超高速旋转金刚石划片刀制造工艺的研究
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摘要
刀具在进行超高速切削工件时,刀具结构上及切削参数的变化会对工件的质量产生很大的影响。在超高速切削机床上用其进行切削实验,对切削硅晶片的划片刀的车削工艺、电镀工艺和后续加工工艺进行研究,利用改变切削参数中的走刀速度,并对切削之后的工件切缝宽度进行测量,得出切缝宽度与走刀速度关系,得出优化的切削参数。
When ultra-high-speed cutting tool during the work,the quality of the tool structure and cutting parameters change will have a huge impact on the workpiece,the paper turning process silicon wafer cutting blade stroke,the plating process and follow-up process are discussed by in its ultra-high speed cutting machine for cutting experiment by changing the cutting parameters cutting speed,and cutting the workpiece after the kerf width measurements,obtained kerf width with cutting speed diagram,drawn optimized cutting parameters.
When ultra-high-speed cutting tool during the work,the quality of the tool structure and cutting parameters change will have a huge impact on the workpiece,the paper turning process silicon wafer cutting blade stroke,the plating process and follow-up process are discussed by in its ultra-high speed cutting machine for cutting experiment by changing the cutting parameters cutting speed,and cutting the workpiece after the kerf width measurements,obtained kerf width with cutting speed diagram,drawn optimized cutting parameters.
引文
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[2]方莉俐,张洋,刘士国.电铸超薄金刚石刀具的研制及应用[J].人工晶体学报,2011,40(3):610-623.FANG Lili,ZHANG Yang,LIU Shiguo.Fabrication and application of diamond super-thin cutting blade by electrotyping method[J].Journal of Synthetic Crystals,2011,40(3):610-623.
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[4]张银霞.单晶硅片超精密磨削加工表面层损伤的研究[D].大连:大连理工大学,2006.ZHANG Yinxia.Study on the surfacelayer damage of monocrystalline silicon wafer induced by ultra-precision grinding[D].Dalian:Dalian University of Technology,2006.