板级波导光互联技术研究现状及发展趋势
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摘要
光互联技术相对于传统的电互联技术具有高速、高带宽、低功耗、低损耗和抗电磁干扰等优势,在高性能计算机、高速交换系统及波分复用(WDM)终端等方向都具有巨大的应用前景。板级电路在电子系统中占据主导地位,就国内外板级波导光互联技术研究现状进行了阐述与分析,并对光电印制电路板(EOPCB)国内外发展水平进行了对比,为我国在该技术领域未来的主要研究方向及重点提供参考。最后对板级光电互联技术的发展趋势进行了展望。
Compared to the conventional electrical interconnects,the optical interconnects has the advantages of higher speed,higher bandwidth,lower power,lower propagation loss and anti-electromagnetic interference. This make the optical interconnects have the potential application prospects in many fields,such as high performance computer,high speed switching system,wavelength division multiplex( WDM) terminal and so on. The board-level circuits play a leading role in the electronic systems. Hence,the state of the art of waveguide-based board-level optical interconnects is introduced and analyzed. Moreover,through comparing the development status of the optical-electrical printed circuit board( EOPCB) in domestic and abroad,a reference of the main research direction and focus is provided for our country. Finally,the future development of the board-level optical interconnect technology is prospected.
Compared to the conventional electrical interconnects,the optical interconnects has the advantages of higher speed,higher bandwidth,lower power,lower propagation loss and anti-electromagnetic interference. This make the optical interconnects have the potential application prospects in many fields,such as high performance computer,high speed switching system,wavelength division multiplex( WDM) terminal and so on. The board-level circuits play a leading role in the electronic systems. Hence,the state of the art of waveguide-based board-level optical interconnects is introduced and analyzed. Moreover,through comparing the development status of the optical-electrical printed circuit board( EOPCB) in domestic and abroad,a reference of the main research direction and focus is provided for our country. Finally,the future development of the board-level optical interconnect technology is prospected.
引文
1 Yu Zhihua.Design and realization of waveguide-based chip-to-chip optical interconnection network[D].Wuhan:Huazhong University of Science and Technology,2010:1-8.余志华.基于光波导的芯片间光互联网络的设计与实现[D].武汉:华中科技大学,2010:1-8.
2 Shao Kejie.Study and design of board level optical interconnect links[D].Mianyang:Chinese Academy of Engineering Physics,2009:2-13.邵科杰.板级光互连链路设计研究[D].绵阳:中国工程物理研究院,2009:2-13.
3 Weng Shousong.The low-k dielectric and its equipment[J].Equipment for Electronic Products Manufacturing,2008,160:28-30.翁寿松.低k电介质及其设备[J].电子工业专用设备,2008,160:28-30.
4 Mai K,Paaske T,Jayasena N,et al..Smart Memories:A modular reconfigurable architecture[C].27th Int Symp Computer Arehitecture,2000:161-171.
5 H B Bakoglu.Circuits,interconnections,and packaging for VLSI reading[M].New Jersey:Addison-Wesley,1990:143-152.
6 R Ho,K Mai,M Horowitz.Efficienton-chip global interconnects[C].VLSI Circuits,2003:271-274.
7 Zhang Yimo.Optics inter-connected network techniques[M].Beijing:Electronics Industry Press,2006:4-5.张以谟.光互联网络技术[M].北京:电子工业出版社,2006:4-5.
8 陈益新.集成光学三十年[M].上海:上海交通大学出版社,1999:216-220.
9 J W Goodman,F J Leonberger,S Y Kung,et al..Optical interconnections for VLSI systems[J].Proc of the IEEE,1984,72(7):850-866.
10 D Agarwal.Optical interconnects to silicon chips using short pulses[D].Stanford:USA Stanford University,2002:9-15.
11 M Karppinen.High bit-rate optical interconnects on printed wiring board[D].Oulu:Oulu University,2008:16-20.
12 G M Jiang,S Baig,M R Wang.Tunable Optofluidic couplers for dynamic card-to-backplane optical interconnect[J].Journal of Lightwave Technology,2013,31(24):4135-4141.
13 R Pitwon,L Brusberg,H Schrder,et al..Pluggable electro-optical circuit board interconnect based on embedded graded-index planar glass waveguides[J].Journal of Lightwave Technology,2015,33(4):741-754.
14 M Immonen,J Wu,H J Yan,et al..Electro-optical backplane demonstrator with multimode polymer waveguides for board-toboard interconnects[C].IEEE Electronics System-Integration Technology Conference,2014:1-6.
15 Jia Nana,Deng Chuanlu,Pang Fufei,et al..Research on excimer laser etching technology for achieving optical waveguide end face[J].Chinese J Lasers,2015,42(3):0303012.贾娜娜,邓传鲁,庞拂飞,等.光波导端面的准分子激光刻蚀技术研究[J].中国激光,2015,42(3):0303012.
16 Shen Pokun,Chen Chinta,Chen Rueihung,et al..Chip-level optical interconnects using polymer waveguide integrated with laser/PD on silicon[J].IEEE Photonics Technology Letters,2015,27(13):1359-1362.
17 Cui Rong,Yang Xiaohong,LüQianqian,et al..InG aA s/InP photodetector on SOI circuitry[J].Laser&Optoelectronics Progress,2014,51(11):110003.崔荣,杨晓红,吕倩倩,等.SOI波导与InG aA s/InP光电探测器的集成[J].激光与光电子学进展,2014,51(11):110003.
18 Chen Qiaoshan,Yang Lin.Optical routers for photonic networks-on-chip[J].Laser&Optoelectronics Progress,2014,51(11):110005.陈乔杉,杨林.用于片上光网络的光学路由器研究[J].激光与光电子学进展,2014,51(11):110005.
19 M Yun,S Cho,S K Kang,et al..Ge-on-Si photodetector with novel metallization schemes for on-chip optical interconnect[C].IEEE International Symposium on Consumer Electronics,2015:1-2.
20 T Sato,K Takeda,A Shinya,et al..Photonic crystal lasers for chip-to-chip and on-chip optical interconnects[J].IEEE Journal of Selected Topics in Quantum Electronics,2015,21(6):728-737.
21 B Ciftcioglu,J Gao,R Berman,et al..Recent progress on 3-D integrated intra-chip free-space optical interconnect[C].IEEE Optical Interconnects Conference,2012:56-57.
22 S Tang,R T Chen,L Garrett,et al..Design limitations of highly parallel free-space optical interconnects based on arrays of vertical cavity surface-emitting laser diodes,microlenses,and photodetectors[J].Journal of Lightwave Technology,1994,12(11):1971-1975.
23 D V Plant,M B Venditti,E Laprise,et al..256-channel bidirectional optical interconnect using VCSELs and photodiodes on CMOS[J].Journal of Lightwave Technology,2001,19(8):1093-1103.
24 B Dhoedt,P D Dobbelaere,J Blondelle,et al..Monolithic integration of diffractive lenses with LED-arrays for board-to-board free space optical interconnect[J].Journal of Lightwave Technology,1995,13(6):1065-1073.
25 D J Goodwill,K E Devenport,H S Hinton.An ATM-based intelligent optical backplane using CMOS-SEED smart pixel arrays and free-space optical interconnect modules[J].IEEE Journal of Selected Optics in Quantum Electronics,1996,2(1):85-96.
26 M Vervaeke,C Debaes,B Volckaerts,et al..Optomechanical Monte Carlo tolerancing study of a packaged free-space intra-MCM optical interconnect system[J].IEEE Journal of Selected Topics in Quantum Electronics,2006,12(5):988-996.
27 K Wang,A Nirmalathas,C Lim,et al..High-speed reconfigurable free-space card-to-card optical interconnects[J].IEEE Photonics Journal,2012,4(5):1407-1419.
28 M Schneider,T Kühner,J Mohr,et al..Fibers in printed circuit boards with passively aligned coupling[J].Journal of Lightwave Technology,2010,28(15):2121-2128.
29 S Kopetz,E Rabe,W J Kang,et al..Polysiloxane optical waveguide layer integrated in printed circuit board[J].Electronics Letters,2004,40(11):668-669.
30 Y Ishii,S Koike,Y Arai,et al..SMT-compatible large-tolerance"optobump"interface for interchip optical interconnections[J].IEEE Transactions on Advanced Packaging,2003,26(2):122-127.
31 Y Ishii,S Koike,Y Arai,et al..SMT-compatible optical-I/O chip packaging for chip-level optical interconnects[C].IEEE Electronic Components and Technology Conference,2001:870-875.
32 Y Ishii,N Tanaka,T Sakamoto,et al..Fully SMT-compatible optical-I/O package with microlens array interface[J].Journal of Lightwave Technology,2003,21(1):275-280.
33 S Hiramatsu,T Mikawa.Optical design of active interposer for high-speed chip level optical interconnects[J].Journal of Lightwave Technology,2006,24(2):927-934.
34 M H Cho,H S Cho,S H Hwang,et al..Optical interconnection schemes using micro-optic connectors for passive packaging in optical PCBs[C].IEEE Electronic Components and Technology Conference,2005:1830-1834.
35 M H Cho,S H Hwang,H S Cho,et al..High-coupling-efficiency optical interconnection using a 90°-bent fiber array connector in optical printed circuit boards[J].IEEE Photonics Technology Letters,2005,17(3):690-692.
36 K Nieweglowski,K J Wolter.Optical analysis of short-distance optical interconnect on the PCB-level[C].Electronics System Integration Technology Conference,2006:392-397.
37 K Nieweglowski,K J Wolter.Novel optical transmitter and receiver for parallel optical interconnects on PCB-level[C].2nd Electronics System-Integration Technology Conference,2008:607-611.
38 K Nieweglowski,R Rieske,K J Wolter.Assembly requirements for multi-channel coupling micro-optics in board-level optical interconnect[C].3nd Electronics System-Integration Technology Conference,2010:1-6.
39 G L Bona,B J Offrein,U Bapst,et al..Characterization of parallel optical-interconnect waveguides integrated on a printed circuit board[C].SPIE,2004,5453:134-141.
40 A F Benner,M.Ignatowski,J A Kash,et al..Exploitation of optical interconnects in future server architectures[J].IBM Journal of Research and Development,2005,49(4.5):755-775.
41 L Schares,J A Kash,F E Doany,et al..Terabus:Terabit/second-class card-level optical interconnect technologies[J].IEEE Journal of Selected Topics in Quantum Electronics,2006,12(5):1032-1044.
42 J A Kash,F E Doany,L Schares,et al..Chip-to-chip optical interconnects[C].Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference,2006:OFA3.
43 O Liboiron-Ladouceur,C L Schow,P K Pepeljugoski,et al..A 17 Gb/s,200-meter multimode optical fiber link using CMOS analog ICs and silicon carrier packaging[C].19th Annual Meeting of the IEEE Lasers and Electro-Optics Society,2006:573-574.
44 F E Doany,C L Schow,C K Tsang,et al..300-Gb/s 24-channel bidirectional Si carrier transceiver optochip for board-level interconnects[C].Electronic Components and Technology Conference,2008:238-243.
45 F E Doany,C L Schow,J A Kash,et al..Waveguide-coupled parallel optical transceiver technology for Tb/s-class chip-to-chip data transmission[C].SPIE,2008,6899:68990V.
46 F E Doany,C L Schow,C W Baks,et al..160 Gb/s bidirectional polymer-waveguide board-level optical interconnects using CMOS-based transceivers[J].IEEE Transactions on Advanced Packaging,2009,32(2):345-359.
47 F E Doany,B G Lee,C L Schow,et al..Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects[C].Electronic Components and Technology Conference,2010:58-65.
48 A V Rylyakov,C L Schow,J E Proesel,et al..A 40-Gb/s,850-nm,VCSEL-based full optical link[C].Optical Fiber Communication Conference&Exposition,2012,27(6):1-3.
49 M Karppinen,T Alajoki,A Tanskanen,et al..Parallel optical interconnect between ceramic BGA packages on FR4 board using embedded waveguides and passive optical alignments[C].Electronic Components and Technology Conference,2006:799-805.
50 L Brusberg,H Schrder,R Erxleben,et al..Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling[C].Electronic Components and Technology Conference,2010:269-274.
51 H Schrder,L Brusberg,N Arndt-Staufenbiel,et al..Advanced thin glass based photonic PCB integration[C].Electronic Components and Technology Conference,2012:194-202.
52 L Brusberg,D Manessis,M Neitz,et al..Development of an electro-optical circuit board technology with embedded single-mode glass waveguide layer[C].Electronics System-Integration Conference,2014:1-5.
53 A L Glebov,M G Lee.3D routing on optical boards[C].19th Annual Meeting of the IEEE Lasers and Electro-Optics Society,2006:22-23.
54 A L Glebov,M G Lee,S Aoki,et al..Integrated waveguide micro-optic elements for 3D routing in board-level optical interconnect[C].SPIE,2006,6126:61260N.
55 Fu Kai.Research of optical interconnection waveguides for EOPCB[D].Wuhan:Huazhong University of Science and Technology,2005:45-52.付凯.光电混合印制电路板(EOPCB)光互连波导研究[D].武汉:华中科技大学,2005:45-52.
56 Zhang Jin.Optical coupling in electrical-optical printed-circuit board[D].Wuhan:Huazhong University of Science and Technology,2008:40-55.张瑾.基于EOPCB光互连板的光耦合研究[D].武汉:华中科技大学,2008:40-55.
57 Feng Xianghua.Study on the elements for optical interconnection[D].Changsha:National University of Defense Technology,2012:52-68.冯向华.用于光互连的单元器件研究[D].长沙:国防科学技术大学,2012:52-68.
58 Feng Xianghua,Ji Jiarong,Dou Wenhua.Fabrication of modified polydimethylsiloxane and multimode optical waveguides[J].Acta Optica Sinica,2012,32(5):0531003.冯向华,季家镕,窦文华.聚硅氧烷改性及多模光波导制备[J].光学学报,2012,32(5):0531003.
59 Feng Xianghua,Ji Jiarong,Dou Wenhua.Bending loss of polysiloxane optical waveguides for optical interconnection[J].Acta Optica Sinica,2012,32(8):0823003.冯向华,季家镕,窦文华.用于光互连的聚硅氧烷波导弯曲损耗[J].光学学报,2012,32(8):0823003.
60 Ni Wei.Research on soft lithography based short range optical interconnection[D].Hangzhou:Zhejiang University,2009:39-91.倪玮.基于软光刻的短距离光互联研究[D].杭州:浙江大学,2009:39-91.
61 Wu Jinhua,M Immonen,Yan Huijuan,et al..Application of multimode polymer waveguide in optical-electrical printed circuit board[J].Electronics Process Technology,2015,36(5):291-294.吴金华,M Immonen,严慧娟,等.多模聚合物波导在光电印制板中的应用[J].电子工艺技术,2015,36(5):291-294.
2 Shao Kejie.Study and design of board level optical interconnect links[D].Mianyang:Chinese Academy of Engineering Physics,2009:2-13.邵科杰.板级光互连链路设计研究[D].绵阳:中国工程物理研究院,2009:2-13.
3 Weng Shousong.The low-k dielectric and its equipment[J].Equipment for Electronic Products Manufacturing,2008,160:28-30.翁寿松.低k电介质及其设备[J].电子工业专用设备,2008,160:28-30.
4 Mai K,Paaske T,Jayasena N,et al..Smart Memories:A modular reconfigurable architecture[C].27th Int Symp Computer Arehitecture,2000:161-171.
5 H B Bakoglu.Circuits,interconnections,and packaging for VLSI reading[M].New Jersey:Addison-Wesley,1990:143-152.
6 R Ho,K Mai,M Horowitz.Efficienton-chip global interconnects[C].VLSI Circuits,2003:271-274.
7 Zhang Yimo.Optics inter-connected network techniques[M].Beijing:Electronics Industry Press,2006:4-5.张以谟.光互联网络技术[M].北京:电子工业出版社,2006:4-5.
8 陈益新.集成光学三十年[M].上海:上海交通大学出版社,1999:216-220.
9 J W Goodman,F J Leonberger,S Y Kung,et al..Optical interconnections for VLSI systems[J].Proc of the IEEE,1984,72(7):850-866.
10 D Agarwal.Optical interconnects to silicon chips using short pulses[D].Stanford:USA Stanford University,2002:9-15.
11 M Karppinen.High bit-rate optical interconnects on printed wiring board[D].Oulu:Oulu University,2008:16-20.
12 G M Jiang,S Baig,M R Wang.Tunable Optofluidic couplers for dynamic card-to-backplane optical interconnect[J].Journal of Lightwave Technology,2013,31(24):4135-4141.
13 R Pitwon,L Brusberg,H Schrder,et al..Pluggable electro-optical circuit board interconnect based on embedded graded-index planar glass waveguides[J].Journal of Lightwave Technology,2015,33(4):741-754.
14 M Immonen,J Wu,H J Yan,et al..Electro-optical backplane demonstrator with multimode polymer waveguides for board-toboard interconnects[C].IEEE Electronics System-Integration Technology Conference,2014:1-6.
15 Jia Nana,Deng Chuanlu,Pang Fufei,et al..Research on excimer laser etching technology for achieving optical waveguide end face[J].Chinese J Lasers,2015,42(3):0303012.贾娜娜,邓传鲁,庞拂飞,等.光波导端面的准分子激光刻蚀技术研究[J].中国激光,2015,42(3):0303012.
16 Shen Pokun,Chen Chinta,Chen Rueihung,et al..Chip-level optical interconnects using polymer waveguide integrated with laser/PD on silicon[J].IEEE Photonics Technology Letters,2015,27(13):1359-1362.
17 Cui Rong,Yang Xiaohong,LüQianqian,et al..InG aA s/InP photodetector on SOI circuitry[J].Laser&Optoelectronics Progress,2014,51(11):110003.崔荣,杨晓红,吕倩倩,等.SOI波导与InG aA s/InP光电探测器的集成[J].激光与光电子学进展,2014,51(11):110003.
18 Chen Qiaoshan,Yang Lin.Optical routers for photonic networks-on-chip[J].Laser&Optoelectronics Progress,2014,51(11):110005.陈乔杉,杨林.用于片上光网络的光学路由器研究[J].激光与光电子学进展,2014,51(11):110005.
19 M Yun,S Cho,S K Kang,et al..Ge-on-Si photodetector with novel metallization schemes for on-chip optical interconnect[C].IEEE International Symposium on Consumer Electronics,2015:1-2.
20 T Sato,K Takeda,A Shinya,et al..Photonic crystal lasers for chip-to-chip and on-chip optical interconnects[J].IEEE Journal of Selected Topics in Quantum Electronics,2015,21(6):728-737.
21 B Ciftcioglu,J Gao,R Berman,et al..Recent progress on 3-D integrated intra-chip free-space optical interconnect[C].IEEE Optical Interconnects Conference,2012:56-57.
22 S Tang,R T Chen,L Garrett,et al..Design limitations of highly parallel free-space optical interconnects based on arrays of vertical cavity surface-emitting laser diodes,microlenses,and photodetectors[J].Journal of Lightwave Technology,1994,12(11):1971-1975.
23 D V Plant,M B Venditti,E Laprise,et al..256-channel bidirectional optical interconnect using VCSELs and photodiodes on CMOS[J].Journal of Lightwave Technology,2001,19(8):1093-1103.
24 B Dhoedt,P D Dobbelaere,J Blondelle,et al..Monolithic integration of diffractive lenses with LED-arrays for board-to-board free space optical interconnect[J].Journal of Lightwave Technology,1995,13(6):1065-1073.
25 D J Goodwill,K E Devenport,H S Hinton.An ATM-based intelligent optical backplane using CMOS-SEED smart pixel arrays and free-space optical interconnect modules[J].IEEE Journal of Selected Optics in Quantum Electronics,1996,2(1):85-96.
26 M Vervaeke,C Debaes,B Volckaerts,et al..Optomechanical Monte Carlo tolerancing study of a packaged free-space intra-MCM optical interconnect system[J].IEEE Journal of Selected Topics in Quantum Electronics,2006,12(5):988-996.
27 K Wang,A Nirmalathas,C Lim,et al..High-speed reconfigurable free-space card-to-card optical interconnects[J].IEEE Photonics Journal,2012,4(5):1407-1419.
28 M Schneider,T Kühner,J Mohr,et al..Fibers in printed circuit boards with passively aligned coupling[J].Journal of Lightwave Technology,2010,28(15):2121-2128.
29 S Kopetz,E Rabe,W J Kang,et al..Polysiloxane optical waveguide layer integrated in printed circuit board[J].Electronics Letters,2004,40(11):668-669.
30 Y Ishii,S Koike,Y Arai,et al..SMT-compatible large-tolerance"optobump"interface for interchip optical interconnections[J].IEEE Transactions on Advanced Packaging,2003,26(2):122-127.
31 Y Ishii,S Koike,Y Arai,et al..SMT-compatible optical-I/O chip packaging for chip-level optical interconnects[C].IEEE Electronic Components and Technology Conference,2001:870-875.
32 Y Ishii,N Tanaka,T Sakamoto,et al..Fully SMT-compatible optical-I/O package with microlens array interface[J].Journal of Lightwave Technology,2003,21(1):275-280.
33 S Hiramatsu,T Mikawa.Optical design of active interposer for high-speed chip level optical interconnects[J].Journal of Lightwave Technology,2006,24(2):927-934.
34 M H Cho,H S Cho,S H Hwang,et al..Optical interconnection schemes using micro-optic connectors for passive packaging in optical PCBs[C].IEEE Electronic Components and Technology Conference,2005:1830-1834.
35 M H Cho,S H Hwang,H S Cho,et al..High-coupling-efficiency optical interconnection using a 90°-bent fiber array connector in optical printed circuit boards[J].IEEE Photonics Technology Letters,2005,17(3):690-692.
36 K Nieweglowski,K J Wolter.Optical analysis of short-distance optical interconnect on the PCB-level[C].Electronics System Integration Technology Conference,2006:392-397.
37 K Nieweglowski,K J Wolter.Novel optical transmitter and receiver for parallel optical interconnects on PCB-level[C].2nd Electronics System-Integration Technology Conference,2008:607-611.
38 K Nieweglowski,R Rieske,K J Wolter.Assembly requirements for multi-channel coupling micro-optics in board-level optical interconnect[C].3nd Electronics System-Integration Technology Conference,2010:1-6.
39 G L Bona,B J Offrein,U Bapst,et al..Characterization of parallel optical-interconnect waveguides integrated on a printed circuit board[C].SPIE,2004,5453:134-141.
40 A F Benner,M.Ignatowski,J A Kash,et al..Exploitation of optical interconnects in future server architectures[J].IBM Journal of Research and Development,2005,49(4.5):755-775.
41 L Schares,J A Kash,F E Doany,et al..Terabus:Terabit/second-class card-level optical interconnect technologies[J].IEEE Journal of Selected Topics in Quantum Electronics,2006,12(5):1032-1044.
42 J A Kash,F E Doany,L Schares,et al..Chip-to-chip optical interconnects[C].Optical Fiber Communication Conference and Exposition and the National Fiber Optic Engineers Conference,2006:OFA3.
43 O Liboiron-Ladouceur,C L Schow,P K Pepeljugoski,et al..A 17 Gb/s,200-meter multimode optical fiber link using CMOS analog ICs and silicon carrier packaging[C].19th Annual Meeting of the IEEE Lasers and Electro-Optics Society,2006:573-574.
44 F E Doany,C L Schow,C K Tsang,et al..300-Gb/s 24-channel bidirectional Si carrier transceiver optochip for board-level interconnects[C].Electronic Components and Technology Conference,2008:238-243.
45 F E Doany,C L Schow,J A Kash,et al..Waveguide-coupled parallel optical transceiver technology for Tb/s-class chip-to-chip data transmission[C].SPIE,2008,6899:68990V.
46 F E Doany,C L Schow,C W Baks,et al..160 Gb/s bidirectional polymer-waveguide board-level optical interconnects using CMOS-based transceivers[J].IEEE Transactions on Advanced Packaging,2009,32(2):345-359.
47 F E Doany,B G Lee,C L Schow,et al..Terabit/s-class 24-channel bidirectional optical transceiver module based on TSV Si carrier for board-level interconnects[C].Electronic Components and Technology Conference,2010:58-65.
48 A V Rylyakov,C L Schow,J E Proesel,et al..A 40-Gb/s,850-nm,VCSEL-based full optical link[C].Optical Fiber Communication Conference&Exposition,2012,27(6):1-3.
49 M Karppinen,T Alajoki,A Tanskanen,et al..Parallel optical interconnect between ceramic BGA packages on FR4 board using embedded waveguides and passive optical alignments[C].Electronic Components and Technology Conference,2006:799-805.
50 L Brusberg,H Schrder,R Erxleben,et al..Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling[C].Electronic Components and Technology Conference,2010:269-274.
51 H Schrder,L Brusberg,N Arndt-Staufenbiel,et al..Advanced thin glass based photonic PCB integration[C].Electronic Components and Technology Conference,2012:194-202.
52 L Brusberg,D Manessis,M Neitz,et al..Development of an electro-optical circuit board technology with embedded single-mode glass waveguide layer[C].Electronics System-Integration Conference,2014:1-5.
53 A L Glebov,M G Lee.3D routing on optical boards[C].19th Annual Meeting of the IEEE Lasers and Electro-Optics Society,2006:22-23.
54 A L Glebov,M G Lee,S Aoki,et al..Integrated waveguide micro-optic elements for 3D routing in board-level optical interconnect[C].SPIE,2006,6126:61260N.
55 Fu Kai.Research of optical interconnection waveguides for EOPCB[D].Wuhan:Huazhong University of Science and Technology,2005:45-52.付凯.光电混合印制电路板(EOPCB)光互连波导研究[D].武汉:华中科技大学,2005:45-52.
56 Zhang Jin.Optical coupling in electrical-optical printed-circuit board[D].Wuhan:Huazhong University of Science and Technology,2008:40-55.张瑾.基于EOPCB光互连板的光耦合研究[D].武汉:华中科技大学,2008:40-55.
57 Feng Xianghua.Study on the elements for optical interconnection[D].Changsha:National University of Defense Technology,2012:52-68.冯向华.用于光互连的单元器件研究[D].长沙:国防科学技术大学,2012:52-68.
58 Feng Xianghua,Ji Jiarong,Dou Wenhua.Fabrication of modified polydimethylsiloxane and multimode optical waveguides[J].Acta Optica Sinica,2012,32(5):0531003.冯向华,季家镕,窦文华.聚硅氧烷改性及多模光波导制备[J].光学学报,2012,32(5):0531003.
59 Feng Xianghua,Ji Jiarong,Dou Wenhua.Bending loss of polysiloxane optical waveguides for optical interconnection[J].Acta Optica Sinica,2012,32(8):0823003.冯向华,季家镕,窦文华.用于光互连的聚硅氧烷波导弯曲损耗[J].光学学报,2012,32(8):0823003.
60 Ni Wei.Research on soft lithography based short range optical interconnection[D].Hangzhou:Zhejiang University,2009:39-91.倪玮.基于软光刻的短距离光互联研究[D].杭州:浙江大学,2009:39-91.
61 Wu Jinhua,M Immonen,Yan Huijuan,et al..Application of multimode polymer waveguide in optical-electrical printed circuit board[J].Electronics Process Technology,2015,36(5):291-294.吴金华,M Immonen,严慧娟,等.多模聚合物波导在光电印制板中的应用[J].电子工艺技术,2015,36(5):291-294.