基于垂直互连技术的上下变频多芯片模块
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摘要
采用垂直互连技术研制了一种X波段上下变频多芯片模块,实现了微波单片集成电路和介质基板在三维微波互连结构中的平稳转换、保证了微波信号的有效传输。简要分析了垂直互连对微波传输的影响和解决方法,应用微波仿真软件建立了互联结构的三维电磁场模型,对垂直互连结构进行了仿真优化。实测结果和仿真结果吻合良好。最后在较小尺寸盒体内实现了上变频链路、下变频链路、电源管理、TTL检测四个功能。模块测试结果表明,下变频链路的变频增益大于51dB,噪声系数小于6dB,杂散抑制小于65dBc;上变频链路的变频增益大于9dB,1dB压缩点输出功率大于11dBm,杂散抑制小于55dBc;模块尺寸为80mm×42mm×15mm,达到了小型化设计要求。
An X band up-down converter multichip module was developed by using the vertical interconnection technology. The stable conversion of microwave monolithic integrated circuit( MMIC) and media substrate in 3D microwave interconnection structure was realized. And the effective transmission of microwave signal was ensured. The influence of vertical interconnection on microwave transmission and its solutions were briefly analyzed. A 3D electromagnetic field model of the interconnection structure was set up by microwave simulation software,and the vertical interconnection was optimized. The test results agree well with the simulation results. The functions of up-converter-link,down-converter-link,power management and TTL detection were achieved in a miniature size box. The test results show that the down-converter channel conversion gain is above 51 dB,the noise figure below 6 dB,and the clutter suppression below 65 dBc,the conversion gain of the up-converter-link is above 9 dB,the output power at the 1 dB compress point above 11 dBm,and the spur suppression ratio below 55 dBc. The module size is 80 mm×42 mm×15 mm,meeting miniaturization requirement.
An X band up-down converter multichip module was developed by using the vertical interconnection technology. The stable conversion of microwave monolithic integrated circuit( MMIC) and media substrate in 3D microwave interconnection structure was realized. And the effective transmission of microwave signal was ensured. The influence of vertical interconnection on microwave transmission and its solutions were briefly analyzed. A 3D electromagnetic field model of the interconnection structure was set up by microwave simulation software,and the vertical interconnection was optimized. The test results agree well with the simulation results. The functions of up-converter-link,down-converter-link,power management and TTL detection were achieved in a miniature size box. The test results show that the down-converter channel conversion gain is above 51 dB,the noise figure below 6 dB,and the clutter suppression below 65 dBc,the conversion gain of the up-converter-link is above 9 dB,the output power at the 1 dB compress point above 11 dBm,and the spur suppression ratio below 55 dBc. The module size is 80 mm×42 mm×15 mm,meeting miniaturization requirement.
引文
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[2]顾墨琳,林守远.微波集成电路技术——回顾与展望[J].微波学报.2000,16(3):278-290.
[3]MARK S H,WOOLDRIDGE J J.High density packaging of X-band active array modules[J].IEEE Trans Components Packaging and Manufacturing Technology,1997,20(3):279-291.
[4]刘永宁.微波多层电路与低温共烧陶瓷(LTCC)[J].现代雷达.2000,22(6):83-86.
[5]严伟,吴金财,郑伟.三维微波多芯片组件垂直微波互联技术[J].微波学报,2012,28(5):1-6.
[6]GUPTA K C,GARG R,BAHL I,et al.Microstrip lines and slotlines[M].2ed.Boston:Artech House Norwood MA,2006:234-240.
[7]DAVID M P.微波工程[M].张肇仪,译.北京:电子工业出版社,2006:174.
[8]SIMON W.Design of passive components for K-band communication modules in LTCC environment[M].Chicago:IMAPS Symposiums,1999:183-188.
[9]雷震亚.射频/微波电路导论[M].西安:西安电子科技大学出版社,2005:13-17.