小面积高兼容性RSA&SM2的硬件实现方法
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  • 英文篇名:Design method of RSA&SM2 hardware with low-area and high-compatibility
  • 作者:邹雪城 ; 周家乐 ; 刘文超 ; 刘政林
  • 英文作者:ZOU Xuecheng;ZHOU Jiale;LIU Wenchao;LIU Zhenglin;School of Optical and Electronic Information,Huazhong University of Science and Technology;
  • 关键词:加密芯片 ; 夏米尔·阿德曼(RSA) ; 椭圆曲线密码体制 ; 双域运算 ; 蒙哥马利模乘
  • 英文关键词:encryption chip;;Rivest-Shamir-Adleman(RSA);;elliptic curve cryptography(ECC);;double domain operation;;Montgomery modular multiplication
  • 中文刊名:HZLG
  • 英文刊名:Journal of Huazhong University of Science and Technology(Natural Science Edition)
  • 机构:华中科技大学光学与电子信息学院;
  • 出版日期:2019-01-10 11:31
  • 出版单位:华中科技大学学报(自然科学版)
  • 年:2019
  • 期:v.47;No.433
  • 基金:国家自然科学基金资助项目(61376026)
  • 语种:中文;
  • 页:HZLG201901015
  • 页数:6
  • CN:01
  • ISSN:42-1658/N
  • 分类号:84-89
摘要
设计了一种小面积高兼容性的夏米尔·阿德曼(RSA)&SM2加密协处理器.模运算层设计了基-32蒙哥马利模运算电路,支持任意位宽下的双域运算,具有可配置的流水线结构;核心运算层设计了统一结构的模幂&标量乘电路,具有可配置的抗SPA攻击功能.通过模运算层和核心运算层电路的功能复用来减小整体硬件结构面积.实验测得本电路支持2 048 bit内任意域RSA运算、768 bit任意域任意曲线和位宽的标量乘运算以及SM2国密规定的所有曲线.在0.13μm工艺下流片,电路总面积为0.32 mm2,约8.7×104个等效门,芯片最高工作频率为250 MHz,具有极高的面积利用率和兼容性.
        A low-area and high-compatibility Rivest-Shamir-Adleman(RSA)&SM2 coprocessor was designed. Architecture for modular arithmetic unit,unified modular power and scalar multiplication unit was implemented.The coprocessor support dual-field operation,key length adjustable,and insert the configurable pipeline to improve computing speed.Because of the function reuse of the modular arithmetic unit,and unified MP&SM unit,area was reduced greatly in the whole hardware structure.The experimental results show that the proposed circuit supports the RSA operation of any domain in 2 048 bit,and the elliptic curve cryptography(ECC) scalar multiplication operation of 768 bit arbitrary curve and bit width,and also supports all the curves specified by the SM2 state secret.Finally,the design was tape-out in a 0.13 μm process,and the total IP area is 0.32 mm2,which is about 8.7×104,and the chip's highest working frequency is 250 MHz,with extremely high area utilization and compatibility.
引文
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