晶圆切割崩裂的成因和预防措施探讨
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摘要
随着电子技术的发展,对集成电路封装工艺的要求越来越高。封装核心工序中划片工序造成的晶圆崩裂问题是一个工艺难点,也是制约封装行业发展的瓶颈之一。本文主要对晶圆崩裂的机理进行了分析,探讨了晶圆切割过程中影响其崩裂的各关键因素,从而针对性的提出了预防晶圆崩裂的有效方法。
With the development of electronic technology, the packaging technology of integrated circuit is required to be more and more advanced. The wafer crack problems caused by dicing during the core package process is a technical difficulty, and it is also one of the bottlenecks of controlling the development of packaging industry. In this paper, the mechanism of wafer crack is analyzed, the key parameters of effecting the crack during the wafer cutting process are investigated, and the methods of preventing from wafer cracking are put forward.
With the development of electronic technology, the packaging technology of integrated circuit is required to be more and more advanced. The wafer crack problems caused by dicing during the core package process is a technical difficulty, and it is also one of the bottlenecks of controlling the development of packaging industry. In this paper, the mechanism of wafer crack is analyzed, the key parameters of effecting the crack during the wafer cutting process are investigated, and the methods of preventing from wafer cracking are put forward.
引文
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[2]龚平.晶圆切割中背面崩裂问题的分析[J].电子与封装,2008,8(7):1-5.
[3]赵奕,周明,董申.脆性材料塑性域超精密加工的研究现状[J].高技术通讯,1999(4):59-62.
[4]庞零.硅芯片封装中改善芯片崩裂的划片工艺[J].苏州市职业大学学报,2011,22(1):36-39.