激光热应力控制断裂切割技术的研究进展
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摘要
总结和分析了激光热应力控制断裂切割技术(激光热裂切割技术)的基本原理、技术特点以及优缺点。针对激光热裂切割技术存在的问题,详细阐述了近20年来发展起来的以热应力控制断裂为基本原理的激光切割改进技术,包括辅助激光热裂切割技术(水冷、预弯曲辅助等)、双激光束热裂切割技术、激光隐形切割技术、激光多焦点热裂切割技术、超短脉冲激光热裂切割技术、基于热应力法微波切割技术和适用于非对称切割材料(包括非对称直线切割、折线切割、曲线切割等)的激光切割路线偏离矫正技术。通过对比和分析各类切割技术的优缺点,希望为激光热裂控制切割脆性材料技术的进一步探索和研究提出可行性思路。最后,在此基础上对激光热裂切割脆性材料存在的问题和发展前景进行总结并提出相关建议。
The basic principle, technical features, and relative merits of laser cutting technology with thermal-induced crack propagation(named as LCT-TCP) are summarized and analyzed. In view of the problems existing in the LCT-TCP, the improvement technology for laser cutting based on thermal-induced crack propagation developed in the past 20 years is described in detail, including auxiliary LCT-TCP(water cooling, pre-bending auxiliary, etc.), double LCT-TCP, laser stealth cutting technology, multi-focus LCT-TCP, ultrashort pulse LCT-TCP, thermal stress based microwave cutting technology and laser cutting technology with path compensation suitable for asymmetric cutting materials(including asymmetric linear cutting, fold line laser cutting, curve cutting, etc.). By comparing and analyzing the advantages and disadvantages of various cutting technologies, it is expected that a feasible idea for the further exploration and research of LCT-TCP for brittle materials is proposed. Finally, the problems and development prospects of the LCT-TCP for brittle materials are summarized and some suggestions are put forward.
The basic principle, technical features, and relative merits of laser cutting technology with thermal-induced crack propagation(named as LCT-TCP) are summarized and analyzed. In view of the problems existing in the LCT-TCP, the improvement technology for laser cutting based on thermal-induced crack propagation developed in the past 20 years is described in detail, including auxiliary LCT-TCP(water cooling, pre-bending auxiliary, etc.), double LCT-TCP, laser stealth cutting technology, multi-focus LCT-TCP, ultrashort pulse LCT-TCP, thermal stress based microwave cutting technology and laser cutting technology with path compensation suitable for asymmetric cutting materials(including asymmetric linear cutting, fold line laser cutting, curve cutting, etc.). By comparing and analyzing the advantages and disadvantages of various cutting technologies, it is expected that a feasible idea for the further exploration and research of LCT-TCP for brittle materials is proposed. Finally, the problems and development prospects of the LCT-TCP for brittle materials are summarized and some suggestions are put forward.
引文
[1] 季凌飞,闫胤洲,鲍勇,等.陶瓷激光切割技术的研究现状与思考[J].中国激光,2008,35(11):1686-1692.JI Ling-fei,YAN Yin-zhou,BAO Yong,et al.Research and consideration on laser cutting technique of ceramics[J].Chinese Journal of Lasers,2008,35(11):1686-1692.
[2] 闫胤洲,季凌飞,鲍勇,等.高硬脆陶瓷激光加工技术的研究及进展[J].激光杂志,2008,29(6):5-8.YAN Yin-zhou,JI Ling-fei,BAO Yong,et al.Researches and developments of laser processing ceramics technique[J].Lasers Journal,2008,29(6):5-8.
[3] 王扬,李春奇,杨立军,等.非常规激光加工技术的研究[J].红外与激光工程,2011,40(3):448-454.WANG Yang,LI Chun-qi,YANG Li-jun,et al.Research on unconventional laser machining[J].Infrared and Laser Engineering,2011,40(3):448-454.
[4] 李海鸥,韦春荣,王晓峰,等.晶圆激光切割技术的研究进展[J].半导体技术,2017,42(8):561-568.LI Hai-ou,WEI Chun-rong,WANG Xiao-feng,et al.Research progress on wafer laser cutting technology[J].Semiconductor Technology,2017,42(8):561-568.
[5] Ueda T,Yamada K,Oiso K,et al.Thermal stress cleaving of brittle materials by laser beam[J].CIRP Annals,2002,51(1):149-152.
[6] Lumley R.Controlled separation of brittle materials using a laser[J].American Ceramic Society Bulletin,1969,48:850-854.
[7] Grove F J,Wright D C,Hamer F M.Cutting of glass with a laser beam:US,3543979[P].1970.
[8] Tsai C H,Liou C S.Fracture mechanism of laser cutting with controlled fracture[J].Journal of Manufacturing Science and Engineering,2003,125(3):519-528.
[9] Tsai C H,Chen H W.Laser cutting of thick ceramic substrates by controlled fracture technique[J].Journal of Materials Processing Technology,2003,136(1/3):166-173.
[10] Tsai C H,Liou C S.Applying an on-line crack detection technique for laser cutting by controlled fracture[J].The International Journal of Advanced Manufacturing Technology,2001,18(10):724-730.
[11] Tsai C H,Lin B C.Laser cutting with controlled fracture and pre-bending applied to LCD glass separation[J].The International Journal of Advanced Manufacturing Technology,2006,32(11/12):1155-1162.
[12] Yamamoto K,Hasaka N,Morita H,et al.Crack propagation in glass by laser irradiation along laser scribed line[J].Journal of Manufacturing Science and Engineering,2009,131(5):1-8.
[13] Yamamoto K,Hasaka N,Morita H,et al.Influence of glass substrate thickness in laser scribing of glass[J].Precision Engineering,2010,34(1):55-61.
[14] Black I,Chua K L.Laser cutting of thick ceramic tile[J].Optics and Laser Technology,1997,29(4):193-205.
[15] Yang L J,Wang Y,Tian Z G,et al.YAG laser cutting soda-lime glass with controlled fracture and volumetric heat absorption[J].International Journal of Machine Tools and Manufacture,2010,50(10):849-859.
[16] 焦俊科,王新兵,李又平.双束CO2激光切割玻璃的实验研究[J].中国激光,2008,35(11):1808-1812.JIAO Jun-ke,WANG Xin-bing,LI You-ping.Experimental study of cutting glass by dual CO2 laser beams[J].Chinese Journal of Lasers,2008,35(11):1808-1812.
[17] Zhao C Y,Zhang H Z,Wang Y.Semiconductor laser asymmetry cutting glass with laser induced thermal-crack propagation[J].Optics and Lasers in Engineering,2014,63:43-52.
[18] Kondratenko V.Cutting method for brittle non-metallic materials (two variants):US,484987[P].2004-10.
[19] Huang K C,Hsiao W T,Hwang C H,et al.The laser ablation model development of glass substrate cutting assisted with the thermal fracture and ultrasonic mechanisms[J].Optics and Lasers in Engineering,2015,67:31-35.
[20] Verheyen W,Raes A,Coopmans J P,et al.Glass cutting:US,4932726[P].1976.
[21] Ikeda M,Shibata T,Makino E,et al.Study on laser breaking of glass plate (1streport)-generation and growth of vertical cracks by scribing[J].Journal of Precision Engineering (Japan),1996,62:413-417.
[22] Tsai C H,Huang B W.Diamond scribing and laser breaking for LCD glass substrates[J].Journal of Materials Processing Technology,2008,198(1/3):350-358.
[23] Saman A M,Furumoto T,Ueda T,et al.A study on separating of a silicon wafer with moving laser beam by using thermal stress cleaving technique[J].Journal of Materials Processing Technology,2015,223:252-261.
[24] Unger U,Wittenbecher W.The cutting edge of laser technology[J].Glass,1998,75(4):101-102.
[25] Kalyanasundaram D,Shehata G,Neumann C,et al.Design and validation of a hybrid laser/water-jet machining system for brittle materials[J].Journal of Laser Applications,2008,20(2):127-134.
[26] Yamamoto K,Hasaka N,Morita H,et al.Influence of thermal expansion coefficient in laser scribing of glass[J].Precision Engineering,2010,34(1):70-75.
[27] Romero P,Otero N,Coto I,et al.Experimental study of diode laser cutting of silicon by means of water assisted thermally driven separation mechanism[J].Physics Procedia,2013,41:617-626.
[28] Pereles S V,Washintomn M,Brugan P.Faster and damage-reduced laser cutting of thick ceramics using a simultaneous prescore approach[J].Journal of Laser Applications,2005,17(4):219-224.
[29] Segall A E,Cai.G,Akarapu R.Studies on the use of offset and angled prescores for fracture control during laser machining of alumina ceramics[J].Journal of Laser Applications,2006,18(4):325-329.
[30] Brugan P,Cai G,Akarapu R,et al.Controlled-fracture of prescored alumina ceramics using simultaneous CO2 lasers[J].Journal of Laser Applications,2006,18(3):236-241.
[31] Jiao J K,Wang X B.Cutting glass substrates with dual-laser beams[J].Optics and Lasers in Engineering,2009,47(7/8):860-864.
[32] 许国良,李迎霞,黄素逸,等.采用双光束 CO2 激光的玻璃切割过程数值模拟[J].华中科技大学学报(自然科学版),2007,35(1):88-90.XU Guo-liang,LI Ying-xia,HUANG Su-yi,et al.Numerical simulation of cutting glass with double-beam CO2-laser[J].Journal of Huazhong University of Science and Technology (Nature Science Edition),2007,35(1):88-90.
[33] 南亨佑,秋大镐,全柏均.用激光束切割非金属衬底的方法和装置:中国,CNl349875[P].2002-5-22.
[34] Kumagai M,Uchiyama N,Ohmura E,et al.Advanced dicing technology for semiconductor wafer-stealth dicing[J].IEEE Transactions on Semiconductor Manufacturing,2007,20(3):259-265.
[35] Ohmura E,Kumagai M,Nakano M,et al.Analysis of processing mechanism in stealth dicing of ultra thin silicon wafer[J].Journal of Advanced Mechanical Design,Systems,and Manufacturing,2008,2(4):540-549.
[36] Izawa Y,Tsurumi Y,Miyanaga N,et al.Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation[C]//2008 IEEE 21st International Conference on Micro Electro Mechanical Systems,Tucson,2008,822-827.
[37] Liu P,Deng L,Duan J,et al.A study on laser multi-focus separation technology of thick KDP crystal[J].International Journal of Machine Tools and Manufacture,2017,118-119:26-36.
[38] Deng L,Duan J,Zeng X,et al.A study on dual laser beam separation technology of KDP crystal[J].International Journal of Machine Tools and Manufacture,2013,72:1-10.
[39] Deng L,Liu P,Duan J,et al.A simulation study of dual laser beam separation technology for thick transparent inorganic materials[J].Materials and Design,2017,132:467-478.
[40] Mishchik K.Ultrashort pulse laser cutting of glass by controlled fracture propagation[J].Journal of Laser Micro/Nanoengineering,2016,11(1):66-70.
[41] Mishchik K,Beuton R,Dematteo Caulier O,et al.Improved laser glass cutting by spatio-temporal control of energy deposition using bursts of femtosecond pulses[J].Optics Express,2017,25(26):33271-33282.
[42] Javaux C,Mishchik K,Dematteo Caulier O,et al.Effects of burst mode on transparent materials processing[C]//in SPIE LASE,San Francisco,Feb 2015,9351-93510.
[43] Parry J,Ahmed R,Dear F,et al.A Fiber-laser process for cutting thick Yttria-Stabilized Zirconia:application and modeling[J].International Journal of Applied Ceramic Technology,2011,8(6):1277-1288.
[44] 闫胤洲.激光无裂纹切割陶瓷研究[D].北京:北京工业大学,2013.YAN Yin-zhou.Investigation on laser crack-free cutting of ceramics [D].Beijing:Beijing University of Technology,2013.
[45] Ji L F,Yan Y Z,Bao Y,et al.Crack-free cutting of thick and dense ceramics with CO2 laser by single-pass process[J].Optics and Lasers in Engineering,2008,46(10):785-790.
[46] Wang H L,Zhang H Z,Wang Y.Splitting of glass and SiC ceramic sheets using controlled fracture technique with elliptic microwave spot[J].Ceramics International,2017,43(2):1669-1676.
[47] Nisar S,Sheikh M A,Li L,et al.Effect of thermal stresses on chip-free diode laser cutting of glass[J].Optics and Laser Technology,2009,41(3):318-327.
[48] Nisar S,Li L,Sheikh M A,et al.The effect of continuous and pulsed beam modes on cut path deviation in diode laser cutting of glass[J].The International Journal of Advanced Manufacturing Technology,2009,49(1/4):167-175.
[49] Nisar S,Khan S Z,Ali M,et al.Comparison of cut path deviation between CO2 and diode lasers in float-glass cutting[J].Journal of Russian Laser Research,2014,35(2):182-192.
[50] Nisar S,Sheikh M A,Li L,et al.The effect of material thickness,laser power and cutting speed on cut path deviation in high-power diode laser chip-free cutting of glass[J].Optics and Laser Technology,2010,42(6):1022-1031.
[51] Lin J.Crack propagation analysis in laser scribing of glass[J].International Journal of Industrial and Manufacturing Engineering,2016,10(9):1630-1636.
[52] Tsai C H,Chen C J.Application of iterative path revision technique for laser cutting with controlled fracture[J].Optics and Lasers in Engineering,2004,41(1):189-204.
[53] Miyashita Y,Mogi M,Hasegawa H,et al.Study on a controlling method for crack nucleation and propagation behavior in laser cutting of glass[J].Journal of Solid Mechanics and Materials Engineering,2008,2(12):1555-1566.
[54] Zhao C Y,Zhang H Z,Yang L J,et al.Dual laser beam revising the separation path technology of laser induced thermal-crack propagation for asymmetric linear cutting glass[J].International Journal of Machine Tools and Manufacture,2016,106:43-55.
[2] 闫胤洲,季凌飞,鲍勇,等.高硬脆陶瓷激光加工技术的研究及进展[J].激光杂志,2008,29(6):5-8.YAN Yin-zhou,JI Ling-fei,BAO Yong,et al.Researches and developments of laser processing ceramics technique[J].Lasers Journal,2008,29(6):5-8.
[3] 王扬,李春奇,杨立军,等.非常规激光加工技术的研究[J].红外与激光工程,2011,40(3):448-454.WANG Yang,LI Chun-qi,YANG Li-jun,et al.Research on unconventional laser machining[J].Infrared and Laser Engineering,2011,40(3):448-454.
[4] 李海鸥,韦春荣,王晓峰,等.晶圆激光切割技术的研究进展[J].半导体技术,2017,42(8):561-568.LI Hai-ou,WEI Chun-rong,WANG Xiao-feng,et al.Research progress on wafer laser cutting technology[J].Semiconductor Technology,2017,42(8):561-568.
[5] Ueda T,Yamada K,Oiso K,et al.Thermal stress cleaving of brittle materials by laser beam[J].CIRP Annals,2002,51(1):149-152.
[6] Lumley R.Controlled separation of brittle materials using a laser[J].American Ceramic Society Bulletin,1969,48:850-854.
[7] Grove F J,Wright D C,Hamer F M.Cutting of glass with a laser beam:US,3543979[P].1970.
[8] Tsai C H,Liou C S.Fracture mechanism of laser cutting with controlled fracture[J].Journal of Manufacturing Science and Engineering,2003,125(3):519-528.
[9] Tsai C H,Chen H W.Laser cutting of thick ceramic substrates by controlled fracture technique[J].Journal of Materials Processing Technology,2003,136(1/3):166-173.
[10] Tsai C H,Liou C S.Applying an on-line crack detection technique for laser cutting by controlled fracture[J].The International Journal of Advanced Manufacturing Technology,2001,18(10):724-730.
[11] Tsai C H,Lin B C.Laser cutting with controlled fracture and pre-bending applied to LCD glass separation[J].The International Journal of Advanced Manufacturing Technology,2006,32(11/12):1155-1162.
[12] Yamamoto K,Hasaka N,Morita H,et al.Crack propagation in glass by laser irradiation along laser scribed line[J].Journal of Manufacturing Science and Engineering,2009,131(5):1-8.
[13] Yamamoto K,Hasaka N,Morita H,et al.Influence of glass substrate thickness in laser scribing of glass[J].Precision Engineering,2010,34(1):55-61.
[14] Black I,Chua K L.Laser cutting of thick ceramic tile[J].Optics and Laser Technology,1997,29(4):193-205.
[15] Yang L J,Wang Y,Tian Z G,et al.YAG laser cutting soda-lime glass with controlled fracture and volumetric heat absorption[J].International Journal of Machine Tools and Manufacture,2010,50(10):849-859.
[16] 焦俊科,王新兵,李又平.双束CO2激光切割玻璃的实验研究[J].中国激光,2008,35(11):1808-1812.JIAO Jun-ke,WANG Xin-bing,LI You-ping.Experimental study of cutting glass by dual CO2 laser beams[J].Chinese Journal of Lasers,2008,35(11):1808-1812.
[17] Zhao C Y,Zhang H Z,Wang Y.Semiconductor laser asymmetry cutting glass with laser induced thermal-crack propagation[J].Optics and Lasers in Engineering,2014,63:43-52.
[18] Kondratenko V.Cutting method for brittle non-metallic materials (two variants):US,484987[P].2004-10.
[19] Huang K C,Hsiao W T,Hwang C H,et al.The laser ablation model development of glass substrate cutting assisted with the thermal fracture and ultrasonic mechanisms[J].Optics and Lasers in Engineering,2015,67:31-35.
[20] Verheyen W,Raes A,Coopmans J P,et al.Glass cutting:US,4932726[P].1976.
[21] Ikeda M,Shibata T,Makino E,et al.Study on laser breaking of glass plate (1streport)-generation and growth of vertical cracks by scribing[J].Journal of Precision Engineering (Japan),1996,62:413-417.
[22] Tsai C H,Huang B W.Diamond scribing and laser breaking for LCD glass substrates[J].Journal of Materials Processing Technology,2008,198(1/3):350-358.
[23] Saman A M,Furumoto T,Ueda T,et al.A study on separating of a silicon wafer with moving laser beam by using thermal stress cleaving technique[J].Journal of Materials Processing Technology,2015,223:252-261.
[24] Unger U,Wittenbecher W.The cutting edge of laser technology[J].Glass,1998,75(4):101-102.
[25] Kalyanasundaram D,Shehata G,Neumann C,et al.Design and validation of a hybrid laser/water-jet machining system for brittle materials[J].Journal of Laser Applications,2008,20(2):127-134.
[26] Yamamoto K,Hasaka N,Morita H,et al.Influence of thermal expansion coefficient in laser scribing of glass[J].Precision Engineering,2010,34(1):70-75.
[27] Romero P,Otero N,Coto I,et al.Experimental study of diode laser cutting of silicon by means of water assisted thermally driven separation mechanism[J].Physics Procedia,2013,41:617-626.
[28] Pereles S V,Washintomn M,Brugan P.Faster and damage-reduced laser cutting of thick ceramics using a simultaneous prescore approach[J].Journal of Laser Applications,2005,17(4):219-224.
[29] Segall A E,Cai.G,Akarapu R.Studies on the use of offset and angled prescores for fracture control during laser machining of alumina ceramics[J].Journal of Laser Applications,2006,18(4):325-329.
[30] Brugan P,Cai G,Akarapu R,et al.Controlled-fracture of prescored alumina ceramics using simultaneous CO2 lasers[J].Journal of Laser Applications,2006,18(3):236-241.
[31] Jiao J K,Wang X B.Cutting glass substrates with dual-laser beams[J].Optics and Lasers in Engineering,2009,47(7/8):860-864.
[32] 许国良,李迎霞,黄素逸,等.采用双光束 CO2 激光的玻璃切割过程数值模拟[J].华中科技大学学报(自然科学版),2007,35(1):88-90.XU Guo-liang,LI Ying-xia,HUANG Su-yi,et al.Numerical simulation of cutting glass with double-beam CO2-laser[J].Journal of Huazhong University of Science and Technology (Nature Science Edition),2007,35(1):88-90.
[33] 南亨佑,秋大镐,全柏均.用激光束切割非金属衬底的方法和装置:中国,CNl349875[P].2002-5-22.
[34] Kumagai M,Uchiyama N,Ohmura E,et al.Advanced dicing technology for semiconductor wafer-stealth dicing[J].IEEE Transactions on Semiconductor Manufacturing,2007,20(3):259-265.
[35] Ohmura E,Kumagai M,Nakano M,et al.Analysis of processing mechanism in stealth dicing of ultra thin silicon wafer[J].Journal of Advanced Mechanical Design,Systems,and Manufacturing,2008,2(4):540-549.
[36] Izawa Y,Tsurumi Y,Miyanaga N,et al.Debris-free in-air laser dicing for multi-layer MEMS by perforated internal transformation and thermally-induced crack propagation[C]//2008 IEEE 21st International Conference on Micro Electro Mechanical Systems,Tucson,2008,822-827.
[37] Liu P,Deng L,Duan J,et al.A study on laser multi-focus separation technology of thick KDP crystal[J].International Journal of Machine Tools and Manufacture,2017,118-119:26-36.
[38] Deng L,Duan J,Zeng X,et al.A study on dual laser beam separation technology of KDP crystal[J].International Journal of Machine Tools and Manufacture,2013,72:1-10.
[39] Deng L,Liu P,Duan J,et al.A simulation study of dual laser beam separation technology for thick transparent inorganic materials[J].Materials and Design,2017,132:467-478.
[40] Mishchik K.Ultrashort pulse laser cutting of glass by controlled fracture propagation[J].Journal of Laser Micro/Nanoengineering,2016,11(1):66-70.
[41] Mishchik K,Beuton R,Dematteo Caulier O,et al.Improved laser glass cutting by spatio-temporal control of energy deposition using bursts of femtosecond pulses[J].Optics Express,2017,25(26):33271-33282.
[42] Javaux C,Mishchik K,Dematteo Caulier O,et al.Effects of burst mode on transparent materials processing[C]//in SPIE LASE,San Francisco,Feb 2015,9351-93510.
[43] Parry J,Ahmed R,Dear F,et al.A Fiber-laser process for cutting thick Yttria-Stabilized Zirconia:application and modeling[J].International Journal of Applied Ceramic Technology,2011,8(6):1277-1288.
[44] 闫胤洲.激光无裂纹切割陶瓷研究[D].北京:北京工业大学,2013.YAN Yin-zhou.Investigation on laser crack-free cutting of ceramics [D].Beijing:Beijing University of Technology,2013.
[45] Ji L F,Yan Y Z,Bao Y,et al.Crack-free cutting of thick and dense ceramics with CO2 laser by single-pass process[J].Optics and Lasers in Engineering,2008,46(10):785-790.
[46] Wang H L,Zhang H Z,Wang Y.Splitting of glass and SiC ceramic sheets using controlled fracture technique with elliptic microwave spot[J].Ceramics International,2017,43(2):1669-1676.
[47] Nisar S,Sheikh M A,Li L,et al.Effect of thermal stresses on chip-free diode laser cutting of glass[J].Optics and Laser Technology,2009,41(3):318-327.
[48] Nisar S,Li L,Sheikh M A,et al.The effect of continuous and pulsed beam modes on cut path deviation in diode laser cutting of glass[J].The International Journal of Advanced Manufacturing Technology,2009,49(1/4):167-175.
[49] Nisar S,Khan S Z,Ali M,et al.Comparison of cut path deviation between CO2 and diode lasers in float-glass cutting[J].Journal of Russian Laser Research,2014,35(2):182-192.
[50] Nisar S,Sheikh M A,Li L,et al.The effect of material thickness,laser power and cutting speed on cut path deviation in high-power diode laser chip-free cutting of glass[J].Optics and Laser Technology,2010,42(6):1022-1031.
[51] Lin J.Crack propagation analysis in laser scribing of glass[J].International Journal of Industrial and Manufacturing Engineering,2016,10(9):1630-1636.
[52] Tsai C H,Chen C J.Application of iterative path revision technique for laser cutting with controlled fracture[J].Optics and Lasers in Engineering,2004,41(1):189-204.
[53] Miyashita Y,Mogi M,Hasegawa H,et al.Study on a controlling method for crack nucleation and propagation behavior in laser cutting of glass[J].Journal of Solid Mechanics and Materials Engineering,2008,2(12):1555-1566.
[54] Zhao C Y,Zhang H Z,Yang L J,et al.Dual laser beam revising the separation path technology of laser induced thermal-crack propagation for asymmetric linear cutting glass[J].International Journal of Machine Tools and Manufacture,2016,106:43-55.