传感器用聚氨酯灌封胶的电性能及热响应研究
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摘要
借助一种结构简化后的温度传感器,通过测试传感器的热响应时间和漏电流,研究聚氨酯灌封胶的导热性能与电性能之间的关联。结果表明,聚氨酯灌封胶的导热系数越高,对应温度传感器的热响应时间也就越短,同时其电导率也会增大,漏电流随之增加。对于用聚氨酯灌封胶填充的温度传感器而言,在追求热响应时间尽可能少的同时,需要考虑漏电流的增加对产品绝缘性能的影响。
Through measuring the thermal response time and leakage current of the sensor,a simplified temperature sensor structure was utilized to study the relationship between the thermal properties and electrical properties of polyurethane potting adhesive. The results showed that the increment of the thermal conductivity of the polyurethane potting adhesive would decrease the thermal response time,increase the electrical conductivity and the leakage current. For the temperature sensor filled with polyurethane potting,it is necessary to consider the effect of increased leakage current on product insulation performance while pursuing as little thermal response time as possible.
Through measuring the thermal response time and leakage current of the sensor,a simplified temperature sensor structure was utilized to study the relationship between the thermal properties and electrical properties of polyurethane potting adhesive. The results showed that the increment of the thermal conductivity of the polyurethane potting adhesive would decrease the thermal response time,increase the electrical conductivity and the leakage current. For the temperature sensor filled with polyurethane potting,it is necessary to consider the effect of increased leakage current on product insulation performance while pursuing as little thermal response time as possible.
引文
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[2]田海明,周正发,任凤梅,等.硅橡胶表面涂层用封闭型聚氨酯合成[J].聚氨酯工业,2011,26(5):12-14.
[3]张小博,王海洋,刘海萍.水滑石/钴沸石复合阻燃聚氨酯保温材料的制备和性能研究[J].聚氨酯工业,2017,32(3):13-15.
[4]王文进,李鸿岩,姜其斌.高导热绝缘高分子复合材料的研究进展[J].绝缘材料,2008,41(5):30-31.
[5]杨再军,杨武利,吴海平.电子封装用聚氨酯灌封胶的研制[J].中国胶粘剂,2016,25(6):30-34.
[6]罗宁,王得宁,应圣康.聚氨酯红外光谱氢键化谱带的归属与定量分析[J].合成橡胶工业,1995,18(4):200-203.
[7]李杰妹,黄瑞,吕小王,等.傅里叶变换红外光谱技术在聚氨酯行业中的应用进展[J].化学推进剂与高分子材料,2008,6(6):30-35.
[8]吕程,廖瑞金.阻燃剂Al(OH)3对聚氨酯弹性体绝缘性能的影响[J].聚氨酯工业,2016,31(2):19-22.
[9]汤浩,陈欣方,罗云霞.复合型导电高分子材料导电机理研究及电阻率计算[J].高分子材料科学与工程,1996,12(2):1-7.
[10]孙炎,黄文斌.聚氨酯灌封胶电绝缘性能的研究[J].聚氨酯工业,2017,32(4):41-43.