摘要
以Al-Si-Mg合金为研究对象,采用双热电偶法和动态凝固应力测试法测试Al-Si-Mg合金的枝晶搭接点温度。结果表明,采用双热电偶法测得Al-Si-Mg合金枝晶搭接点温度为603.8℃,采用动态凝固应力法测得粗杆和细杆中Al-7Si-0.5Mg合金枝晶搭接点温度分别为615.2℃和607.6℃,两种方法测得结果基本一致。因此,动态凝固应力法测试铸造合金枝晶搭接点是可行的。
The dendrite coherency point of Al-Si-Mg alloy was tested by double thermocouples method and dynamic solidifying stress method.The results show that the temperature of dendrite coherency point is 603.8 ℃ by double thermocouples method,measured dynamic stress method of solidification thick and thin rods of Al-Si7-0.5 Mg alloy dendrite take contact temperature of 615.2 ℃ and 607.6 ℃,respectively.The results of the two methods are basically consistent.Therefore,the dynamic solidification stress method is feasible to test the casting alloy dendrite coherency point.
引文
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