摘要
设计三因素三水平TC4盘铣开槽正交实验,DEWESOFT独立多功能测试系统同时采集切削力和切削温度信号,为加工表面状态改变提供基本理论依据, 600 MRD数显洛式硬度计进行显微硬度测量,莱卡S6D显微镜进行金相组织分析,研究TC4盘铣表面变质层规律及工艺参数对变质层的影响规律。针对表面残余应力研究发现,盘铣TC4表面均为压应力,主要由铣削加工过程中后刀面与工件摩擦产生的挤光效应引起。针对表层显微硬度及显微组织研究发现,不同工艺参数加工表面发生了严重的拉伸变形,微观组织由初始等轴组织α相转变为α+β双态组织或魏氏组织,使材料硬度增大。试验结果表明:各因素对变质层的影响程度依次为铣削速度>切削深度>进给速度,变质层随着铣削速度的增大逐渐减小,随着切削深度和进给速度的增大逐渐增大。
Three factors three levels orthogonal experiment of TC4 disc milling grooving is designed. The signal of milling force and milling temperature are measured by DEWESOFT test system, which provide the basis to the change of the machined surface states. The microhardness is measured by digital display Rockwell hard-tester 600 MRD, the microstructure is detected by S6 D4 microscope. Research on affected-layer rule and influence on affected-layer of technological parameters are conducted on. It is found that the surface of disc-milling are all compressive stress, mainly are generated by burnishing effect, which is produced by friction between flank face and workpiece during processing. In addition, through the research on surface microhardness and microstructure, machining surface of various technological parameters occurs serious tensile deformation, micostructure changes in α+β bimodal structure or widmannstatted structure from equimannstatten structure, which makes material hardness increases. The experimental results shows that the successive impact factors for affected layer are cutting speed>cut depth>feed speed respectively.
引文
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