石墨烯对微胶囊铜电子浆料导电性能的影响
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摘要
以丙烯酸树脂作为微胶囊壁材溶液包覆铜粉,石墨烯作为导电增强相,制备了石墨烯-微胶囊铜复合电子浆料。利用金属电导率测试仪、X射线衍射仪、四探针测试仪和扫描电子显微镜分别研究了微胶囊铜粉的电导率及其抗氧化性能,分析了石墨烯对石墨烯-微胶囊铜复合电子浆料导电性能的影响。结果表明:微胶囊铜粉与未包覆铜粉相比,电导率明显提高,且当增重率为4%(wt,质量分数)时,电导率达到最大值41.30%IACS,且不存在CuO或Cu_2O;石墨烯的加入对铜复合电子浆料的导电性能有增强作用,但不同类型石墨烯的增强效果不同,导电性能主要与石墨烯的片径、厚度、纯度相关,其中片径约5μm,厚度为1～5nm的石墨烯纳米片作为导电增强相制备的铜复合电子浆料导电性能最优。
Acrylic resin was chosen as a microcapsule wall material to coat the copper powders,graphene was as an enhanced phase to prepare copper electronic paste.The conductivity and oxidation resistance of microencapsulated copper powders were investigated by metal conductivity tester,XRD diffractometer,four-probe tester and scanning electron microscope(SEM),the effect of graphene on the electrical conductivity of copper composite paste was analyzed.Results showed that compared with the uncoated copper powders,the conductivity of microencapsulated copper powders was obviously increased.When the weight gain rate was 4 wt%,the conductivity reached the maximum value of 41.30%IACS and there were no CuO or Cu_2O.The addition of graphene had enhance effect on paste,but the enhancement effect of variety of graphene was different.Electrical conductivity was mainly related to the size,thickness,purity of graphene.Graphene with about 5μm size and 1～5 nm thickness was used to prepare copper composite paste,in which the conductivity was best.
Acrylic resin was chosen as a microcapsule wall material to coat the copper powders,graphene was as an enhanced phase to prepare copper electronic paste.The conductivity and oxidation resistance of microencapsulated copper powders were investigated by metal conductivity tester,XRD diffractometer,four-probe tester and scanning electron microscope(SEM),the effect of graphene on the electrical conductivity of copper composite paste was analyzed.Results showed that compared with the uncoated copper powders,the conductivity of microencapsulated copper powders was obviously increased.When the weight gain rate was 4 wt%,the conductivity reached the maximum value of 41.30%IACS and there were no CuO or Cu_2O.The addition of graphene had enhance effect on paste,but the enhancement effect of variety of graphene was different.Electrical conductivity was mainly related to the size,thickness,purity of graphene.Graphene with about 5μm size and 1～5 nm thickness was used to prepare copper composite paste,in which the conductivity was best.
引文
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[2]张飞进,朱晓云.电子浆料用有机载体的研究现状及发展趋势[J].材料导报A(综述篇),2013,27(2):81-85.
[3]王艳萍,苏晓磊,屈银虎,等.铜电子浆料的制备及性能[J].材料科学与工程学报,2015,33(6):908-911.
[4]Manabu Yoshida,Hideo Tokuhisa,Uichi Itoh,et al.Novel low-temperature-sintering type Cu-Alloy pastes for silicon solar sells[J].Energy Procedia,2012,21:66-74.
[5]Wu Songping,Meng Shuyuan.Preparation of micron size copper powder with chemical reduction method[J].Materials Letters,2006,60(20):2438-2442.
[6]刘晓琴,苏晓磊.铜电子浆料的研究发展现状[J].硅酸盐通报,2013,32(12):2502-2507.
[7]刘新峰,屈银虎,郑红梅,等.铜电子浆料的抗氧化研究和进展[J].应用化工,2014,43(8):1493-1496.
[8]李冰,王俊勃,苏晓磊,等.电子浆料中的贱金属导电相的改善工艺研究进展[J].材料导报,2013,27(11):35-39.
[9]常英,刘彦军.片状镀银铜粉的制备及性能表征[J].化工新型材料,2005,33(4):56-58.
[10]Fu Q,Bao X H.Progress in graphene chemistry[J].Chinese Sci Bull(Chinese Ver),2009,54(18):2657-2666.
[11]彭舒,唐振方,吉锐.电子浆料中微米级铜粉的抗氧化研究[J].表面技术,2008,37(3):6-8.
[12]罗艳,周康根,肖妍艳.导电浆料用铜粉的表面改性及其性能[J].材料与冶金学报,2006,5(2):119-124.
[13]Zhong J H,Li Z H,Ouyang L Y.Study on the anti-oxidant property of copper powder coated silane coupling agent in isotropically conductive adhesives[J].Advanced Materials Research,2010,139-141:117-120.
[14]Dubey R,Shami T C,Rao B.Microencapsulation technology and applications[J].Defence Science Journal,2009,59(1):82-95.
[15]王翔,屈银虎,成小乐,等.高温烧结型铜电子浆料的导电性[J].西安工程大学学报,2017,31(1):113-118.
[16]孙文通.贱金属电子浆料导电机理研究[J].电子元件与材料,1997,16(3):16-21.
[17]徐磊,张宏亮,刘显杰.电子浆料研究进展[J].船电技术,2012,32(S1):141-146.