单晶锗脆塑转变纳米划痕实验研究
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摘要
为控制单晶锗脆塑转变临界状态,基于公式对单晶锗脆塑转变时的临界载荷进行了预测,采用纳米压痕仪对单晶锗(110)晶面进行了变载荷纳米划痕实验和恒定载荷纳米划痕实验,分析得到单晶锗(110)晶面发生脆塑转变时的临界状态,并借助原子力显微镜(AFM)对实验表面进行扫描表征。结果表明,单晶锗(110)晶面在变载荷纳米划痕实验下发生脆塑转变的临界载荷和临界深度分别为41.4mN、623nm;单晶锗(110)晶面在恒定载荷纳米划痕实验下发生脆塑转变的临界载荷和临界深度分别为30～50mN、500～900nm,验证了变载荷纳米划痕实验结果的正确性。根据变载荷纳米划痕实验结果修正了单晶锗(110)晶面在固定实验参数下发生脆塑转变临界深度理论计算公式,为分析单晶锗微纳米尺度塑性域切削提供数据支持。
In order to control the critical state of brittle-plastic transition of single crystal germanium.The critical load of brittle-plastic transition of single crystal germanium is predicted based on the formula.Variable load and constant load nano-scratch experiments on Ge(110)are performed by using a nano indentation device,and the critical state of brittle-plastic transition of Ge(110)is obtained.Moreover,the experimental surfaces is scanned by using atomic force microscopy(AFM).The results show that:under the variable load nano-scratch experiment,the critical load for the brittle-plastic transition of Ge(110)is 41.4 mN,and the critical depth is 623 nm;Under the constant load nano-scratch experiment,critical load of the brittle-plastic transition of Ge(110)is 30 to 50 mN,and the critical depth is 500 to 900 nm,which verifies the correctness of the experimental results of variable load scratches.According to the results of variable load nano-scratch experiment,the theoretical formula for the critical depth of brittle-plastic transition of Ge(110)is revised under fixed experimental parameters,which provides data support for the analysis of single-crystal germanium microscale plastic field cutting.
In order to control the critical state of brittle-plastic transition of single crystal germanium.The critical load of brittle-plastic transition of single crystal germanium is predicted based on the formula.Variable load and constant load nano-scratch experiments on Ge(110)are performed by using a nano indentation device,and the critical state of brittle-plastic transition of Ge(110)is obtained.Moreover,the experimental surfaces is scanned by using atomic force microscopy(AFM).The results show that:under the variable load nano-scratch experiment,the critical load for the brittle-plastic transition of Ge(110)is 41.4 mN,and the critical depth is 623 nm;Under the constant load nano-scratch experiment,critical load of the brittle-plastic transition of Ge(110)is 30 to 50 mN,and the critical depth is 500 to 900 nm,which verifies the correctness of the experimental results of variable load scratches.According to the results of variable load nano-scratch experiment,the theoretical formula for the critical depth of brittle-plastic transition of Ge(110)is revised under fixed experimental parameters,which provides data support for the analysis of single-crystal germanium microscale plastic field cutting.
引文
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[2]张文涛,毛杰伟,刘文浩.基于分子动力学单晶锗的切削特性分析[J].工具技术,2012,46(9):54-57.ZHANG Wentao,MAO Jiewei,LIU Wenhao.Analysis of cutting characteristics of Ge based on molecular dynamics[J].Tool Technology,2012,46(9):54-57.
[3]BHUSHAN B.Nanoscale tribophysics and tribomechanics[J].Wear,1999,225/229(4):465-492.
[4]张治国.单晶材料纳米级切削机理的研究[D].天津:天津大学,2009.ZHANG Zhiguo.Single-crystal material nano-cutting mechanism[D].Tianjin:Tianjin University,2009.
[5]LANDMAN U,LUEDTKE W D,BURNHAM N A,et al.Atomistic mechanisms and dynamics of adhesion,nanoindentation,and fracture[J].Science,1990,248(4954):454-461.
[6]MIN L,ZHANG X,FANG F.Nanoindentation-induced phase transformation and structural deformation of monocrystalline germanium:a molecular dynamics simulation investigation[J].Nanoscale Research Letters,2013,8(1):353-361.
[7]ARIF M,RAHMAN M,SAN W Y.Ultraprecision ductile mode machining of glass by micromilling process[J].Journal of Manufacturing Processes,2011,13(1):50-59.
[8]王景贺,李顺增,宋晓莉,等.基于纳米压痕疲劳实验的微晶玻璃脆塑转变研究[J].光学学报,2013,33(9):243-248.WANG Jinghe,LI Shunzheng,SONG Xiaoli,et al.Study on brittle plastic transition of glass ceramics based on nano-indentation fatigue test[J].Journal of Optics,2013,33(9):251-256.
[9]HAN X S,YUANZHONG H U.Analysis micromechanism of burrs formation in the case of nanometric cutting process using numerical simulation method[J].Chinese Science:Technical Science,2007,50(2):129-137.
[10]汪圣飞,安晨辉,张飞虎,等.基于纳米划痕实验和有限元仿真的KDP晶体断裂性能研究[J].人工晶体学报,2015,44(9):2325-2329.WANG Shengfei,AN Chenhui,ZHANG Feihu,et al.Study on fracture properties of KDP crystal[J].Journal of Synthetic Crystals,2015,44(9):2325-2329.
[11]卢泽生,王明海.硬脆光学晶体材料超精密切削理论研究综述[J].机械工程学报,2003,39(8):15-21.LU Zesheng,WANG Minghai.Review on the theory of ultra-precision cutting of hard and brittle optical crystals[J].Journal of Mechanical Engineering,2003,39(8):15-21.
[12]杨晓京,赵彪,李勇,等.利用纳米压痕法研究单晶锗的力学行为[J].热加工工艺,2016,45(16):80-83.YANG Xiaojing,ZHAO Biao,LI Yong,et al.Study on mechanical behavior of Ge by nanoindentation[J].Hot Working Technology,2016,45(16):80-83.
[13]王栋,冯平法,张承龙,等.KDP晶体各向异性对划痕特性影响的实验研究[J].人工晶体学报,2012,41(3):28-32.WANG Dong,FENG Pingfa,ZHANG Chenglong,et al.Experimental study of the influence of KDPcrystal anisotropy on scratch characteristics[J].Journal of Synthetic Optics,2012,41(3):28-32.
[14]王景贺,陈明君,董申,等.KDP晶体单点金刚石切削脆塑转变机理的研究[J].光电工程,2005,32(7):67-70.WANG Jinghe,CHEN Mingjun,DONG Shen,et al.KDP Study on brittle plastic transformation mechanism of single point diamond cutting[J].Opto-Electronics Engineering,2005,32(7):67-70.
[15]周明,李敏,杨志勇.光学玻璃塑性域切削试验研究[J].制造技术与机床,2008(8):9-12.ZHOU Ming,LI Min,YANG Zhiyong.Experimental study of plastic cutting in optical glass[J].Manufacturing Technology and Machine Tools,2008(8):9-12.
[16]MOSKOVIC R.Modelling of fracture toughness data in the ductile to brittle transition temperature region by statistical analysis[J].Engineering Fracture Mechanics,2002,69(4):511-530.