working pressure has significant influence on the quality of the coatings.The density of structure decreased with pressure increased.At the same time,the morphology and particle size of the coating changes.All of which has result a similar variation tendency of the surface roughness corresponding to the surface particles.A tendency decreased first and then increased when the working pressure increase.Especially,when the working pressure is 0.5 Pa,the Al-W coating has the best comprehensive performance.Its surface morphology is of small homogeneous pyramid-shape and surface roughness value is as low as 331.1 nm.
In the research of inertial confinement fusion,high-low Z metal coating is vital to the performance of target.Tilt rotating tray and knocking device were applied in this experiment by DC magnetron sputtering technology.The Al-W multilayer coatings with different working pressure were deposited on GDP hollow microspheres.And using scanning electron microscopy,atomic force microscopy and X-ray diffractometer to study the effect of working pressure on the quality of the multilayer coatings.The results show that the uniformity of thickness of the multilayer coating is better which is more than 90%.And the coating has a compact columnar crystal growth model with small residual stress.The working pressure has significant influence on the quality of the coatings.The density of structure decreased with pressure increased.At the same time,the morphology and particle size of the coating changes.All of which has result a similar variation tendency of the surface roughness corresponding to the surface particles.A tendency decreased first and then increased when the working pressure increase.Especially,when the working pressure is 0.5 Pa,the Al-W coating has the best comprehensive performance.Its surface morphology is of small homogeneous pyramid-shape and surface roughness value is as low as 331.1 nm.
引文
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28 Hao M,Liu K,Liu X,et al.Experimental investigation on photoelectric properties of ZAO thin film deposited on flexible substrate by magnetron sputtering[J].Applied Surface Science,2016,388:259.
29 Li D J,Wang M X,Zhang J J,et al.Working pressure induced structural and mechanical properties of nanoscale ZrN/W2N multilayered coatings[J].Journal of Vacuum Science&Technology AVacuum Surfaces&Films,2006,24(4):966.
30 Chang C L,Chiou T H,Chen P H,et al.Characteristics of TiN/W2N multilayers prepared using magnetron sputter deposition with dc and pulsed dc powers[J].Surface and Coatings Technology,2016,303:25.
31 Tse Y Y,Babonneau D,Michel A,et al.Nanometer-scale multilayer coatings combining a soft metallic phase and a hard nitride phase:Study of the interface structure and morphology[J].Surface&Coatings Technology,2004,180(3):470.
32 Chu J P,Lin T N.Deposition,microstructure and properties of sputtered copper films containing insoluble molybdenum[J].Journal of Applied Physics,1999,85(9):6462.
33 Kamiko M,Suenaga R,Koo J W,et al.Effect of seed layers on structure of self-organized Ag nanodots on MgO substrates[J].Japanese Journal of Applied Physics,DOI:10.7567/JJAP.54.06FH06.
34Shen Y G,Mai Y W,Zhang Q C.Residual stress,microstructure,and structure of tungsten thin films deposited by magnetron sputtering[J].Journal of Applied Physics,2000,87(1):177.
2 Müller C M,Sologubenko A S,Gerstl S S A,et al.Nanoscale Cu/Ta multilayer deposition by co-sputtering on a rotating substrate.Empirical model and experiment[J].Surface&Coatings Technology,2016,302:284.
3 Guo H Y,Xia M,Wu Z T,et al.Nanocrystalline-grained tungsten prepared by surface mechanical attrition treatment:Microstructure and mechanical properties[J].Journal of Nuclear Materials,2016,480:281.
4 Huang J,Liu Y,Du K,et al.Microstructure evolution of copperdoped tungsten coatings for inertial confinement fusion application[J].Fusion Science&Technology,2017.71(2):187.
5 Nikroo A,Baugh W,Steinman D A.Fabrication of gas-filled tungsten-coated glass shells[J].Fusion Science&Technology,2003,45(2):202.
6 Jaquez J S,Alfonso E L,Nikroo A,Greenwood A L.Aluminum coatings as a deuterium permeation barrier on foam shells and the dependence on foam surface finish[J].Fusion Science&Technology,2007,51:688.
7 Czechowicz D G,Dorman J A,Geronimo J C,et al.Tungsten sputter coating development to produce high Z shells[J].Fusion Science&Technology,2007,51(4):631.
8 Jankowski A F,Hayes J P,Morse J D.Chambered capsule coatings[J].Thin Solid Films,2001,398(398):587.
9 Xu H W,Alford C S,Cooley J C,et al.Beryllium capsule coating development for NIF targets[J].Fusion Science&Technology,2007,51(4):547.
10Zhang Y,Ma H,Yi M,et al.Magnetron-sputtering fabrication of noble metal nanodots coated TiO2,nanoparticles with enhanced photocatalytic performance[J].Materials&Design,2017,125:94.
11 Chang C L,Chiou T H,Chen P H,et al.Characteristics of TiN/W2N multilayers prepared using magnetron sputter deposition with dc and pulsed dc powers[J].Surface&Coatings Technology,2016,303:25.
12Stueber M,Diechle D,Leiste H,et al.Synthesis of Al-Cr-O-N thin films in corundum and f.c.c.structure by reactive r.f.magnetron sputtering[J].Thin Solid Films,2011,519(12):4025.
13 Emadinia O,Sim7es S,Viana F,et al.Cold rolled versus sputtered Ni/Ti multilayers for reaction-assisted diffusion bonding[J].Welding in the World,2016,60(2):337.
14 Liu G T,Sun Y,Guo Z Z,et al.Structure and properties of magnetron sputtering Cu-Nb and Cu-Mo films[J].Materials Review B:Research Papers.2012,26(3):49(in Chinese).刘国涛,孙勇,郭中正,等.磁控溅射Cu-Nb和Cu-Mo薄膜结构与性能[J].材料导报:研究篇,2012,26(3):49.
15 Xu W,Yu J,Wang X J,et al.Effect of process parameters on properties of ZnO:Al thin films by magnetron sputtering[J].Materials Review,2009,23(s1):387(in Chinese).徐玮,于军,王晓晶,等.磁控溅射中工艺参数对ZnO∶Al薄膜性能的影响[J].材料导报,2009,23(s1):387.
16 Liu M F,Chen S F,Liu Y Y,et al.Characterization of sphericity and wall thickness uniformity of thick walled hollow microspheres[J].High Power Laser and Particle Beams,2014,26(2):153.刘梅芳,陈素芬,刘一杨,等.厚壁空心微球的球形度和壁厚均匀性的表征研究[J].强激光与粒子束,2014,26(2):153.
17Sun H L,Song Z X,Guo D G,et al.Microstructure and mechanical properties of nanocrystalline tungsten thin films[J].Journal of Materials Science&Technology,2010,26(1):87.
18 Karabacak T,Mallikarjunan A,Singh J P,et al.β-phase tungsten nanorod formation by oblique-angle sputter deposition[J].Applied Physics Letters,2003,83(15):3096.
19 Vassallo E,Caniello R,Canetti M,et al.Microstructural characterization of tungsten coatings deposited using plasma sputtering on Si substrates[J].Thin Solid Films,2014,558:189.
20 Hell J,Horkel M,Neubauer E,et al.Construction and characterization of a sputter deposition system for coating granular materials[J].Vacuum,2009,84(4):453.
21Savaloni H,Babaei F,Song S,et al.Influence of substrate rotation speed on the nanostructure of sculptured Cu thin films[J].Vacuum,2011,85(7):776.
22 Wang C,Brault P,Zaepffel C,et al.Deposition and structure of W-Cu multilayer coatings by magnetron sputtering[J].Journal of Physics D:Applied Physics,2003,36(36):2709
23 Yu X,Shen Z,Xu Z.Preparation and characterization of Ag-coated cenospheres by magnetron sputtering method[J].Nuclear Instruments&Methods in Physics Research Section B,2007,265(2):637.
24 Schmid G H S,Eisenmenger-Sittner C.A method for uniformly coating powdery substrates by magnetron sputtering[J].Surface&Coatings Technology,2013,236(2):353.
25 Wang C,Brault P,Zaepffel C,et al.Deposition and structure of W-Cu multilayer coatings by magnetron sputtering[J].Journal of Physics D Applied Physics,2003,36(36):2709.
26 Yang H M,Chen Y F,Xu X Y.Effect of sputtering pressure on the structure and electrical properties of Al2O3thin films[J].Science Technology and Engineering,2010,10(24):5985(in Chinese).杨和梅,陈云福,徐秀英.溅射气压对Al2O3薄膜的结构与电性能的影响[J].科学技术与工程,2010,10(24):5985.
27 Willmott P R.Deposition of complex multielemental thin films[J].Progress in Surface Science,2004,76(6-8):163.
28 Hao M,Liu K,Liu X,et al.Experimental investigation on photoelectric properties of ZAO thin film deposited on flexible substrate by magnetron sputtering[J].Applied Surface Science,2016,388:259.
29 Li D J,Wang M X,Zhang J J,et al.Working pressure induced structural and mechanical properties of nanoscale ZrN/W2N multilayered coatings[J].Journal of Vacuum Science&Technology AVacuum Surfaces&Films,2006,24(4):966.
30 Chang C L,Chiou T H,Chen P H,et al.Characteristics of TiN/W2N multilayers prepared using magnetron sputter deposition with dc and pulsed dc powers[J].Surface and Coatings Technology,2016,303:25.
31 Tse Y Y,Babonneau D,Michel A,et al.Nanometer-scale multilayer coatings combining a soft metallic phase and a hard nitride phase:Study of the interface structure and morphology[J].Surface&Coatings Technology,2004,180(3):470.
32 Chu J P,Lin T N.Deposition,microstructure and properties of sputtered copper films containing insoluble molybdenum[J].Journal of Applied Physics,1999,85(9):6462.
33 Kamiko M,Suenaga R,Koo J W,et al.Effect of seed layers on structure of self-organized Ag nanodots on MgO substrates[J].Japanese Journal of Applied Physics,DOI:10.7567/JJAP.54.06FH06.
34Shen Y G,Mai Y W,Zhang Q C.Residual stress,microstructure,and structure of tungsten thin films deposited by magnetron sputtering[J].Journal of Applied Physics,2000,87(1):177.