凝固应力法测试铸造铝硅合金枝晶搭接点研究
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  • 英文篇名:Determination of Dendrite Coherency Point by Dynamic Solidifying Stress Method
  • 作者:曾哲明 ; 冯义成 ; 杨婉婷 ; 张佳鹏 ; 王丽萍 ; 李娜
  • 英文作者:ZENG Zheming;FENG Yicheng;YANG Wanting;ZHANG Jiapeng;WANG Liping;LI Na;School of Materials Science and Engineering,Harbin University of Science and Technology;
  • 关键词:Al-Si合金 ; 枝晶搭接点 ; 凝固曲线 ; 凝固应力
  • 英文关键词:Al-Si alloy;;dendrite coherency point;;solidification curve;;solidification stress
  • 中文刊名:ZZJS
  • 英文刊名:Foundry Technology
  • 机构:哈尔滨理工大学材料科学与工程学院;
  • 出版日期:2018-11-18
  • 出版单位:铸造技术
  • 年:2018
  • 期:v.39;No.320
  • 语种:中文;
  • 页:ZZJS201811012
  • 页数:4
  • CN:11
  • ISSN:61-1134/TG
  • 分类号:57-60
摘要
以Al-Si-Mg合金为研究对象,采用双热电偶法和动态凝固应力测试法测试Al-Si-Mg合金的枝晶搭接点温度。结果表明,采用双热电偶法测得Al-Si-Mg合金枝晶搭接点温度为603.8℃,采用动态凝固应力法测得粗杆和细杆中Al-7Si-0.5Mg合金枝晶搭接点温度分别为615.2℃和607.6℃,两种方法测得结果基本一致。因此,动态凝固应力法测试铸造合金枝晶搭接点是可行的。
        The dendrite coherency point of Al-Si-Mg alloy was tested by double thermocouples method and dynamic solidifying stress method.The results show that the temperature of dendrite coherency point is 603.8 ℃ by double thermocouples method,measured dynamic stress method of solidification thick and thin rods of Al-Si7-0.5 Mg alloy dendrite take contact temperature of 615.2 ℃ and 607.6 ℃,respectively.The results of the two methods are basically consistent.Therefore,the dynamic solidification stress method is feasible to test the casting alloy dendrite coherency point.
引文
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