微波产品焊点典型失效模式可靠性研究
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摘要
微波元器件引线和基板的互连方式较多,为了保证产品性能,最理想的方式是将其引线直接与基板搭焊,但这种方式仅靠焊料和引线的形变来释放应力,有一定的局限性,因此常常出现焊点开裂失效的问题。为了评估微波产品焊点释放应力的能力,介绍了在微波产品中典型的三种高热应力焊点失效模式,分析了焊点开裂的机理。使用ANSYS软件对其应力进行了仿真,结合焊点位移量及其所带来的焊点剪切应变来评估焊点热疲劳寿命,并验证了这些方法的可行性和实用性,最后提出了高应力焊点相应的工艺设计优化措施,对提高焊点可靠性具有重要的指导作用。
There were plenty of methods to connect leads of microwave components with the circuit board, but soldering them directly on board was the best way for guaranting the microwave performances of products.However, in this method, the thermal stress was only set free by the deformation of the solder and the lead which were limited in a poor stress release capacity, generally leading to the crack of solder joints. To evaluate the stress release capacity of microwave products joints, three common typical failure modes of high thermal stress solder joints were introduced, whose crack mechanisms were separately analyzed. The stress of solder joints was simulated through ANSYS software, which combined shift value of solder joints with the shearing deformation produced by it, to evaluate heat fatigue life of solder joints. The applicability and effectiveness of these evaluation methods were verified. Finally, some optimized process design measures were presented which were very important for reliability improvement of solder joints.
There were plenty of methods to connect leads of microwave components with the circuit board, but soldering them directly on board was the best way for guaranting the microwave performances of products.However, in this method, the thermal stress was only set free by the deformation of the solder and the lead which were limited in a poor stress release capacity, generally leading to the crack of solder joints. To evaluate the stress release capacity of microwave products joints, three common typical failure modes of high thermal stress solder joints were introduced, whose crack mechanisms were separately analyzed. The stress of solder joints was simulated through ANSYS software, which combined shift value of solder joints with the shearing deformation produced by it, to evaluate heat fatigue life of solder joints. The applicability and effectiveness of these evaluation methods were verified. Finally, some optimized process design measures were presented which were very important for reliability improvement of solder joints.
引文
[1] DAVE S S.电子设备热循环和振动故障预防[M].常勇,丁其伯,译.北京:航空工业出版社,2012:1.
[2]郝磷,贾忠中,王玉. BGA应力可靠性问题及解决方法[J].电子工艺技术, 2013, 34(3):136-141.
[3]叶焕,薛松柏,张亮,等. CSP器件无铅焊点可靠性的有限元分析[J].焊接学报, 2019,30(11):93-97.
[4]田野.热冲击条件下倒装组装微焊点的可靠性—应力应变[J].焊接学报, 2016, 37(8):67-71.
[5]王尚,田艳红,韩春,等. CBGA器件温度场分布对焊点疲劳寿命影响的有限元分析[J].焊接学报, 2016, 37(11):113-119.
[6] TEE T Y, NGH S H, ZHONG Z W, et al. Board-level solder joint reliability analysis of thermally enhanced BGAs and LGAs[J]. IEEE Trans. Advanced Packaging, 2006, 29(2):284-290.
[7] PAO Y H. A fracture mechanics approach to thermal fatigue life prediction of solder joints[J]. IEEE Transactions on Components Hybrids&Manufacturing Technology, 1990, 203(4):559-570.
[8] BHATE D, SUBBARAYAN G. A nonlinear fracture mechanics perspective on solder joint failure:going beyond the Coffin-Manson equation[C]. IEEE, 2006:1220-1225.
[9] TU P L, CHAN Y C, LAI J K L. Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints[J]. IEEE Transactions on Components Packaging&Manufacturing Technology Part B, 2002, 20(1):87-93.
[10]克莱因瓦辛克R J.电子产品可焊性及焊接技术[M].王志强,译.南京:中国南京无线电公司,南京电子学会,1989:103-104.
[2]郝磷,贾忠中,王玉. BGA应力可靠性问题及解决方法[J].电子工艺技术, 2013, 34(3):136-141.
[3]叶焕,薛松柏,张亮,等. CSP器件无铅焊点可靠性的有限元分析[J].焊接学报, 2019,30(11):93-97.
[4]田野.热冲击条件下倒装组装微焊点的可靠性—应力应变[J].焊接学报, 2016, 37(8):67-71.
[5]王尚,田艳红,韩春,等. CBGA器件温度场分布对焊点疲劳寿命影响的有限元分析[J].焊接学报, 2016, 37(11):113-119.
[6] TEE T Y, NGH S H, ZHONG Z W, et al. Board-level solder joint reliability analysis of thermally enhanced BGAs and LGAs[J]. IEEE Trans. Advanced Packaging, 2006, 29(2):284-290.
[7] PAO Y H. A fracture mechanics approach to thermal fatigue life prediction of solder joints[J]. IEEE Transactions on Components Hybrids&Manufacturing Technology, 1990, 203(4):559-570.
[8] BHATE D, SUBBARAYAN G. A nonlinear fracture mechanics perspective on solder joint failure:going beyond the Coffin-Manson equation[C]. IEEE, 2006:1220-1225.
[9] TU P L, CHAN Y C, LAI J K L. Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints[J]. IEEE Transactions on Components Packaging&Manufacturing Technology Part B, 2002, 20(1):87-93.
[10]克莱因瓦辛克R J.电子产品可焊性及焊接技术[M].王志强,译.南京:中国南京无线电公司,南京电子学会,1989:103-104.