锡基合金在模拟土壤溶液中的腐蚀与浸出（英文）
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摘要
研究Sn-0.75Cu焊料合金及其接头在NaCl-Na_2SO_4和NaCl-Na_2SO_4-Na_2CO_3模拟土壤溶液中的腐蚀与浸出行为,并与其在NaCl溶液中的行为进行对比,以评估废弃电子产品被填埋时对环境的潜在危害。Sn的浸出动力学表明,Sn的浸出量随时间的增加而增加。在NaCl溶液中接头的Sn浸出量是最多的。SO_4~(2-)和CO_3~(2-)阻碍了接头中Sn的浸出,但加速了焊料中Sn的浸出。在NaCl溶液中的接头表面腐蚀层疏松多孔,而在NaCl-Na_2SO_4和Na Cl-Na_2SO_4-Na_2CO_3溶液中的接头表面腐蚀层则较为致密。XRD结果表明,焊料和接头表面的腐蚀产物以Sn的氧化物、氯化物和碱式氯化物为主。讨论了焊料合金在模拟土壤溶液中的动电位极化曲线。
The corrosion and leaching behaviors of Sn-0.75 Cu solders and joints in NaCl-Na_2SO_4 and NaCl-Na_2SO_4-Na_2CO_3 simulated soil solutions were investigated compared with those in Na Cl solution, aiming to assess the potential risk from the electronic-waste disposed in soil. The leaching kinetics of Sn reveals that the leaching amount of Sn increases with increasing the time. The amount of Sn leached from the joint is the largest in NaC l solution. SO_4~(2-) and CO_3~(2-) inhibit the leaching of Sn from the joints, but accelerate that from the solders. Meanwhile, the corrosion layer of the joint in Na Cl solution is more porous, and those immersed in NaCl-Na_2SO_4 and Na Cl-Na_2SO_4-Na_2CO_3 solutions are compact. The XRD results indicate that the main corrosion products on the solders and joints surfaces are comprised of tin oxide, tin chloride and tin chloride hydroxide. The potentiodynamic polarization measurements for the solders were discussed in the simulated soil solutions.
The corrosion and leaching behaviors of Sn-0.75 Cu solders and joints in NaCl-Na_2SO_4 and NaCl-Na_2SO_4-Na_2CO_3 simulated soil solutions were investigated compared with those in Na Cl solution, aiming to assess the potential risk from the electronic-waste disposed in soil. The leaching kinetics of Sn reveals that the leaching amount of Sn increases with increasing the time. The amount of Sn leached from the joint is the largest in NaC l solution. SO_4~(2-) and CO_3~(2-) inhibit the leaching of Sn from the joints, but accelerate that from the solders. Meanwhile, the corrosion layer of the joint in Na Cl solution is more porous, and those immersed in NaCl-Na_2SO_4 and Na Cl-Na_2SO_4-Na_2CO_3 solutions are compact. The XRD results indicate that the main corrosion products on the solders and joints surfaces are comprised of tin oxide, tin chloride and tin chloride hydroxide. The potentiodynamic polarization measurements for the solders were discussed in the simulated soil solutions.
引文
[1]YANG Jian-xin,LU Bin,XU Cheng.WEEE flow and mitigating measures in China[J].Waste Management,2008,28(9):1589-1597.
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[11]GAO Yan-fang,CHENG Cong-qian,ZHAO Jie,WANG Li-hua,LIXiao-gang.Electrochemical corrosion of Sn-0.75Cu solder joints in NaC l solution[J].Transactions of Nonferrous Metals Society of China,2012,22(4):977-982.
[12]FARINA S,MORANDO C.Comparative corrosion behaviour of different Sn-based solder alloys[J].Journal of Materials Science:Materials in Electronics,2015,26(1):464-471.
[13]SMITH E B,SWANGER L K.Toxicity and worldwide environmental regulation of lead-free solders[J].Transactions of the Institute of Metal Finishing,2000,78(2):B18-B21.
[14]HE Bin,YUN Zhao-jun,SHI Jian-bo,JIANG Gui-bin.Research progress of heavy metal pollution in China:Sources,analytical methods,status,and toxicity[J].Chinese Science Bulletin,2013,58(2):134-140.
[15]MORI M,MIURA K,SASAKI T,OHTSUKA T.Corrosion of tin alloys in sulfuric and nitric acids[J].Corrosion Science,2002,44(4):887-898.
[16]BRENNEN M,PERUMAREDDI J R,SASTRI V S,ELBOUJDAINIM,BROWN J R.Studies on leaching of metals from solders due to corrosion[J].Materials and Corrosion,1998,49(8):551-555.
[17]LI D Z,CONWAY P P,LIU C Q.Corrosion characterization of tin-lead and lead free solders in 3.5 wt.%NaC l solution[J].Corrosion Science,2008,50(4):995-1004.
[18]LIU J,PARK S,NAGAO S,NOGI M,KOGA H,MA J,ZHANG G,SUGANUMA K.The role of Zn precipitates and Cl-anions in pitting corrosion of Sn-Zn solder alloys[J].Corrosion Science,2015,92:263-271.
[19]ROSALBINO F,ANGELINI E,ZANICCHI G,MARAZZA R.Corrosion behaviour assessment of lead-free Sn-Ag-M(M=In,Bi,Cu)solder alloys[J].Materials Chemistry and Physics,2008,109(2-3):386-391.
[20]NAZERI M F M,ISMAIL A B,MOHAMAD A A.Effect of polarizations on Sn-Zn solders alloys in alkaline electrolyte[J].Journal of Alloys and Compounds,2014,606:278-287.
[21]MOHANTY U S,LIN K.The effect of alloying element gallium on the polarization characteristics of Pb-free Sn-Zn-Ag-Al-XGa solders in NaC l solution[J].Corrosion Science,2006,48(3):662-678.
[22]JUNG J,LEE S,JOO Y,LEE H,PARK Y.Anodic dissolution characteristics and electrochemical migration lifetimes of Sn solder in NaC l and Na2SO4 solutions[J].Microelectronic Engineering,2008,85(7):1597-1602.
[23]WANG M N,WANG J Q,KE W.Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition[J].Journal of Materials Science:Materials in Electronics,2014,25(3):1228-1236.
[24]MOUANGA M,BERCOT P.Comparison of corrosion behaviour of zinc in NaC l and in NaO H solutions.Part II:Electrochemical analyses[J].Corrosion Science,2010,52(12):3993-4000.
[25]WANG L H,CHENG C Q,YANG F,ZHAO J.Leaching behavior of lead-free solders in a NaC l-Na2SO4-Na2CO3 mixed solution as simulated soil[J].Journal of Chinese Society for Corrosion and Protection,2011,31(5):381-384.(in Chinese)
[26]MOUANGA M,BER?OT P,RAUCH J Y.Comparison of corrosion behaviour of zinc in NaC l and in NaO H solutions.Part I:Corrosion layer characterization[J].Corrosion Science,2010,52(12):3984-3992.
[27]WANG Bao-cheng.Corrosion and protection of materials[M].Beijing:Peking University Press,2012:118-123.(in Chinese)
[28]CHANG H,CHEN H,LI M,WANG L,FU Y.Generation of tin(II)oxide crystals on lead-free solder joints in deionized water[J].Journal of Electronic Materials,2009,38(10):2170-2178.
[2]EVELOY V,GANESAN S,FUKUDA Y,WU J,PECHT M G.WEEE,Ro HS,and what you must do to get ready for lead-free electronics[C]//Proceedings of the Sixth International Conference on Electronics Packaging Technology.Piscataway:IEEE,2005:27-44.
[3]EVELOY V,GANESAN S,FUKUDA Y,WU J,PECHT M G.Are you ready for lead-free electronics?[J].IEEE Transactions on Components and Packaging Technologies,2005,28(4):884-894.
[4]CHENG C Q,YANG F,ZHAO J,WANG L H,LI X G.Leaching of heavy metal elements in solder alloys[J].Corrosion Science,2011,53(5):1738-1747.
[5]YANG Bin,KONG Ling-xin,XU Bao-qiang,LIU Da-chun,DAIYong-nian.Recycling of metals from waste Sn-based alloys by vacuum separation[J].Transactions of Nonferrous Metals Society of China,2015,25(4):1315-1324.
[6]WIDMER R,OSWALD-KRAPF H,SINHA-KHETRIWAL D,SCHNELLMANN M,B?NI H.Global perspectives on e-waste[J].Environmental Impact Assessment Review,2005,25(5):436-458.
[7]BABU B R,PARANDE A K,BASHA C A.Electrical and electronic waste:A global environmental problem[J].Waste Management&Research,2007,25(4):307-318.
[8]ROBINSON B H.E-waste:An assessment of global production and environmental impacts[J].Science of the Total Environment,2009,408(2):183-191.
[9]SOCOLOF M L,GEIBIG J R.Life-cycle impacts of lead and lead-free solder used in wave soldering of electronics[C]//Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment.Piscataway:IEEE,2005:96-101.
[10]OSóRIO W R,FREITAS E S,SPINELLI J E,GARCIA A.Electrochemical behavior of a lead-free Sn-Cu solder alloy in NaC l solution[J].Corrosion Science,2014,80:71-81.
[11]GAO Yan-fang,CHENG Cong-qian,ZHAO Jie,WANG Li-hua,LIXiao-gang.Electrochemical corrosion of Sn-0.75Cu solder joints in NaC l solution[J].Transactions of Nonferrous Metals Society of China,2012,22(4):977-982.
[12]FARINA S,MORANDO C.Comparative corrosion behaviour of different Sn-based solder alloys[J].Journal of Materials Science:Materials in Electronics,2015,26(1):464-471.
[13]SMITH E B,SWANGER L K.Toxicity and worldwide environmental regulation of lead-free solders[J].Transactions of the Institute of Metal Finishing,2000,78(2):B18-B21.
[14]HE Bin,YUN Zhao-jun,SHI Jian-bo,JIANG Gui-bin.Research progress of heavy metal pollution in China:Sources,analytical methods,status,and toxicity[J].Chinese Science Bulletin,2013,58(2):134-140.
[15]MORI M,MIURA K,SASAKI T,OHTSUKA T.Corrosion of tin alloys in sulfuric and nitric acids[J].Corrosion Science,2002,44(4):887-898.
[16]BRENNEN M,PERUMAREDDI J R,SASTRI V S,ELBOUJDAINIM,BROWN J R.Studies on leaching of metals from solders due to corrosion[J].Materials and Corrosion,1998,49(8):551-555.
[17]LI D Z,CONWAY P P,LIU C Q.Corrosion characterization of tin-lead and lead free solders in 3.5 wt.%NaC l solution[J].Corrosion Science,2008,50(4):995-1004.
[18]LIU J,PARK S,NAGAO S,NOGI M,KOGA H,MA J,ZHANG G,SUGANUMA K.The role of Zn precipitates and Cl-anions in pitting corrosion of Sn-Zn solder alloys[J].Corrosion Science,2015,92:263-271.
[19]ROSALBINO F,ANGELINI E,ZANICCHI G,MARAZZA R.Corrosion behaviour assessment of lead-free Sn-Ag-M(M=In,Bi,Cu)solder alloys[J].Materials Chemistry and Physics,2008,109(2-3):386-391.
[20]NAZERI M F M,ISMAIL A B,MOHAMAD A A.Effect of polarizations on Sn-Zn solders alloys in alkaline electrolyte[J].Journal of Alloys and Compounds,2014,606:278-287.
[21]MOHANTY U S,LIN K.The effect of alloying element gallium on the polarization characteristics of Pb-free Sn-Zn-Ag-Al-XGa solders in NaC l solution[J].Corrosion Science,2006,48(3):662-678.
[22]JUNG J,LEE S,JOO Y,LEE H,PARK Y.Anodic dissolution characteristics and electrochemical migration lifetimes of Sn solder in NaC l and Na2SO4 solutions[J].Microelectronic Engineering,2008,85(7):1597-1602.
[23]WANG M N,WANG J Q,KE W.Corrosion behavior of Sn-3.0Ag-0.5Cu solder under high-temperature and high-humidity condition[J].Journal of Materials Science:Materials in Electronics,2014,25(3):1228-1236.
[24]MOUANGA M,BERCOT P.Comparison of corrosion behaviour of zinc in NaC l and in NaO H solutions.Part II:Electrochemical analyses[J].Corrosion Science,2010,52(12):3993-4000.
[25]WANG L H,CHENG C Q,YANG F,ZHAO J.Leaching behavior of lead-free solders in a NaC l-Na2SO4-Na2CO3 mixed solution as simulated soil[J].Journal of Chinese Society for Corrosion and Protection,2011,31(5):381-384.(in Chinese)
[26]MOUANGA M,BER?OT P,RAUCH J Y.Comparison of corrosion behaviour of zinc in NaC l and in NaO H solutions.Part I:Corrosion layer characterization[J].Corrosion Science,2010,52(12):3984-3992.
[27]WANG Bao-cheng.Corrosion and protection of materials[M].Beijing:Peking University Press,2012:118-123.(in Chinese)
[28]CHANG H,CHEN H,LI M,WANG L,FU Y.Generation of tin(II)oxide crystals on lead-free solder joints in deionized water[J].Journal of Electronic Materials,2009,38(10):2170-2178.