银粉及银导电浆料制备技术的研究进展
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摘要
银导电浆料是发展电子元器件的基础之一,其制造技术的核心包括银粉的制备和银浆的调浆两部分。文章结合近年来银粉及银导电浆料领域文献及研究工作情况,综述了各形貌银粉的制备方法,且着重介绍了化学还原法;阐述了银浆的组成、制备方法以及各成分对浆料性能的影响;并提出了银导电环保浆料和复合浆料的发展趋势。
The silver conductive paste is one of the bases for developing electronic components,and the core manufacturing techniques of silver conductive paste includes preparation of silver powder and size mixing processing. Based on the literature and research work in the field of silver powder and silver conductive paste in recent years,the preparation methods of silver powder with different shapes are summarized,and the chemical reduction method is introduced emphatically. The composition of the silver paste,the preparation method and the influence of each component on the properties of the paste are described. And the development tendency of silver conductive environmental protection paste and composite paste are also put forward.
The silver conductive paste is one of the bases for developing electronic components,and the core manufacturing techniques of silver conductive paste includes preparation of silver powder and size mixing processing. Based on the literature and research work in the field of silver powder and silver conductive paste in recent years,the preparation methods of silver powder with different shapes are summarized,and the chemical reduction method is introduced emphatically. The composition of the silver paste,the preparation method and the influence of each component on the properties of the paste are described. And the development tendency of silver conductive environmental protection paste and composite paste are also put forward.
引文
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[36]闫方存,滕媛,严继康,等.片状银粉对太阳能电池银浆料电性能影响研究[J].功能材料与器件学报,2015,21(4):31-35.
[37]DURAIRAJ R,LEONG K C.Effect of silver flakes and particle shape on the steady shear viscosity of isotropic conductive adhesives[J].J Test Eval,2015,43(6):1288-1295.
[38]魏艳彪,曹秀华.片状银粉对烧结型银浆性能的影响[J].电子工艺技术,2013,34(3):142-173.
[39]王林.微电子工业用银浆导电填料的制备研究[D].成都:电子科技大学,2015.
[40]赵军.不同形貌Cu@Ag粉体的制备及其导电胶的研究[D].武汉:武汉理工大学,2012.
[41]甘卫平,周华,张金玲.无铅银浆烧结工艺与导电性能研究[J].电子元件与材料,2010,29(4):65-69.
[42]樊钊锋,刘君秀.低温PTC热敏电子元器件用无铅银电极浆料的制备方法:CN107068237A[P].2017-08-18.
[43]包卫锋,王斐.一种无铅环保银浆料及硅太阳能电池背面电极的形成方法:CN102222705A[P].2011-10-19.
[44]程耿,祝志勇,王强.低温固化银浆的制备[J].船电技术,2015,35(3):52-55.
[45]LIM C K,LEE Y S,CHOA S H,et al.Effect of polymer binder on the transparent conducting electrodes on stretchable film fabricated by screen printing of silver paste[J].Int J Polym Sci,2017,2017:1-6.
[46]罗世永,庞远燕,郝燕萍,等.电子浆料用有机载体的挥发性能[J].电子元件与材料,2006,25(8):49-51.
[47]赵敏敏,雷跃文.银浆料用有机载体的分散剂研究[J].材料导报,2013,27(S1):215-240.
[48]韩向超,张愿成,刘玉杰,等.有机载体对正面银浆印刷性能及电极形貌影响[J].电工材料,2017(3):11-.
[2]陆广广,宣天鹏.电子浆料的研究进展与发展趋势[J].金属功能材料,2008,15(1):48-52.
[3]冯清福,孟宪伟,李世鸿,等.导电填料对电子浆料性能影响的研究进展[J].贵金属,2017,38(2):79-84.
[4]李跃文,梁炳联,娄红涛,等.一种高温烧结银浆用银微粉制备方法:CN101972855B[P].2012-10-17.
[5]刘玲,王军.低温固化银浆固化效果的影响因素分析[J].世界有色金属,2016,8:173-175.
[6]杨华荣,夏风,杨华荣,等.一种水性铝银浆、其制备方法及其在油墨中的应用:CN106634061A[P].2017-05-10.
[7]郝晓光,周世平.一种中低温烧渗银电极浆料及其制备方法:CN107093491A[P].2017-08-25.
[8]天津大学,华南工学院合编.电子陶瓷[M].北京:国防工业出版社,1979.
[9]WANG D,MEI Y H,XIE H N,et al.Roles of palladium particles in enhancing the electrochemical migration resistance of sintered nano-silver paste as a bonding material[J].Mater Lett,2017,206(1):1-4.
[10]柳忠琪,刘春松,李代颖.电子浆料用银粉制备工艺综述[J].船电技术,2014,34(5):6-13.
[11]何发泉,李勇军.银粉的用途和制备[J].中国粉体技术,2001,7(3):45-47.
[12]滕媛,闫方存,李文琳,等.银浆用银粉制备工艺的综述[J].材料导报,2015,29(S1):172-175.
[13]唐鹿.还原剂和分散剂对银粉粒径及微观形貌影响的研究[J].材料导报,2015,29(S2):13-15.
[14]NISARATANAPORN E,WONGSUWAN K.Preparation of ultrafine silver powder using glycerol as reducing agent[J].J Met Mater Miner,2008,18(2):1-5.
[15]徐磊,刘显杰,程耿.电子浆料用超细银粉的制备[J].船电技术,2013,33(5):61-64.
[16]张健,吴贤,张晗亮,等.电子浆料用超细银粉的制备工艺研究[J].功能材料,2007,38:662-665.
[17]姚卿敏,张彩云.电子浆料用球形银粉的制备[J].电子工艺技术,2005,26(2):102-118.
[18]甘卫平,罗贱,郭桂全,等.化学还原法制备电子浆料用超细银粉[J].电子元件与材料,2010,29(11):15-18.
[19]陈志波.超细银粉的制备及低温固化银浆固化工艺的研究[D].长沙:中南大学,2012.
[20]郭学益,邓多,李宇,等.液相还原法制备微米级球形银粉及其分散机理[J].中国有色金属学报,2015,25(9):2484-2491.
[21]张小敏,雷艳惠,张振忠,等.超细银粉及导体浆料的制备及导电性能[J].真空科学与技术学报,2014,34(11):1257-1261.
[22]刘志宏,刘智勇,李启厚,等.喷雾热分解法制备超细银粉及其形貌控制[J].中国有色金属学报,2007,17(1):149-154.
[23]易宇,石靖,郭学益.溶液雾化焙烧法制备微米级球形银粉及其表征[J].金属材料与冶金工程,2015,43(1):15-23.
[24]OGIHARA T,KUBO T,ARITA S,et al.Production and characterization of silver powder created using highpressure water atomization[J].J Ceram Soc Jpn,2017,125(1):19-22.
[25]梁海春,容敏智,章明秋,等.微乳液法制备纳米银粒子的结构及其荧光现象研究[J].物理学报,2002,51(1):49-53.
[26]向奇志,吴燕,符嫦娥,等.反相微乳液法制备纳米银/羧甲基壳聚糖复合微粒[J].日用化学品科学,2017,40(3):27-31.
[27]王崇国,陈卫东.球料比对高密度片状银粉的影响[J].中国冶金,2015,25(8):15-17.
[28]琚伟,伊希斌,张晶,等.片状银粉行星球磨过程中的影响因素[J].中国粉体技术,2016,22(6):46-49.
[29]陈学刚,王军,张晓烨.低松装密度片状银粉制备的研究[J].世界有色金属,2016(11上):142-144.
[30]吴爱民,张路里.金属粉末置换法制备银粉试验研究[J].现代冶金,2012,40(2):16-18.
[31]施昌快,梁诗宇,朱晓云.光诱导还原法制备片状银粉的研究[J].稀有金属,2015,39(6):533-539.
[32]童文俊,丁秉钧,马晓妮,等.纳米银的置换反应制备及其表征[J].兵器材料科学与工程,2008,31(4):72-74.
[33]陈岁元,马利霞,刘常升,等.硝酸银溶液中Zn置换微细Ag粒子的激光辐照银制备法[J].东北大学学报(自然科学版),2005,26(6):550-553.
[34]FADDOUL R,REVERDYBRUAS N,BOUREL J.Silver content effect on rheological and electrical properties of silver pastes[J].J Mater Sci:Mater Electron,2012,23:1415-1426.
[35]潘中海,司荣美,刘彩风.一种纳米银浆的制备方法:CN106531348A[P].2017-03-22.
[36]闫方存,滕媛,严继康,等.片状银粉对太阳能电池银浆料电性能影响研究[J].功能材料与器件学报,2015,21(4):31-35.
[37]DURAIRAJ R,LEONG K C.Effect of silver flakes and particle shape on the steady shear viscosity of isotropic conductive adhesives[J].J Test Eval,2015,43(6):1288-1295.
[38]魏艳彪,曹秀华.片状银粉对烧结型银浆性能的影响[J].电子工艺技术,2013,34(3):142-173.
[39]王林.微电子工业用银浆导电填料的制备研究[D].成都:电子科技大学,2015.
[40]赵军.不同形貌Cu@Ag粉体的制备及其导电胶的研究[D].武汉:武汉理工大学,2012.
[41]甘卫平,周华,张金玲.无铅银浆烧结工艺与导电性能研究[J].电子元件与材料,2010,29(4):65-69.
[42]樊钊锋,刘君秀.低温PTC热敏电子元器件用无铅银电极浆料的制备方法:CN107068237A[P].2017-08-18.
[43]包卫锋,王斐.一种无铅环保银浆料及硅太阳能电池背面电极的形成方法:CN102222705A[P].2011-10-19.
[44]程耿,祝志勇,王强.低温固化银浆的制备[J].船电技术,2015,35(3):52-55.
[45]LIM C K,LEE Y S,CHOA S H,et al.Effect of polymer binder on the transparent conducting electrodes on stretchable film fabricated by screen printing of silver paste[J].Int J Polym Sci,2017,2017:1-6.
[46]罗世永,庞远燕,郝燕萍,等.电子浆料用有机载体的挥发性能[J].电子元件与材料,2006,25(8):49-51.
[47]赵敏敏,雷跃文.银浆料用有机载体的分散剂研究[J].材料导报,2013,27(S1):215-240.
[48]韩向超,张愿成,刘玉杰,等.有机载体对正面银浆印刷性能及电极形貌影响[J].电工材料,2017(3):11-.