航天器电子产品抗火工冲击环境设计方法
|
摘要
根据航天器火工冲击载荷特点及结构传递和响应特性,梳理了航天器电子产品常见的冲击失效模式以及火工冲击载荷的减缓和隔离措施,通过对电子产品复杂结构进行简化,给出了冲击载荷作用下电子产品冲击响应计算和刚度计算方法。文章提出了电子产品在设计阶段进行抗火工冲击环境的设计方法,试验结果表明:给出的抗火工冲击设计方法正确且流程合理,可以作为同类电子产品抗冲击环境能力评估的参考。
According to the pyroshock and structure response characteristic,the modes of failure caused by shock are summarized,and the methods of reduction and isolation are proposed.The pyroshock response calculation method of electrical unit under pyroshock load and rigidity calculation method are proposed in this paper.The method to resist pyroshock environment in the phase of design by simplifying complex structure of electronic unit is presented.The test results illustrate the correctness of method and the rationality of flow-process.The method can be used to evaluate other similar unit to resist pyroshock environment.
According to the pyroshock and structure response characteristic,the modes of failure caused by shock are summarized,and the methods of reduction and isolation are proposed.The pyroshock response calculation method of electrical unit under pyroshock load and rigidity calculation method are proposed in this paper.The method to resist pyroshock environment in the phase of design by simplifying complex structure of electronic unit is presented.The test results illustrate the correctness of method and the rationality of flow-process.The method can be used to evaluate other similar unit to resist pyroshock environment.
引文
[1]NASA.NASA-STD-7003 Pyroshock test criteria[S].Washington D.C.:NASA,1999
[2]张欢,刘天雄,李长江,等.航天器火工冲击环境防护技术现状与应用[J].航天器工程,2014,23(2):104-113Zhang Huan,Liu Tianxiong,Li Changjiang,et al.Status and application analysis of spacecraft pyroshock protection techniques[J].Spacecraft Engineering,2014,23(2):104-113(in Chinese)
[3]Wong E H,Seah S K W,Shim V P W,et al.A review of board level solder joints for mobile applications[J].Microelectronics Reliability,2008,48(12):1747-1758
[4]Wong E H,Lim K M,Lee N,et al.Drop impact test mechanics and physics of failure[C]//Proceedings of the Fourth Electronic Packaging Technology Conference.New York:IEEE,2002:327-33
[5]Department of Defense.MIL-STD-810G Environmental engineering considerations and laboratory tests[S].Washington D.C.:Department of Defense,2008
[6]Moening C J.Pyrotechnic shock flight failure[C]//Institute of Environmental Sciences Pyrotechnic Shock Tutorial Program,31st Annual Technical Meeting.Washshington D.C.NASA,1985:4-5
[7]Alan Patterso.ARES I separation system design certification testing[R].Washington D.C.:NASA,2005
[8]J Gomez Garcia,J Albus,C Hude,et al.Isolation of sensible instrumentation-platforms against very high pyrotechnic shock in launch vehicles[C]//52International Astronautical Congress.Paris:IAF,2001
[9]Peter H V,Edward C Schlatter.Z-leg shock isolator:US.20100327142[P].2010-12-30
[10]B Brevart.Design rules for electronic equipment submitted to shock[C]//ESA/ESTEC Workshop on Spacecraft Shock Environment and Verification.Paris:ESA,2008
[11]丁继锋,赵欣,韩增尧.航天器火工冲击技术研究进展[J].宇航学报,2014,35(12):1339-1349Ding Jifeng,Zhao Xin,Han Zengyao.Research development of spacecraft pyroshock technique[J].Journal of Astronautics,2014,35(12):1339-1349(in Chinese)
[12]赵欣,丁继锋,韩增尧,等.航天器火工冲击环境分析预示方法研究综述[J].航天器环境工程,2016,33(3):247-256Zhao Xin,Ding Jifeng,Han Zengyao,et al.Review of the prediction methods of the pyroshock environment in spacecraft[J].Spacecraft Environment Engineering,2016,33(3):247-256(in Chinese)
[13]张欢,刘海平,刘天雄,等.航天器火工冲击载荷减缓设计及验证[J].装备环境工程,2015,12(3):34-41Zhang Huan,Liu Haiping,Liu Tianxiong,et al.Design and verification of pyrotechnic shock reduction scheme of spacecraft[J].Equipment Environment Engineering,2015,12(3):34-41(in Chinese)
[14]国防科学技术工业委员会.GJB/Z 222-2005动力学环境数据采集和分析指南[S].北京:国防科工委军标出版发行部出版,2005Commission on Science,Technology,and Industry for National Defense.GJB/Z 222-2005 Guidelines for dynamic environmental data acquisition and analysis[S].Beijing:Military Standard Publishing Department of Commission on Science,Technology,and Industry for National Defense,2005(in Chinese)
[15]Department of Defense.MIL-STD-810G Environmental engineering considerations and laboratory tests[S].Washington D.C.:Department of Defense,2008
[16]中国人民解放军总装备部.GJB 150.16A-2009军用装备实验室环境试验方法第16部分:振动试验[S].北京:总装备部军标出版发行部出版,2009General Armament Department of the Chinese People’s Liberation Army.GJB 150.16A-2009Laboratory environmental test methods for military materiel Part16:vibration test[S].Beijing:Army Standards Press of General Armament Department,2005(in Chinese)
[17]戴夫S斯坦伯格.电子设备振动分析[M].王建刚,译.北京:航空工业出版社,2012Dave S Steinberg.Vibration analysis for electronic equipment[M].Wang Jiangang,translated.Beijing:China Aviation Industry Press,2012(in Chinese)
[18]季馨,王树荣.电子设备振动环境适应性设计[M].北京:电子工业出版社,2013:194-196Ji Xin,Wang Shurong.Adaptive design of vibration environment for electronic equipment[M].Beijing:Publishing Hause of Electronics and Industry,2013:194-196(in Chinese)
[2]张欢,刘天雄,李长江,等.航天器火工冲击环境防护技术现状与应用[J].航天器工程,2014,23(2):104-113Zhang Huan,Liu Tianxiong,Li Changjiang,et al.Status and application analysis of spacecraft pyroshock protection techniques[J].Spacecraft Engineering,2014,23(2):104-113(in Chinese)
[3]Wong E H,Seah S K W,Shim V P W,et al.A review of board level solder joints for mobile applications[J].Microelectronics Reliability,2008,48(12):1747-1758
[4]Wong E H,Lim K M,Lee N,et al.Drop impact test mechanics and physics of failure[C]//Proceedings of the Fourth Electronic Packaging Technology Conference.New York:IEEE,2002:327-33
[5]Department of Defense.MIL-STD-810G Environmental engineering considerations and laboratory tests[S].Washington D.C.:Department of Defense,2008
[6]Moening C J.Pyrotechnic shock flight failure[C]//Institute of Environmental Sciences Pyrotechnic Shock Tutorial Program,31st Annual Technical Meeting.Washshington D.C.NASA,1985:4-5
[7]Alan Patterso.ARES I separation system design certification testing[R].Washington D.C.:NASA,2005
[8]J Gomez Garcia,J Albus,C Hude,et al.Isolation of sensible instrumentation-platforms against very high pyrotechnic shock in launch vehicles[C]//52International Astronautical Congress.Paris:IAF,2001
[9]Peter H V,Edward C Schlatter.Z-leg shock isolator:US.20100327142[P].2010-12-30
[10]B Brevart.Design rules for electronic equipment submitted to shock[C]//ESA/ESTEC Workshop on Spacecraft Shock Environment and Verification.Paris:ESA,2008
[11]丁继锋,赵欣,韩增尧.航天器火工冲击技术研究进展[J].宇航学报,2014,35(12):1339-1349Ding Jifeng,Zhao Xin,Han Zengyao.Research development of spacecraft pyroshock technique[J].Journal of Astronautics,2014,35(12):1339-1349(in Chinese)
[12]赵欣,丁继锋,韩增尧,等.航天器火工冲击环境分析预示方法研究综述[J].航天器环境工程,2016,33(3):247-256Zhao Xin,Ding Jifeng,Han Zengyao,et al.Review of the prediction methods of the pyroshock environment in spacecraft[J].Spacecraft Environment Engineering,2016,33(3):247-256(in Chinese)
[13]张欢,刘海平,刘天雄,等.航天器火工冲击载荷减缓设计及验证[J].装备环境工程,2015,12(3):34-41Zhang Huan,Liu Haiping,Liu Tianxiong,et al.Design and verification of pyrotechnic shock reduction scheme of spacecraft[J].Equipment Environment Engineering,2015,12(3):34-41(in Chinese)
[14]国防科学技术工业委员会.GJB/Z 222-2005动力学环境数据采集和分析指南[S].北京:国防科工委军标出版发行部出版,2005Commission on Science,Technology,and Industry for National Defense.GJB/Z 222-2005 Guidelines for dynamic environmental data acquisition and analysis[S].Beijing:Military Standard Publishing Department of Commission on Science,Technology,and Industry for National Defense,2005(in Chinese)
[15]Department of Defense.MIL-STD-810G Environmental engineering considerations and laboratory tests[S].Washington D.C.:Department of Defense,2008
[16]中国人民解放军总装备部.GJB 150.16A-2009军用装备实验室环境试验方法第16部分:振动试验[S].北京:总装备部军标出版发行部出版,2009General Armament Department of the Chinese People’s Liberation Army.GJB 150.16A-2009Laboratory environmental test methods for military materiel Part16:vibration test[S].Beijing:Army Standards Press of General Armament Department,2005(in Chinese)
[17]戴夫S斯坦伯格.电子设备振动分析[M].王建刚,译.北京:航空工业出版社,2012Dave S Steinberg.Vibration analysis for electronic equipment[M].Wang Jiangang,translated.Beijing:China Aviation Industry Press,2012(in Chinese)
[18]季馨,王树荣.电子设备振动环境适应性设计[M].北京:电子工业出版社,2013:194-196Ji Xin,Wang Shurong.Adaptive design of vibration environment for electronic equipment[M].Beijing:Publishing Hause of Electronics and Industry,2013:194-196(in Chinese)