糖精钠对脉冲电沉积Ni-Sn-Mn合金镀层性能的影响
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  • 英文篇名:Effect of Saccharin Sodium on Properties of Ni-Sn-Mn Alloy Coatings Prepared by Pulse Electrodeposition
  • 作者:孟庆波 ; 齐海东 ; 卢帅 ; 郭昭 ; 杨海丽
  • 英文作者:MENG Qingbo;QI Haidong;LU Shuai;GUO Zhao;YANG Haili;Key Laboratory of the Ministry of Education for Modern Metallurgy Technology,North China University of Science and Technology;
  • 关键词:糖精钠 ; 脉冲电沉积 ; Ni-Sn-Mn合金镀层 ; 耐蚀性
  • 英文关键词:saccharin sodium;;pulse electrodeposition;;Ni-Sn-Mn alloy coating;;corrosion resistance
  • 中文刊名:DDHB
  • 英文刊名:Electroplating & Pollution Control
  • 机构:华北理工大学现代冶金技术教育部重点实验室;
  • 出版日期:2019-01-30
  • 出版单位:电镀与环保
  • 年:2019
  • 期:v.39;No.225
  • 基金:国家自然科学基金资助项目(编号:51474088);; 华北理工大学研究生创新项目(编号:2017S13)
  • 语种:中文;
  • 页:DDHB201901015
  • 页数:5
  • CN:01
  • ISSN:31-1507/X
  • 分类号:45-49
摘要
采用脉冲电沉积法在Q235钢表面制备了Ni-Sn-Mn合金镀层,并研究了糖精钠的质量浓度对镀层的成分、沉积速率、表面形貌及耐蚀性的影响。结果表明:随着糖精钠的质量浓度的增加,阴极极化曲线负移,阴极极化作用增强;镀层中Ni和Sn的质量分数降低,而Mn的质量分数升高;沉积速率和阴极电流效率均减小;镀层的耐蚀性先增强后减弱。当糖精钠的质量浓度为3g/L时,制备的Ni-Sn-Mn合金镀层均匀致密,在3.5%的NaCl溶液中具有最正的自腐蚀电位、最低的自腐蚀电流密度和最大的电荷转移电阻,耐蚀性最好。
        Ni-Sn-Mn alloy coatings were prepared on the surface of Q235 steel by pulse electrodeposition,and the effect of mass concentration of saccharin sodium on the composition,deposition rate,surface morphology and corrosion resistance of the coatings was investigated.The results showed that with the increasing of mass concentration of saccharin sodium,the cathodic polarization curve moved towards the negative direction,and cathode polarization effect was enhanced.The mass fraction of Ni and Sn decreased,while the mass fraction of Mn increased.The deposition rate and cathode current efficiency were both decreased.Corrosion resistance of the coatings was enhanced firstly and then weakened.The Ni-Sn-Mn alloy coating prepared at mass concentration of saccharin sodium of 3g/L was uniform and compact,and exhibited the best corrosion resistance in 3.5% NaCl solution,it has the most positive selfcorrosion potential,the smallest self-corrosion current density and the biggest charge transfer resistance.
引文
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