一种具有低振动灵敏度和宽动态范围的MEMS陀螺仪(英文)
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摘要
为了进一步提高MEMS陀螺的动态范围和振动环境适应性,以加速其工程化应用步伐,研究了陀螺振动误差,提出了一种新型MEMS陀螺结构。MEMS陀螺仍然采用了音叉结构形式,同时采用了工字型框架和隔离结构,从而提高了陀螺结构的稳定性和抗振动性能,并降低了残余应力对陀螺影响。理论分析了驱动和检测模态频差对标度因数非线性的影响,并基于理论和实验分析了振动环境中的角振动对陀螺性能的影响。在此基础上,进行了陀螺的模态优化设计,以进一步减小了陀螺的振动灵敏度,并使其具有大动态范围。MEMS陀螺采用了SOI圆片制备,并采用了圆片级真空封装技术实现陀螺芯片的真空封装。MEMS陀螺芯片和ASIC芯片叠装在陶瓷管壳内,体积为11.4?11.4?3.8 mm3。实验结果表明,MEMS陀螺的测量范围为±7200 (°)/s,零偏稳定性为12.2 (°)/h(1σ)。随机振动环境下(7.6grms),该陀螺的振中零偏变化量小于10.0 (°)/h,振中的零偏稳定性小于24.0 (°)/h,是原陀螺的1/5。
To improve the dynamic range and vibration environment adaptability of MEMS gyroscope and accelerate its engineering application, the vibration induced errors are studied, and a new MEMS gyro structure is proposed. The MEMS gyro adopts TFG structure and has I-shaped frame and isolation structures,which improves the structural stability and vibration immunity, and decreases the effect of the residual stress on the gyro. The effect of the frequency difference between the drive mode and the sense mode on scale factor nonlinearity is analyzed theoretically, and the effect of angular vibration in vibration environment on gyro performance is theoretically and experimentally analyzed. The gyro modes are optimized to further reduce its vibration sensitivity and broaden its dynamic range. The MEMS gyro is fabricated on a SOI wafer and packaged with wafer-level vacuum packaging. The MEMS gyro die and ASIC die are stacked in the ceramic package, and the volume is 11.4×11.4×3.8 mm~3. The MEMS gyro's full scale is ±7200(°)/s with the bias repeatability of 15.7(°)/h(1σ). The bias change in vibration environment is less than 10.0(°)/h, and the bias stability is below 24.0(°)/h under random vibration(7.6 grms), which is about 1/5 of the original MEMS gyro's bias stability.
To improve the dynamic range and vibration environment adaptability of MEMS gyroscope and accelerate its engineering application, the vibration induced errors are studied, and a new MEMS gyro structure is proposed. The MEMS gyro adopts TFG structure and has I-shaped frame and isolation structures,which improves the structural stability and vibration immunity, and decreases the effect of the residual stress on the gyro. The effect of the frequency difference between the drive mode and the sense mode on scale factor nonlinearity is analyzed theoretically, and the effect of angular vibration in vibration environment on gyro performance is theoretically and experimentally analyzed. The gyro modes are optimized to further reduce its vibration sensitivity and broaden its dynamic range. The MEMS gyro is fabricated on a SOI wafer and packaged with wafer-level vacuum packaging. The MEMS gyro die and ASIC die are stacked in the ceramic package, and the volume is 11.4×11.4×3.8 mm~3. The MEMS gyro's full scale is ±7200(°)/s with the bias repeatability of 15.7(°)/h(1σ). The bias change in vibration environment is less than 10.0(°)/h, and the bias stability is below 24.0(°)/h under random vibration(7.6 grms), which is about 1/5 of the original MEMS gyro's bias stability.
引文
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[13]Qiu A,Su Y,Shi Q,et al.Development of MEMS inertial sensors in NUST[C]//The 5th International Workshop on Computer Science and Engineering.Moscow,Russia,2015:224-230.
[2]Prikhodko I P,Sachin N,Gregory J A,et al.Half-a-month stable 0.2 degree-per-hour mode-matched MEMS gyroscope[C]//International Symposium on Inertial Sensors and Systems.Hawaii,USA,2017:15-18.
[3]Zhou B,Zhang T,Yin P,et al.Innovation of flat gyro:center support quadruple mass gyroscope[C]//International Symposium on Inertial Sensors and Systems.California,USA,2016:42-45.
[4]Zhao Y,Zhao J,Xia G,et al.A 0.5?/h bias instability0.067°/√h angle random walk MEMS gyroscope with CMOS readout circuit[C]//IEEE Asian Solid-state Circuits Conference.Xia’men,China,2015.
[5]Weinberg H.Gyro mechanical performance:the most important parameter[R].Technical article MS-2158.Analog Devices,Inc.,2011:1-5.
[6]Sang W Y,Lee S,Nazafi K.Vibration-induced errors in MEMS tuning fork gyroscopes[J].Sensors and Actuators a Physical,2012,180(6):32-44.
[7]Weinberg M S.How to invent(or not invent)the first silicon MEMS gyroscope[C]//IEEE Inertial and Systems Symposium.Hawaii,USA,2015:53-57.
[8]Wu G,Chua G,Navab S.A quadruple mass vibrating MEMS gyroscope with symmetric design[J].IEEE Sensors Letters,2018,2(4):2501404.
[9]Analog Devices Inc..High stability,low noise vibration rejecting yaw rate gyroscope.[2019-01-18].http://www.analog com/media/en/technical-documentation/data-sheets/ADXRS646.pdf
[10]Brenton R S,Sanbuddha K,Trusov A A,et al.Mode ordering in tuning fork structures with negative structural coupling for mitigation of common-mode g sensitivity[C]//IEEE Sensors.Busan,Korea,2015:626-629.
[11]Gao Y,Li H,Huang L,et al.A lever coupling mechanism in dual-mass micro-gyroscopes for improving the shock resistance along the driving direction[J].Sensors,2017,17(5):995-1014.
[12]Shi Q,Qiu A,Xia G,et al.Tactical grade MEMS gyro with low acceleration sensitivity[C]//IEEE Sensors.Busan,Korea,2015:630-633.
[13]Qiu A,Su Y,Shi Q,et al.Development of MEMS inertial sensors in NUST[C]//The 5th International Workshop on Computer Science and Engineering.Moscow,Russia,2015:224-230.