片状银粉的制备及在电子浆料中的应用研究进展
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摘要
近年来,随着电子和信息的高速发展,对电子浆料的性能要求越来越高。导电填料作为导电浆料的重要组成部分,决定了浆料的性能。本文介绍了有着广泛应用的金属系导电填料——银粉,概述了银粉的尺寸和形貌对导电浆料的影响,阐述了不同制备方法获得的片状银粉对电子浆料性能的影响,并探讨了存在的问题。
In recent years,with the rapid development of electronics and information technology,demand on the electronic pastes properties is more and more urgent.Conductive fillers are one of the most important components,which define the properties of electronic pastes.In this paper,the metal series conductive filler-sliver powder was generally introduced,and the effects of size and morphology of sliver powder on electronic pastes were outlined.Meanwhile,the influence of flake sliver powder prepared with different methods on the properties of electronic pastes was introduced,and the existing problems were discussed.
In recent years,with the rapid development of electronics and information technology,demand on the electronic pastes properties is more and more urgent.Conductive fillers are one of the most important components,which define the properties of electronic pastes.In this paper,the metal series conductive filler-sliver powder was generally introduced,and the effects of size and morphology of sliver powder on electronic pastes were outlined.Meanwhile,the influence of flake sliver powder prepared with different methods on the properties of electronic pastes was introduced,and the existing problems were discussed.
引文
1徐磊,张宏亮,刘显杰.电子浆料研究进展[J].船电技术,2012,32(z2):141.
2 马晓旭,魏先福,黄蓓青,等.导电性填料对电热膜用导电油墨性能的影响[J].北京印刷学院学报,2011,19(2):16.
3 肖爽,堵永国,刘其城,等.碳系导电油墨中功能相对油墨性能的影响[J].电工材料,2013(1):27.
4 甘卫平,潘巧赟,周建.有机载体及烧结工艺对银浆料导电性能的影响[J].矿冶工程,2014(2):118.
5 李三虎.目前世界微电子技术发展的两种价值取向[J].探求,1996(1):28.
6 孟新昊.用于电子工业的超细银粉与导电银浆的制备及研究[D].上海:复旦大学,2011.
7 郝海娟.镀银类导电粉体填料的应用领域和技术现状综述[J].化工新型材料,2014(1):164.
8 杨劲,王文龙,大比特.国内外导电银粉、银浆、导电胶市场状况分析[C]∥中国电子学会敏感技术分会第十六届电压敏学术年会.广州,2013.
9 Zhang S S,Zhang Y J,Wang H W.Effect of particle size distributions on the rheology of Sn/Ag/Cu lead-free solder pastes[J].Mater Des,2010,31(1):594.
10 Zhang Y,Qi S,Wu X,et al.Electrically conductive adhesive based on acrylate resin filled with silver plating graphite nanosheet[J].Synth Met,2011,161(5):516.
11 Amoli B M,Gumfekar S,Hu A,et al.Thiocarboxylate functionalization of silver nanoparticles:Effect of chain length on the electrical conductivity of nanoparticles and their polymer composites[J].J Mater Chem,2012,22(37):20048.
12 Szalapak J,Gados A,Kielbasinski K,et al.Nanosilver sintered joints on elastic substrates[C]∥ISSE International Spring Seminar in Electronics Technology Netherlands,2014:104.
13 闫方存,滕媛,严继康,等.片状银粉对太阳能电池银浆料电性能影响研究[J].功能材料与器件学报,2015(4):31.
14 赵德强,马立斌,杨君,等.银粉及电子浆料产品的现状及趋势[J].电子元件与材料,2005,24(6):54.
15 谢燕青.纳米银导电浆料制备技术及性能研究[D].武汉:华中科技大学,2008.
16 秦云川,齐暑华,杨永清,等.提高导电胶性能的研究进展[J].中国胶粘剂,2011,20(9):53.
17 杨桂生,陈步明,郭忠诚.低松比片状银粉低温聚合物导体浆料的研究[C]//2011中国西南四省市表面工程技术交流会.成都,2011.
18 Durairaj R,Leong K C.Effect of silver flakes and particle shape on the steady shear viscosity of isotropic conductive adhesives[J].J Test Evaluat,2015,43(6):20130084.
19 谢湘洲,刘心宇,袁昌来.银粉粒径及形貌搭配对无铅导体浆料性能的影响[J].稀有金属材料与工程,2015(12):3113.
20 代凯,张志浩,方建慧,等.添加短棒状纳米银粉的导电胶及其制备方法[J].黄金科学技术,2010(2):81.
21 熊娜娜,王悦辉,李晶泽.纳米银填充导电浆料的研究进展[J].稀有金属材料与工程,2015(10):2589.
22 赵斌,张国庆.超细银粉在导电涂料中的应用[J].涂料技术,2000(1):40.
23 Efremov M Y,Schiettekatte F,Zhang M,et al.Discrete periodic melting point observations for nanostructure ensembles[J].Phys Rev Lett,2000,85(17):3560.
24 Seo D S,Park S H,Lee J K.Sinterability and conductivity of silver paste with Pb-free frit[J].Current Appl Phys,2009,9(1):S72.
25 Albert A D,Becker M F,Keto J W,et al.Low temperature,pressure-assisted sintering of nanoparticulate silver films[J].Acta Mater,2008,56(8):1820.
26 Bai J G,Zhang Z Z,Calata J N,et al.Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material[J].IEEE Trans Components Packaging Technol,2006,29(3):589.
27 Lee H H,Chou K S,Shih Z W.Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives[J].Int J Adhes Adhes,2005,25(5):437.
28 Jiang H,Moon K S,Lu J,et al.Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization[J].J Electron Mater,2005,34(11):1432.
29 Zhang R,Lin W,Moon K S,et al.Fast preparation of printable highly conductive polymer nanocomposites by thermal decomposition of silver carboxylate and sintering of silver nanoparticles[J].ACS Appl Mater Interf,2010,2(9):2637.
30 董春法,张祥林,付锐平,等.纳米银及其导电浆料的制备与研究[J].电子元件与材料,2013,32(9):30.
31 丁星兆,柳襄怀.纳米材料的结构,性能及应用[J].材料导报,1997,11(4):1.
32 甘卫平,陈迎龙,郭桂全,等.以甲基纤维素作分散剂制备高分散超细银粉[J].粉末冶金材料科学与工程,2012,17(4):522.
33 梁焕珍,金东镇,喻克宁,等.六方片状银粉的合成[J].粉末冶金技术,2003,21(4):218.
34 张磊,甘国友,严继康,等.高能球磨法制备片状银粉的研究[C]∥中国材料研讨会论文集.长沙,2010.
35 林辰,太阳能电池浆料用片状银粉的制备[J].科技创新与应用,2015(5):9.
36 周云,张彦伟,王晶晶,等.一种太阳能电池背面银浆用不规则片状银粉的制备方法:中国,201410839022[P].2015-04-01
37 卫平,甘梅,刘妍.高能球磨对片状银粉的改性研究[J].材料导报,2007,21(F05):325.
38 刘永庆.导电银浆银的迁移及预防[J].丝网印刷,2005(11):19.
39 陈德山.薄膜开关银迁移及其预防[J].丝网印刷,2006(3):14.
40 施昌快,梁诗宇,朱晓云.光诱导还原法制备片状银粉的研究[J].稀有金属,2015,39(6):533.
41 Túlio C R R,Herbert W,Eduard W,et al.Formation kinetics of silver triangular nanoplates[J].J Phys Chem C,2003,111(7):2885.
42 Yoreo J J D,Dove P M.Shaping crystals with biomolecules[J].Science,2004,306(5700):1301.
43 Yang Jianhui,Lu Lehui,Wang Haishui,et al.Glycyl glycine templating synthesis of single-crystal silver nanoplates[J].Cryst Growth Des,2006,6(9):2155.
44 Jin R C,Cao Y W,et al.Photoinduced conversion of silver nanospheres to nanoprisms[J].Science,2001,294(5548):1901.
45 Zhou Q F,Bao J C,Xu Z.Shape-controlled synthesis of nanostructured gold by aprotection-reduction technique[J].J Mater Chem,2002,12(2):384.
46 刘江,宋永辉,兰新哲.片状银粉的制备研究[J].有色金属工程,2002,54(z1):64.
47 Zhou Quanfa,Li Feng,Zhu Wen.Photoinduced reduction for preparing flake nanosilver[J].Precious Metals,2003,24(1):35.
48 Washio I,Xiong Y J,Yin Y D.Reduction by the end groups of poly(vinyl pyrrolidone):A new and versatile route to the kinetically controlled synthesis of Ag triangular nanoplates[J].Adv Mater,2006,18(13):1745.
49 李芝华,王炎伟,卢健体.片状纳米银粉的化学制备技术研究进展[J].化工学报,2009,60(6):1351.
50 刘江,宋永辉,兰新哲.片状银粉的制备研究[J].有色金属工程,2002,54(z1):64.
51 Zhai Aixia,Cai Xionghui,Du Bin.A novel wet-chemical method for preparation of silver flakes[J].Trans Nonferrous Met Soc China,2014,24(5):1452.
52 陈海波,曹镛,彭俊彪,等.一种环境友好的微米级三角形银片的制备方法:中国,201110051486[P].2012-12-26
53 莫博,阚彩侠,柯善林.物理化学学报[J].银纳米片的研究进展,2012,28(11):2511.
54 Tang Bin,Xu Shuping,An Jing,et al.Photoinduced shape conversion and reconstruction of silver nanoprisms[J].J Phys Chem C,2009,113(17):7025.
55 Yang Guangwu,Li Hulin.Sonochemical synthesis of highly monodispersed and size controllable Ag nanoparticles in ethanol solution[J].Mater Lett,2008,62(14):2189.
56 欧毓迎.电路板硫化失效的研究[J].日用电器,2014(5):43.
57 陈志波.超细银粉的制备及低温固化银浆固化工艺的研究[D].长沙:中南大学,2012.
2 马晓旭,魏先福,黄蓓青,等.导电性填料对电热膜用导电油墨性能的影响[J].北京印刷学院学报,2011,19(2):16.
3 肖爽,堵永国,刘其城,等.碳系导电油墨中功能相对油墨性能的影响[J].电工材料,2013(1):27.
4 甘卫平,潘巧赟,周建.有机载体及烧结工艺对银浆料导电性能的影响[J].矿冶工程,2014(2):118.
5 李三虎.目前世界微电子技术发展的两种价值取向[J].探求,1996(1):28.
6 孟新昊.用于电子工业的超细银粉与导电银浆的制备及研究[D].上海:复旦大学,2011.
7 郝海娟.镀银类导电粉体填料的应用领域和技术现状综述[J].化工新型材料,2014(1):164.
8 杨劲,王文龙,大比特.国内外导电银粉、银浆、导电胶市场状况分析[C]∥中国电子学会敏感技术分会第十六届电压敏学术年会.广州,2013.
9 Zhang S S,Zhang Y J,Wang H W.Effect of particle size distributions on the rheology of Sn/Ag/Cu lead-free solder pastes[J].Mater Des,2010,31(1):594.
10 Zhang Y,Qi S,Wu X,et al.Electrically conductive adhesive based on acrylate resin filled with silver plating graphite nanosheet[J].Synth Met,2011,161(5):516.
11 Amoli B M,Gumfekar S,Hu A,et al.Thiocarboxylate functionalization of silver nanoparticles:Effect of chain length on the electrical conductivity of nanoparticles and their polymer composites[J].J Mater Chem,2012,22(37):20048.
12 Szalapak J,Gados A,Kielbasinski K,et al.Nanosilver sintered joints on elastic substrates[C]∥ISSE International Spring Seminar in Electronics Technology Netherlands,2014:104.
13 闫方存,滕媛,严继康,等.片状银粉对太阳能电池银浆料电性能影响研究[J].功能材料与器件学报,2015(4):31.
14 赵德强,马立斌,杨君,等.银粉及电子浆料产品的现状及趋势[J].电子元件与材料,2005,24(6):54.
15 谢燕青.纳米银导电浆料制备技术及性能研究[D].武汉:华中科技大学,2008.
16 秦云川,齐暑华,杨永清,等.提高导电胶性能的研究进展[J].中国胶粘剂,2011,20(9):53.
17 杨桂生,陈步明,郭忠诚.低松比片状银粉低温聚合物导体浆料的研究[C]//2011中国西南四省市表面工程技术交流会.成都,2011.
18 Durairaj R,Leong K C.Effect of silver flakes and particle shape on the steady shear viscosity of isotropic conductive adhesives[J].J Test Evaluat,2015,43(6):20130084.
19 谢湘洲,刘心宇,袁昌来.银粉粒径及形貌搭配对无铅导体浆料性能的影响[J].稀有金属材料与工程,2015(12):3113.
20 代凯,张志浩,方建慧,等.添加短棒状纳米银粉的导电胶及其制备方法[J].黄金科学技术,2010(2):81.
21 熊娜娜,王悦辉,李晶泽.纳米银填充导电浆料的研究进展[J].稀有金属材料与工程,2015(10):2589.
22 赵斌,张国庆.超细银粉在导电涂料中的应用[J].涂料技术,2000(1):40.
23 Efremov M Y,Schiettekatte F,Zhang M,et al.Discrete periodic melting point observations for nanostructure ensembles[J].Phys Rev Lett,2000,85(17):3560.
24 Seo D S,Park S H,Lee J K.Sinterability and conductivity of silver paste with Pb-free frit[J].Current Appl Phys,2009,9(1):S72.
25 Albert A D,Becker M F,Keto J W,et al.Low temperature,pressure-assisted sintering of nanoparticulate silver films[J].Acta Mater,2008,56(8):1820.
26 Bai J G,Zhang Z Z,Calata J N,et al.Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material[J].IEEE Trans Components Packaging Technol,2006,29(3):589.
27 Lee H H,Chou K S,Shih Z W.Effect of nano-sized silver particles on the resistivity of polymeric conductive adhesives[J].Int J Adhes Adhes,2005,25(5):437.
28 Jiang H,Moon K S,Lu J,et al.Conductivity enhancement of nano silver-filled conductive adhesives by particle surface functionalization[J].J Electron Mater,2005,34(11):1432.
29 Zhang R,Lin W,Moon K S,et al.Fast preparation of printable highly conductive polymer nanocomposites by thermal decomposition of silver carboxylate and sintering of silver nanoparticles[J].ACS Appl Mater Interf,2010,2(9):2637.
30 董春法,张祥林,付锐平,等.纳米银及其导电浆料的制备与研究[J].电子元件与材料,2013,32(9):30.
31 丁星兆,柳襄怀.纳米材料的结构,性能及应用[J].材料导报,1997,11(4):1.
32 甘卫平,陈迎龙,郭桂全,等.以甲基纤维素作分散剂制备高分散超细银粉[J].粉末冶金材料科学与工程,2012,17(4):522.
33 梁焕珍,金东镇,喻克宁,等.六方片状银粉的合成[J].粉末冶金技术,2003,21(4):218.
34 张磊,甘国友,严继康,等.高能球磨法制备片状银粉的研究[C]∥中国材料研讨会论文集.长沙,2010.
35 林辰,太阳能电池浆料用片状银粉的制备[J].科技创新与应用,2015(5):9.
36 周云,张彦伟,王晶晶,等.一种太阳能电池背面银浆用不规则片状银粉的制备方法:中国,201410839022[P].2015-04-01
37 卫平,甘梅,刘妍.高能球磨对片状银粉的改性研究[J].材料导报,2007,21(F05):325.
38 刘永庆.导电银浆银的迁移及预防[J].丝网印刷,2005(11):19.
39 陈德山.薄膜开关银迁移及其预防[J].丝网印刷,2006(3):14.
40 施昌快,梁诗宇,朱晓云.光诱导还原法制备片状银粉的研究[J].稀有金属,2015,39(6):533.
41 Túlio C R R,Herbert W,Eduard W,et al.Formation kinetics of silver triangular nanoplates[J].J Phys Chem C,2003,111(7):2885.
42 Yoreo J J D,Dove P M.Shaping crystals with biomolecules[J].Science,2004,306(5700):1301.
43 Yang Jianhui,Lu Lehui,Wang Haishui,et al.Glycyl glycine templating synthesis of single-crystal silver nanoplates[J].Cryst Growth Des,2006,6(9):2155.
44 Jin R C,Cao Y W,et al.Photoinduced conversion of silver nanospheres to nanoprisms[J].Science,2001,294(5548):1901.
45 Zhou Q F,Bao J C,Xu Z.Shape-controlled synthesis of nanostructured gold by aprotection-reduction technique[J].J Mater Chem,2002,12(2):384.
46 刘江,宋永辉,兰新哲.片状银粉的制备研究[J].有色金属工程,2002,54(z1):64.
47 Zhou Quanfa,Li Feng,Zhu Wen.Photoinduced reduction for preparing flake nanosilver[J].Precious Metals,2003,24(1):35.
48 Washio I,Xiong Y J,Yin Y D.Reduction by the end groups of poly(vinyl pyrrolidone):A new and versatile route to the kinetically controlled synthesis of Ag triangular nanoplates[J].Adv Mater,2006,18(13):1745.
49 李芝华,王炎伟,卢健体.片状纳米银粉的化学制备技术研究进展[J].化工学报,2009,60(6):1351.
50 刘江,宋永辉,兰新哲.片状银粉的制备研究[J].有色金属工程,2002,54(z1):64.
51 Zhai Aixia,Cai Xionghui,Du Bin.A novel wet-chemical method for preparation of silver flakes[J].Trans Nonferrous Met Soc China,2014,24(5):1452.
52 陈海波,曹镛,彭俊彪,等.一种环境友好的微米级三角形银片的制备方法:中国,201110051486[P].2012-12-26
53 莫博,阚彩侠,柯善林.物理化学学报[J].银纳米片的研究进展,2012,28(11):2511.
54 Tang Bin,Xu Shuping,An Jing,et al.Photoinduced shape conversion and reconstruction of silver nanoprisms[J].J Phys Chem C,2009,113(17):7025.
55 Yang Guangwu,Li Hulin.Sonochemical synthesis of highly monodispersed and size controllable Ag nanoparticles in ethanol solution[J].Mater Lett,2008,62(14):2189.
56 欧毓迎.电路板硫化失效的研究[J].日用电器,2014(5):43.
57 陈志波.超细银粉的制备及低温固化银浆固化工艺的研究[D].长沙:中南大学,2012.