笼型倍半硅氧烷(POSS)的官能化、杂化以及在改性环氧树脂中应用研究进展
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  • 英文篇名:Progress in functionalization,hybridization of polyhedral oligomeric silsesquioxanes(POSS) and its application in modified epoxy resin
  • 作者:杨胜 ; 陈珂龙 ; 王智勇 ; 张桐 ; 崔溢
  • 英文作者:YANG Sheng;CHEN Kelong;WANG Zhiyong;ZHANG Tong;CUI Yi;AECC Beijing Institute of Aeronautical Materials;Key Laboratory of Science and Technology on Stealth Materials,AECC Beijing Institute of Aeronautical Materials;
  • 关键词:笼型倍半硅氧烷(POSS) ; 官能化 ; 改性 ; 环氧树脂
  • 英文关键词:polyhedral oligomeric silsesquioxanes(POSS);;functionalization;;modification;;epoxy resin
  • 中文刊名:HKCB
  • 英文刊名:Journal of Aeronautical Materials
  • 机构:中国航发北京航空材料研究院;中国航发北京航空材料研究院隐身材料重点实验室;
  • 出版日期:2019-06-01
  • 出版单位:航空材料学报
  • 年:2019
  • 期:v.39
  • 语种:中文;
  • 页:HKCB201903003
  • 页数:15
  • CN:03
  • ISSN:11-3159/V
  • 分类号:14-28
摘要
笼型倍半硅氧烷(polyhedral oligomeric silsesquioxane,POSS)具有独特的结构和良好的耐热性,对POSS进行官能化后可得到高性能的新型有机-无机杂化材料,在很多领域具有潜在应用价值。本文综述了POSS的合成、官能化的相关问题。POSS的种类很多应用范围广泛,但是价格相对昂贵,限制了POSS在许多领域内的发展规模;POSS可作为环氧树脂的改性剂,具有明显的增强、增韧效果,并显著提高固化环氧树脂的耐热性能,但是由于POSS的纳米尺寸效应,导致其在树脂中的添加量有限。未来随着POSS合成成本的降低、改性树脂手段的不断进步,POSS在热固性树脂改性领域应用范围必将不断扩大。
        Polyhedral oligomeric silsesquioxanes(POSS) has a unique structure and good heat resistance.After the functionalization of POSS,a new type of organic-inorganic hybrid material with high performance can be obtained,which has potential application value in many fields.This paper reviews the related issues of the synthesis and functionalization of POSS.Many types of POSS are widely used,but the relatively expensive price limits the development scale of POSS in many fields.POSS can be used as the modifier of epoxy resin,which has obvious strengthening and toughening effects,and significantly improves the heat resistance of cured epoxy resin.However,due to the nanometer size effect of POSS,the addition amount of POSS in the resin is limited.In the future,with the cost reduction of POSS synthesis and the continuous improvement of the means to modify the resin,the application scope of POSS in the modification field of thermosetting resin will be expanded.
引文
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