用户名: 密码: 验证码:
基于加权SSIM算法的PCB元件缺陷检测
详细信息    查看全文 | 推荐本文 |
  • 英文篇名:PCB component defects detection using weighted SSIM
  • 作者:乔羽 ; 沈精虎 ; 于腾 ; 安帅 ; 孙恺
  • 英文作者:QIAO Yu;SHEN Jing-hu;YU Teng;AN Shuai;SUN Kai;
  • 关键词:PCB ; 自动光学检测 ; 加权SSIM ; 插件元件
  • 中文刊名:JXGY
  • 英文刊名:Manufacturing Automation
  • 机构:青岛大学机电工程学院;青岛大学电子信息学院;
  • 出版日期:2019-04-25
  • 出版单位:制造业自动化
  • 年:2019
  • 期:v.41
  • 语种:中文;
  • 页:JXGY201904004
  • 页数:5
  • CN:04
  • ISSN:11-4389/TP
  • 分类号:16-20
摘要
提出了一种自动光学检测方法,通过将传统的SSIM算法与元件的权重相结合的方法来检测PCB元件缺陷。该方法基于图像内容生成权重图,与SSIM矩阵相乘,它可以有效地增强平滑区域信息并消除高频区域的干扰。该系统不需要严格照明条件,对相机性能要求不高。实验结果表明,该方法在PCB缺陷检测精度方面,特别是对位置变化较大的插件元件的检测优于传统的SSIM方法。将有助于开发低成本和自动化的缺陷检测系统。
        
引文
[1]Wu F,Zhang X,Kuan Y,et al.An AOI algorithm for PCB based on feature extraction[A].Intelligent Control and Automation,2008.Wcica 2008.World Congress on[C].IEEE,2008:240-247.
    [2]Belbachir A N,Lera M,Fanni A,et al.An automatic optical inspection system for the diagnosis of printed circuits based on neural networks[A].Fourtieth Ias Meeting.Conference Record of the 2005 Industry Applications Conference[C].IEEE,2005:680-684 Vol.1.
    [3]Wang D Z,Wu C H,Ip A,et al.Fast Multi-template Matching Using a Particle Swarm Optimization Algorithm for PCBInspection[J].2008,4974(4):365-370.
    [4]Chuang S F,Chang W T,Lin C C,et al.Misalignment inspection of multilayer PCBs with an automated X-ray machine vision system[J].International Journal of Advanced Manufacturing Technology,2010,51(9-12):995-1008.
    [5]Yu L,Yang Y,Sun S.A PCB Component Location Method Based on Image Hashing[A].International Conference on Electronic Measurement and Instruments[C].IEEE,2007:2-697-2-700.
    [6]Wang,Zhou;Bovik,A.C.;Sheikh,H.R.;Simoncelli,E.P.Image Assessment:from error visibility to structural similarity[A].IEEETransactions on Image Processing[C].13(4),2004-04-01:600-612.
    [7]Zhang G,He J,Li X.3D vision inspection for internal surface based on circle structured light[J].Sensors&Actuators A Physical,2005,122(1):68-75.
    [8]Nayana H G,IIDeepa P,IIIAnitha D B,IVDr.Mahesh Rao.A Review on Defect Detection of SMT and Through HoleComponents in Assembled PCB[J].nternational Journal of Advanced Research in Computer Science&Technology,vol.5,no.2,2017.
    [9]Sikka S,Sikka K,Bhuyan M K,et al.Pseudo vs.True Defect Classification in Printed Circuits Boards using Wavelet Features[J].Computer Science,2013.
    [10]Chomsuwan K,Yamada S,Iwahara M.Bare PCB Inspection System With SV-GMR Sensor Eddy-Current Testing Probe[J].IEEE Sensors Journal,2007,7(5):890-896.
    [11]Choi K S,Pyun J Y,Kim N H,et al.Real-Time Inspection System for Printed Circuit Boards[J].2003,1:166-170 vol.1.
    [12]Dong N,Wu C H,Chen Z Q,et al.Chaotic species based particle swarm optimization algorithms and its application in PCBcomponents detection[J].Expert Systems with Applications An International Journal,2012,39(16):12501-12511.
    [13]Mar N S S,Yarlagadda P K D V,Fookes C.Design and development of automatic visual inspection system for PCB manufacturing[J].Robotics and Computer-Integrated Manufacturing,2011,27(5):949-962.
    [14]Luo B,Zhang Y,Yu G,et al.ANN Ensembles Based Machine Vision Inspection for Solder Joints[A].IEEE International Conference on Control and Automation[C].IEEE,2007:3111-3115.
    [15]Wu F,Zhang X,Kuan Y,et al.An AOI algorithm for PCB based on feature extraction[A].Intelligent Control and Automation,2008.Wcica 2008.World Congress on[C].IEEE,2008:240-247.
    [16]Crispin A J,Rankov V.Automated inspection of PCB components using a genetic algorithm template-matching approach[J].International Journal of Advanced Manufacturing Technology,2007,35(3-4):293-300.
    [17]Ganavi V M.Printed Circuit Board Assembly Defects Detection Using ImageProcassing technigues[J].International Journal of Engineering Science and Computing,Bangalore,2016,6(6).
    [18]Xie F,Uitdenbogerd A,Song A.Detecting PCB component placement defects by genetic programming[A].Evolutionary Computation[C].IEEE,2013:1138-1145.
    [19]Sundaraj K.PCB inspection for missing or misaligned components using background subtraction[J].Wseas Transactions on Information Science&Applications,2009,6(5):778-787.
    [20]李芬.用于PCB板检测的AOI关键算法研究[D].武汉理工大学,2010.
    [21]Reed J M,Hutchinson S.Image fusion and subpixel parameter estimation for automated optical inspection of electronic components[J].Industrial Electronics IEEE Transactions on,1996,43(3):346-354.
    [22]Ibrahim Z,Al-Attas S A R,Aspar Z.Analysis of the wavelet-based image difference algorithm for PCB inspection[A].Sice 2002.Proceedings of the,Sice Conference[C].IEEE,2003:2108-2113vol.4.
    [23]Choi K S,Pyun J Y,Kim N H,et al.Real-Time Inspection System for Printed Circuit Boards[M].Pattern Recognition.Springer Berlin Heidelberg,2003:458-465.

© 2004-2018 中国地质图书馆版权所有 京ICP备05064691号 京公网安备11010802017129号

地址:北京市海淀区学院路29号 邮编:100083

电话:办公室:(+86 10)66554848;文献借阅、咨询服务、科技查新:66554700