光学玻璃的高效精密划切工艺研究
|
摘要
利用自主研发的FAD1210高精高效划片机,通过单因素试验法研究了装夹紧固方式、划片刀种类、切割水流量对K9光学玻璃划切性能的影响,且检测其崩边宽度及表面粗糙度来评价划切效果。结果表明:玻璃基板的紧固方式效果较好,UV膜次之,高温硅胶带较差;树脂结合剂划片刀划切玻璃的效果较理想,其崩边宽度较小、表面粗糙度较好,金属刀次之,电镀刀效果较差;切割水流量增大,玻璃崩边宽度和表面粗糙度逐渐减小,当切割水流量大于4.5 L/min时,划切效果趋于稳定。在玻璃基板紧固方式、树脂划片刀和切割水流量4.5 L/min的优化参数下划切K9光学玻璃,划切效果最佳,崩边宽度为5.8μm,表面粗糙度R_a为10.5 nm。
Single factor tests are implemented on self-developed FAD 1210 high-precision and high-efficiency slicing machine. The influences of clamping method, dicing blade type and water flow rate on the sliced K9 optical glass are studied and evaluated by measuring the chipping size and the surface roughness of the glass. The results show that the fastening mode of glass substrate has the best effect on the cutting of K9 optical glass, followed by UV film and high temperature silicone tape. The effect of resin bond dicing blade is ideal when dicing glass, with smaller chipping size and better surface roughness. The metal dicing blade ranks next and the effect of electroplating dicing blade is worst. With the increase of dicing water flow rate, the chipping size and surface roughness decrease gradually. When the dicing water flow rate is more than 4.5 L/min, the dicing effect tends to be stable. When chipping K9 optical glass under the optimum parameters of glass substrate fastening mode, resin dicing blade and dicing water flow rate of 4.5 L/min, the dicing effect is the best with chipping size of 5.8 μm and surface roughness R_a of 10.5 nm.
Single factor tests are implemented on self-developed FAD 1210 high-precision and high-efficiency slicing machine. The influences of clamping method, dicing blade type and water flow rate on the sliced K9 optical glass are studied and evaluated by measuring the chipping size and the surface roughness of the glass. The results show that the fastening mode of glass substrate has the best effect on the cutting of K9 optical glass, followed by UV film and high temperature silicone tape. The effect of resin bond dicing blade is ideal when dicing glass, with smaller chipping size and better surface roughness. The metal dicing blade ranks next and the effect of electroplating dicing blade is worst. With the increase of dicing water flow rate, the chipping size and surface roughness decrease gradually. When the dicing water flow rate is more than 4.5 L/min, the dicing effect tends to be stable. When chipping K9 optical glass under the optimum parameters of glass substrate fastening mode, resin dicing blade and dicing water flow rate of 4.5 L/min, the dicing effect is the best with chipping size of 5.8 μm and surface roughness R_a of 10.5 nm.
引文
[1] 修树东, 周明, 李敏. 光学玻璃微切削时材料去除机理和表面质量的研究 [J]. 工具技术, 2008(4): 15–17.XIU Shudong, ZHOU Ming, LI Min. Research on material removal mechanism and surface quality in micro-cutting of optical glasses [J]. Tool Engineering, 2008(4): 15-17.
[2] 闫伟文, 高清勇. 划片机划切工艺研究 [J]. 电子工业专用设备, 2014, 43(11): 24–28.YAN Weiwen, GAO Qingyong. The research of dicing saw′s dicing process [J]. Equipment for Electronic Products Manufacturing, 2014, 43(11): 24-28.
[3] 杜鹃, 李占杰, 宫虎, 等. 硬脆材料加工诱导崩边断裂的机理分析及控制方法研究 [J]. 机械科学与技术, 2013, 32(10): 1451–1455.DU Juan, LI Zhanjie, GONG Hu, et al. Study on the mechanisms and control method of edge chipping fracture in the machining of brittle and hard materials [J]. Mechanical Science and Technology for Aerospace Engineering, 2013, 32(10): 1451-1455.
[4] 蔡克新, 曹力宁. LCD玻璃划切机控制系统设计 [J]. 电子工艺技术, 2013, 34(3): 170–173.CAI Kexin, CAO Lining. Control system design of LCD glass incising machine [J]. Electronics Process Technology, 2013, 34(3): 170-173.
[5] 耿其东, 李春燕. 磁力研磨加工K9光学玻璃的实验研究 [J]. 表面技术, 2018, 47(7): 112–118.GENG Qidong, LI Chunyan. Experimental study on magnetic abrasive finishing K9 optical glass [J]. Surface Technology, 2018, 47(7): 112-118.
[6] 肖强, 朱育权, 王丽君. ELID磨削试验电解参数对光学玻璃表面质量的影响研究 [J]. 表面技术, 2006(2): 24–26.XIAO Qiang, ZHU Yuquan, WANG Lijun. Study on the effect of electrolytic parameter of the ELID grinding expermient on surface quality of optical glass [J]. Surface Technology, 2006(2): 24-26.
[7] 甄万财. 砂轮划片机划切技术的研究 [J]. 电子工业专用设备, 2004(9): 68–71.ZHEN Wancai. A research on dicing technology of wheel wafer dicer [J]. Equipment for Electronic Products Manufacturing, 2004(9): 68-71.
[8] SCOTT C G, DANYLUK S. Examination of silicon wear debris generated in a linear scratch test [J]. Wear, 1992, 52(1) : 183-185.
[9] 姜峰, 李剑锋, 孙杰, 等. 硬脆材料塑性加工技术的研究现状 [J]. 工具技术, 2007, 41(8): 5–10.JIANG Feng, LI Jianfeng, SUN Jie, et al. Research actualities of ductile machining for hard and brittle materials [J]. Tool Engineering, 2007, 41(8): 5-10.
[10] 张伟, 贾月明. 晶圆划切工艺与优化 [J]. 电子工业专用设备, 2012(4): 7–12.ZHANG Wei, JIA Yueming. Technics and optimization of wafer dicing [J]. Equipment for Electronic Products Manufacturing, 2012(4): 7-12.
[11] 倪皓, 宫虎, 房丰洲. 旋转超声加工硬脆性材料中边缘破损的研究 [J]. 航空精密制造技术, 2009, 45(5): 8–10.NI Hao, GONG Hu, FANG Fengzhou. Study on edge-chipping of brittle and hard materials in rotary ultrasonic machining [J]. Aviation Precision Manufacturing Technology, 2009, 45(5): 8-10.
[12] 王守发, 高身杰. 优化砂轮性能提高磨削质量 [J]. 经济技术协作信息, 2011(20): 103.WANG Shoufa, GAO Shenjie. Optimizing the performance of grinding wheel and improving grinding quality [J]. Economic and Technological Collaboration Information, 2011(20): 103.
[13] LIN J W, CHENG M H. Investigation of chipping and wear of silicon wafer dicing [J]. Journal of Manufacturing Processes, 2014, 16(3): 373-378.
[14] 文赟, 王克江, 孙敏, 等. 浅析砂轮划片机划切工艺 [J]. 电子工业专用设备, 2010, 39(6): 21–26.WEN Yun, WANG Kejiang, SUN Min, et al. Shallow analysis on the technics of grinding wheel dicing saw [J]. Equipment for Electronic Products Manufacturing, 2010, 39(6): 21-26.
[2] 闫伟文, 高清勇. 划片机划切工艺研究 [J]. 电子工业专用设备, 2014, 43(11): 24–28.YAN Weiwen, GAO Qingyong. The research of dicing saw′s dicing process [J]. Equipment for Electronic Products Manufacturing, 2014, 43(11): 24-28.
[3] 杜鹃, 李占杰, 宫虎, 等. 硬脆材料加工诱导崩边断裂的机理分析及控制方法研究 [J]. 机械科学与技术, 2013, 32(10): 1451–1455.DU Juan, LI Zhanjie, GONG Hu, et al. Study on the mechanisms and control method of edge chipping fracture in the machining of brittle and hard materials [J]. Mechanical Science and Technology for Aerospace Engineering, 2013, 32(10): 1451-1455.
[4] 蔡克新, 曹力宁. LCD玻璃划切机控制系统设计 [J]. 电子工艺技术, 2013, 34(3): 170–173.CAI Kexin, CAO Lining. Control system design of LCD glass incising machine [J]. Electronics Process Technology, 2013, 34(3): 170-173.
[5] 耿其东, 李春燕. 磁力研磨加工K9光学玻璃的实验研究 [J]. 表面技术, 2018, 47(7): 112–118.GENG Qidong, LI Chunyan. Experimental study on magnetic abrasive finishing K9 optical glass [J]. Surface Technology, 2018, 47(7): 112-118.
[6] 肖强, 朱育权, 王丽君. ELID磨削试验电解参数对光学玻璃表面质量的影响研究 [J]. 表面技术, 2006(2): 24–26.XIAO Qiang, ZHU Yuquan, WANG Lijun. Study on the effect of electrolytic parameter of the ELID grinding expermient on surface quality of optical glass [J]. Surface Technology, 2006(2): 24-26.
[7] 甄万财. 砂轮划片机划切技术的研究 [J]. 电子工业专用设备, 2004(9): 68–71.ZHEN Wancai. A research on dicing technology of wheel wafer dicer [J]. Equipment for Electronic Products Manufacturing, 2004(9): 68-71.
[8] SCOTT C G, DANYLUK S. Examination of silicon wear debris generated in a linear scratch test [J]. Wear, 1992, 52(1) : 183-185.
[9] 姜峰, 李剑锋, 孙杰, 等. 硬脆材料塑性加工技术的研究现状 [J]. 工具技术, 2007, 41(8): 5–10.JIANG Feng, LI Jianfeng, SUN Jie, et al. Research actualities of ductile machining for hard and brittle materials [J]. Tool Engineering, 2007, 41(8): 5-10.
[10] 张伟, 贾月明. 晶圆划切工艺与优化 [J]. 电子工业专用设备, 2012(4): 7–12.ZHANG Wei, JIA Yueming. Technics and optimization of wafer dicing [J]. Equipment for Electronic Products Manufacturing, 2012(4): 7-12.
[11] 倪皓, 宫虎, 房丰洲. 旋转超声加工硬脆性材料中边缘破损的研究 [J]. 航空精密制造技术, 2009, 45(5): 8–10.NI Hao, GONG Hu, FANG Fengzhou. Study on edge-chipping of brittle and hard materials in rotary ultrasonic machining [J]. Aviation Precision Manufacturing Technology, 2009, 45(5): 8-10.
[12] 王守发, 高身杰. 优化砂轮性能提高磨削质量 [J]. 经济技术协作信息, 2011(20): 103.WANG Shoufa, GAO Shenjie. Optimizing the performance of grinding wheel and improving grinding quality [J]. Economic and Technological Collaboration Information, 2011(20): 103.
[13] LIN J W, CHENG M H. Investigation of chipping and wear of silicon wafer dicing [J]. Journal of Manufacturing Processes, 2014, 16(3): 373-378.
[14] 文赟, 王克江, 孙敏, 等. 浅析砂轮划片机划切工艺 [J]. 电子工业专用设备, 2010, 39(6): 21–26.WEN Yun, WANG Kejiang, SUN Min, et al. Shallow analysis on the technics of grinding wheel dicing saw [J]. Equipment for Electronic Products Manufacturing, 2010, 39(6): 21-26.