填充型高导热环氧树脂复合材料研究进展
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  • 英文篇名:Recent advance of filled epoxy resin composites with high thermal conductivity
  • 作者:刘圣楠 ; 王思蛟 ; 蔡会武
  • 英文作者:Liu Shengnan;Wang Sijiao;Cai Huiwu;Xi'an University of Science and Technology;Tsinghua University;
  • 关键词:环氧树脂 ; 导热填料 ; 表面改性 ; 进展
  • 英文关键词:epoxy resin;;thermal conductive filler;;surface modification;;progress
  • 中文刊名:GXLJ
  • 英文刊名:China Adhesives
  • 机构:西安科技大学;清华大学电机系;
  • 出版日期:2018-12-25
  • 出版单位:中国胶粘剂
  • 年:2018
  • 期:v.27
  • 基金:国家自然科学基金项目(51577154)
  • 语种:中文;
  • 页:GXLJ201812012
  • 页数:6
  • CN:12
  • ISSN:31-1601/TQ
  • 分类号:55-60
摘要
本文总结了近年来填充型高导热环氧树脂复合材料研究进展,分析了其导热机理。综述了填料种类、尺寸、填充量等因素对热导率的影响,并对高导热环氧树脂复合材料的未来发展方向进行了展望。
        The recent progress of the thermal conductive composites based on filled epoxy resins wassummarized,and its thermal conducting mechanism was analyzed. The influence of filler type,size and fillingamount on thermal conductivity was reviewed. Finally the future development of epoxy resin composites with highthermal conductivity was prospected.
引文
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