铜铝层状复合材料的研究进展
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摘要
介绍了铜铝层状复合材料的固-液复合法铸轧工艺特点,并从原子扩散和反应扩散两方面客观地分析了铸轧复合的界面结合机理。阐述了铜铝层状复合材料过渡层中金属间化合物的形成规律和铝基体化学成分变化对界面扩散的影响,从分子动力学模型和耦合模型的角度,综述了数值模拟技术在铜铝层状复合材料研究中的发展现状,提出其发展趋势。
The characteristics of cast/rolling process for copper aluminum laminar composites are introduced in this paper The interfacial bonding mechanism in the process is analyzed from two aspects of atom diffusion and reaction diffusion.The formation regularity of intermetallic compounds in transition layer of copper-aluminium laminated composites and the influence of chemical composition of aluminium matrix on interfacial diffusion are elaborated.Based on both molecular dynamics model and coupling model,the current development of numerical simulation technology in the copper aluminum laminar composite material is also summarized.The developing trends of the technology and the materials are prospected.
The characteristics of cast/rolling process for copper aluminum laminar composites are introduced in this paper The interfacial bonding mechanism in the process is analyzed from two aspects of atom diffusion and reaction diffusion.The formation regularity of intermetallic compounds in transition layer of copper-aluminium laminated composites and the influence of chemical composition of aluminium matrix on interfacial diffusion are elaborated.Based on both molecular dynamics model and coupling model,the current development of numerical simulation technology in the copper aluminum laminar composite material is also summarized.The developing trends of the technology and the materials are prospected.
引文
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[24]郭亚杰,刘桂武,金海云,等.Cu和Al箔扩散结合界面相生长行为研究[J].稀有金属材料与工程,2012,41(2):281~284.
[25]王超.双辊铸轧结晶辊传热规律研究及其结构优化[D].秦皇岛:燕山大学,2014.
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[30] Kim H J,Lee J Y,Paik K W,et al.Effects of Cu/Al Intermetallic Compound(IMC)on Copper Wire and Aluminum Pad Bondability[J].Components&Packaging Technologies IEEE Transactions on,2003,26(2):367~374.
[31] Pintore M,Starykov O,Mittler T, et al.Experimental Investigations on the Influence of the Thermal Conditions During Composite Casting on the Microstructure of Cu-Al Bilayer Compounds[J].International Journal of Metalcasting,2017:1~10.
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[33] Lee T H,Sim M S,Joo S H,et al.Effect of Intermetallic Compound Thickness on Anisotropy of Al/Cu Honeycomb Rods Fabricated by Hydrostatic Extrusion Process[J].Transactions of Nonferrous Metals Society of China,2016,26(2):456~463.
[34] Zhang J,Wang B H,Chen G H,et al.Formation and Growth of Cu-Al IMCs and Their Effect on Electrical Property of Electroplated Cu/Al Laminar Composites[J].Transactions of Nonferrous Metals Society of China,2016,26(12):3283~3291.
[35]赵佳蕾.浸镀Ni层结构特征及其对Al/Cu复层材料界面的影响[D].大连:大连理工大学,2014.
[36]黄增阳.铜/铝/铜复合箔的制备及其界面行为[D].沈阳:东北大学,2013.
[37] Yuan H U,Chen Y Q,Li L I,et al.Microstructure and Properties of Al/Cu Bimetal in Liquid-solid Compound Casting Process[J].Transactions of Nonferrous Metals Society of China,2016,26(6):1555~1563.
[38]张红安,陈刚.铜/铝复合材料的固-液复合法制备及其界面结合机理[J].中国有色金属学报,2008,18(3):414~420.
[39] Tang Y,Zhang L,Yang H,et al.Numerical Simulation of Thermal Properties at Cu/Al Interfaces Based on Hybrid Model[J].Engineering Computations,2015,32(3):574~584.
[40]顾骑峰.双金属轧制的分子动力学模拟[D].秦皇岛:燕山大学,2010.
[41] Geysermans P,Gorse D,Pontikis V.Molecular Dynamics Study of the Solid-liquid Interface[J].Molecular Physics,2005,113(20):6382~6389.
[42]李昶.Al-Cu体系扩散过程的分子动力学研究[D].南宁:广西大学,2014.
[43] Chen S,Ke F,Min Z,et al.Atomistic Investigation of the Effects of Temperature and Surface Roughness on Diffusion Bonding between Cu and Al[J].Acta Materialia,2007,55(9):3169~3175.
[44]珠梅,赫冀成,徐广.双辊连续铸轧工艺中流场、温度场和热应力场的数值计算[J].金属学报,2000,36(4):391~394.
[45]黄华贵,季策,董伊康,等.Cu/Al复合带固-液铸轧热-流耦合数值模拟及界面复合机理[J].中国有色金属学报,2016,26(3):623~629.
[46]叶丽芬.Cu/Al复合板单机双流铸轧复合界面多尺度模拟与实验研究[D].秦皇岛:燕山大学,2015.
[47]陶辉锦,彭坤,谢佑卿,等.Ti-Al金属间化合物脆性问题的研究进展[J].粉末冶金材料科学与工程,2007,12(6):330~336.
[2]刘腾,刘平,王渠东.铜铝双金属复合材料的研究进展[J].材料导报,2013,27(19):1~5.
[3] Pintore M, Starykov O, Mittler T,et al.Experimental Investigations on the Influence of the Thermal Conditions During Composite Casting on the Microstructure of Cu-Al Bilayer Compounds[J].International Journal of Metalcasting,2018,12(1):1~10.
[4]夏兆辉,姚辉,孙谊媊,等.铜铝复合材料在电力电气行业的研究和应用[J].热加工工艺,2016,22:24~28.
[5] Kim W N,Sun I H.Interactive Deformation and Enhanced Ductility of Tri-layered Cu/Al/Cu Clad Composite[J].Materials Science&Engineering A,2016,651:976~986.
[6]祖国胤.层状金属复合材料制备理论与技术[M].第1版.沈阳:东北大学出版社,2013:15~53.
[7]马立峰,庞志宁,马自勇,等.AZ31B宽幅镁合金铸轧板材热轧边裂原因分析[J].材料科学与工程学报,2014,32(5):665~671.
[8]陈燕俊,孟亮,周世平,等.不同温度下Ag/Cu复合界面的扩散处理[J].材料科学与工程学报,2001,19(1):56~59.
[9]王泽宇,龚潇雨,苗龙,李宝棉.铜铝异步轧制复合压下率对其组织性能的影响[J].材料科学与工程学报,2015,33(3):455~459.
[10]孙德勤,吴春京,谢建新.双结晶器连铸工艺制备层状双金属复合材料的界面结合原理分析[J].热加工工艺,2005,2:4~6.
[11]谢建新,吴春京,李静媛.多层复合材料一次铸造成形设备与工艺[P].中国专刊:CN1229703,1999-09-29.
[12] Stolbchenko M,Grydin O,Samsonenko A,et al.Numerical Analysis of the Twin-roll Easting of thin Aluminium-steel Clad Strips[J].Forschung Im Ingenieurwesen,2014,78(3):1~10.
[13]黄华贵,季策,董伊康,杜凤山.双金属复合管固-液铸轧复合工艺环形布流器设计及其流场模拟[J].复合材料学报,2016,10:2246~2252.
[14]高志.材料[液—固]流变界面传热机理与高梯度温变成型界面的建立[D].长沙:中献学,2001.
[15]谢水生,刘相华.有色金属材料的控制加工[M].第1版.天津:中南大学出版社,2013:233~235.
[16] Romanowski C A.Method for Twin Roll Casting of Aluminum Clad Magnesium[P].美国专刊.US8122940B2,2012-02-28.
[17]牛永胜,司云森,竺培显,等.低压铸造-轧制法快速制备Al-Cu复合材料[J].材料导报,2016,30(22):104~108.
[18]秋海滨,张明,张军亮.固-液相金属铸轧复合方法研究[J].世界有色金属,2016,10:15~19.
[19]黄华贵,刘文文,叶丽芬,等.Cu/Al双辊异温铸轧复合界面局部熔合机理[J].哈尔滨工程大学学报,2016,37(3):432~437.
[20] Grabowski S,Entel P.Elementary Diffusion Processes in AlCu-Zn Alloys:AN AB Initio Study[J].Journal of Chemical Thermodynamics,2015,30(9):1047~1048.
[21]谢佑卿,刘心笔.金属Al的电子结构和物理性质[J].中国科学:技术科学,1999,29(5):391~395.
[22]谢佑卿,张晓东.金属Cu的电子结构和物理性质[J].中国科学:数学,1993,36(5):545~551.
[23]李慧,龙萍,牛永胜,等.Al/Cu复合材料制备中理论与工艺研究进展[J].材料导报,2016,30(7):148~153.
[24]郭亚杰,刘桂武,金海云,等.Cu和Al箔扩散结合界面相生长行为研究[J].稀有金属材料与工程,2012,41(2):281~284.
[25]王超.双辊铸轧结晶辊传热规律研究及其结构优化[D].秦皇岛:燕山大学,2014.
[26] Li C,Li D,Tao X,et al.Molecular Dynamics Simulation of Diffusion Bonding of Al-Cu Interface[J].Calphad-computer Coupling of Phase Diagrams&Thermochemistry,2015,51(6):396~397.
[27]于庆波,刘相华,孙莹,等.室温轧制Cu/Al多层复合薄带的变形诱导反应扩散现象[J].中国科学:技术科学,2016,46(11):1166~1174.
[28]崔忠圻,刘北兴.金属学与热处理原理[M].第2版.北京:机械工业出版社,1998:60~69.
[29]郭青蔚,王桂生,郭庚辰.常用有色金属二元合金相图集[M].第1版.北京:化学工业出版社,2009:48~49.
[30] Kim H J,Lee J Y,Paik K W,et al.Effects of Cu/Al Intermetallic Compound(IMC)on Copper Wire and Aluminum Pad Bondability[J].Components&Packaging Technologies IEEE Transactions on,2003,26(2):367~374.
[31] Pintore M,Starykov O,Mittler T, et al.Experimental Investigations on the Influence of the Thermal Conditions During Composite Casting on the Microstructure of Cu-Al Bilayer Compounds[J].International Journal of Metalcasting,2017:1~10.
[32] Chen S Y,Chang G W,Yue X D,et al.Solidification Process and Microstructure of Transition Layer of Cu-Al Composite Cast Prepared by Method of Pouring Molten Aluminum[J].Transactions of Nonferrous Metals Society of China,2016,26(8):2247~2256.
[33] Lee T H,Sim M S,Joo S H,et al.Effect of Intermetallic Compound Thickness on Anisotropy of Al/Cu Honeycomb Rods Fabricated by Hydrostatic Extrusion Process[J].Transactions of Nonferrous Metals Society of China,2016,26(2):456~463.
[34] Zhang J,Wang B H,Chen G H,et al.Formation and Growth of Cu-Al IMCs and Their Effect on Electrical Property of Electroplated Cu/Al Laminar Composites[J].Transactions of Nonferrous Metals Society of China,2016,26(12):3283~3291.
[35]赵佳蕾.浸镀Ni层结构特征及其对Al/Cu复层材料界面的影响[D].大连:大连理工大学,2014.
[36]黄增阳.铜/铝/铜复合箔的制备及其界面行为[D].沈阳:东北大学,2013.
[37] Yuan H U,Chen Y Q,Li L I,et al.Microstructure and Properties of Al/Cu Bimetal in Liquid-solid Compound Casting Process[J].Transactions of Nonferrous Metals Society of China,2016,26(6):1555~1563.
[38]张红安,陈刚.铜/铝复合材料的固-液复合法制备及其界面结合机理[J].中国有色金属学报,2008,18(3):414~420.
[39] Tang Y,Zhang L,Yang H,et al.Numerical Simulation of Thermal Properties at Cu/Al Interfaces Based on Hybrid Model[J].Engineering Computations,2015,32(3):574~584.
[40]顾骑峰.双金属轧制的分子动力学模拟[D].秦皇岛:燕山大学,2010.
[41] Geysermans P,Gorse D,Pontikis V.Molecular Dynamics Study of the Solid-liquid Interface[J].Molecular Physics,2005,113(20):6382~6389.
[42]李昶.Al-Cu体系扩散过程的分子动力学研究[D].南宁:广西大学,2014.
[43] Chen S,Ke F,Min Z,et al.Atomistic Investigation of the Effects of Temperature and Surface Roughness on Diffusion Bonding between Cu and Al[J].Acta Materialia,2007,55(9):3169~3175.
[44]珠梅,赫冀成,徐广.双辊连续铸轧工艺中流场、温度场和热应力场的数值计算[J].金属学报,2000,36(4):391~394.
[45]黄华贵,季策,董伊康,等.Cu/Al复合带固-液铸轧热-流耦合数值模拟及界面复合机理[J].中国有色金属学报,2016,26(3):623~629.
[46]叶丽芬.Cu/Al复合板单机双流铸轧复合界面多尺度模拟与实验研究[D].秦皇岛:燕山大学,2015.
[47]陶辉锦,彭坤,谢佑卿,等.Ti-Al金属间化合物脆性问题的研究进展[J].粉末冶金材料科学与工程,2007,12(6):330~336.