Ka频段八波束接收组件的设计与实现
|
摘要
介绍了一种Ka频段八波束接收组件的设计方法和关键技术。为实现八波束及1.6 GHz瞬时带宽的要求,在接收组件中集成了实时延时芯片,并提出了射频组件三维垂直互联与射频信号交叉传输的方法,同时采用多芯片组装技术、多功能芯片技术等高密度集成方法实现组件装配。研制的接收组件具有高集成度,噪声系数等关键指标在10dB的数控衰减下小于3.5dB,较传统组件在尺寸、质量及波束数量上具有较大优势。
Design method and key technologies of a Ka band with high integration receiver module are given. In order to meet the requirement of more than 1.6 GHz instantaneous bandwidth in Ka band, true time-delay chip is integrated in the module. According to the requirement of 8 beams, a method of vertical interconnection and Radio Frequency(RF) cross technology is proposed, and the Multi-Functional Chip(MFC) technique and Multi-Chip Module(MCM) technique are also adopted to increase the integration level. Finally, a receiver module with 16 channels(8 beams) is developed successfully and NF of the module is less than 3.5 dB in the case of 10 dB attenuation. The receiver module features high integration level. It has more advantages on the size, weight and the number of beams than the conventional module.
Design method and key technologies of a Ka band with high integration receiver module are given. In order to meet the requirement of more than 1.6 GHz instantaneous bandwidth in Ka band, true time-delay chip is integrated in the module. According to the requirement of 8 beams, a method of vertical interconnection and Radio Frequency(RF) cross technology is proposed, and the Multi-Functional Chip(MFC) technique and Multi-Chip Module(MCM) technique are also adopted to increase the integration level. Finally, a receiver module with 16 channels(8 beams) is developed successfully and NF of the module is less than 3.5 dB in the case of 10 dB attenuation. The receiver module features high integration level. It has more advantages on the size, weight and the number of beams than the conventional module.
引文
[1]ZHENG Xiaoyu,LIU Luokun,GUO Hong,et al. A study on expanding instantaneous bandwidth of phased array antenna[J].Modern Radar, 2014,36(11):40-44.
[2]RODENBEEK C T,KIM S G,TU W H,et a1. Ultra-wideband low cost phased-array radars[J]. IEEE Transactions on Microwave Theory and Techniques, 2005,53(12):3697-3703.
[3]MA Qian,LEENAERTS D W M,BALTUS P G M. Silicon-based true-time-delay phased-array front-ends at Ka-band[J]. IEEE Transactions on Microwave Theory and Techniques, 2015,63(9):2942-2952.
[4]刘晓莉,郝金中. Ka波段多通道发射组件的设计[J].舰船电子对抗, 2015,38(3):99-102.(LIU Xiaoli,HAO Jinzhong.Design of Ka-band multi-channel transmitting module[J]. Shipboard Electronic Countermeasure, 2015,38(3):99-102.)
[5]ABBOSH A M. Vertical microstrip-microstrip transition for ultra wideband applications[C]//2007 Asia-Pacific Microwave Conference. Bangkok,Thailand:IEEE, 2007:1-4.
[6]郝金中,张瑜,周扬.一种宽带多通道瓦片式T/R组件的研制[J].电讯技术, 2015,55(1):108-112.(HAO Jinzhong,ZHANG Yu,ZHOU Yang. Design of a broadband multi-channel tile-type T/R module[J]. Telecommunication Engineering, 2015,55(1):108-112.)
[7]石海然,张橹,倪子楠,等. Ka频段片式一体化发射组件的设计与实现[J].计算机测量与控制, 2018,26(4):160-163.(SHI Hairan,ZHANG Lu,NI Zinan,et al. Design of a Ka band integrated tile-type transmit module[J]. Computer Measurement and Control, 2018,26(4):160-163.)
[8]周骏,沈亚,顾江川.新型三维立体集成接收组件设计与实现[J].固体电子学研究与进展, 2016,36(1):25-29.(ZHOU Jun,SHEN Ya,GU Jiangchuan. A novel design of three dimensional integration receiving module[J]. Research and Progress of SSE, 2016,36(1):25-29.)
[9]严伟,吴金财,郑伟.三维微波多芯片组件垂直微波互联技术[J].微波学报, 2012,28(5):1-6.(YAN Wei,WU Jincai,ZHENG Wei. Vertical microwave interconnection techniques for 3D microwave multi-chip modules[J]. Journal of Microwaves,2012,28(5):1-6.)
[10]武红玉,厉志强,乔明昌,等.毫米波多通道接收组件隔离度对移相的影响[J].舰船电子对抗, 2016,39(3):79-82.(WU Hongyu,LI Zhiqiang,QIAO Mingchang,et al. Influence of isolation of millimeter-wave multi-channel receiving module on Phase Shift[J]. Shipboard Electronic Countermeasure, 2016,39(3):79-82.)
[11]SIMON W,LAUER A,SCHAUWECKER B,et al. EM design of an isolated coplanar RE cross for MEMS switch matrix applications[C]//2003 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems. Grainau,Germany:IEEE,2003:162-165.
[12]万涛,王耀召.小型化层叠式三维T/R组件[J].太赫兹科学与电子信息学报, 2016,14(5):758-762.(WAN Tao,WANG Yaozhao. Miniaturization and multilayer for 3D T/R module[J]. Journal of Terahertz Science and Electronic Information Technology, 2016,14(5):758-762.)
[13]TSAI C C,CHENG Y S,HUANG T Y,et al. Design of microstrip-to-microstrip via transition in multilayered LTCC for frequencies up to 67 GHz[J]. IEEE Transactions on Components,Packaging and Manufacturing Technology, 2011,1(4):595-601.
[14]LIU Z H,WU M Y. Technical trends and challenges of integration of microsystems function modules[J]. Electronic Technology,2015,36(4):195-198.
[15]MANCUSO Y,GREMILLET P,LACOMME P. T/R-modules technological and technical trends for phased array antennas[C]//2005 European Microwave Conference. Paris,France:IEEE, 2005:614-617.
[16]白锐,高长征.基于微波多层板的小型化多通道接收前端设计[J].电讯技术, 2014,54(11):1544-1548.(BAI Rui,GAO Changzheng. Design of a miniaturized multi-channel receiver front-end based on microwave multilayer[J]. Telecommunication Engineering, 2014,54(11):1544-1548.)
[2]RODENBEEK C T,KIM S G,TU W H,et a1. Ultra-wideband low cost phased-array radars[J]. IEEE Transactions on Microwave Theory and Techniques, 2005,53(12):3697-3703.
[3]MA Qian,LEENAERTS D W M,BALTUS P G M. Silicon-based true-time-delay phased-array front-ends at Ka-band[J]. IEEE Transactions on Microwave Theory and Techniques, 2015,63(9):2942-2952.
[4]刘晓莉,郝金中. Ka波段多通道发射组件的设计[J].舰船电子对抗, 2015,38(3):99-102.(LIU Xiaoli,HAO Jinzhong.Design of Ka-band multi-channel transmitting module[J]. Shipboard Electronic Countermeasure, 2015,38(3):99-102.)
[5]ABBOSH A M. Vertical microstrip-microstrip transition for ultra wideband applications[C]//2007 Asia-Pacific Microwave Conference. Bangkok,Thailand:IEEE, 2007:1-4.
[6]郝金中,张瑜,周扬.一种宽带多通道瓦片式T/R组件的研制[J].电讯技术, 2015,55(1):108-112.(HAO Jinzhong,ZHANG Yu,ZHOU Yang. Design of a broadband multi-channel tile-type T/R module[J]. Telecommunication Engineering, 2015,55(1):108-112.)
[7]石海然,张橹,倪子楠,等. Ka频段片式一体化发射组件的设计与实现[J].计算机测量与控制, 2018,26(4):160-163.(SHI Hairan,ZHANG Lu,NI Zinan,et al. Design of a Ka band integrated tile-type transmit module[J]. Computer Measurement and Control, 2018,26(4):160-163.)
[8]周骏,沈亚,顾江川.新型三维立体集成接收组件设计与实现[J].固体电子学研究与进展, 2016,36(1):25-29.(ZHOU Jun,SHEN Ya,GU Jiangchuan. A novel design of three dimensional integration receiving module[J]. Research and Progress of SSE, 2016,36(1):25-29.)
[9]严伟,吴金财,郑伟.三维微波多芯片组件垂直微波互联技术[J].微波学报, 2012,28(5):1-6.(YAN Wei,WU Jincai,ZHENG Wei. Vertical microwave interconnection techniques for 3D microwave multi-chip modules[J]. Journal of Microwaves,2012,28(5):1-6.)
[10]武红玉,厉志强,乔明昌,等.毫米波多通道接收组件隔离度对移相的影响[J].舰船电子对抗, 2016,39(3):79-82.(WU Hongyu,LI Zhiqiang,QIAO Mingchang,et al. Influence of isolation of millimeter-wave multi-channel receiving module on Phase Shift[J]. Shipboard Electronic Countermeasure, 2016,39(3):79-82.)
[11]SIMON W,LAUER A,SCHAUWECKER B,et al. EM design of an isolated coplanar RE cross for MEMS switch matrix applications[C]//2003 Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems. Grainau,Germany:IEEE,2003:162-165.
[12]万涛,王耀召.小型化层叠式三维T/R组件[J].太赫兹科学与电子信息学报, 2016,14(5):758-762.(WAN Tao,WANG Yaozhao. Miniaturization and multilayer for 3D T/R module[J]. Journal of Terahertz Science and Electronic Information Technology, 2016,14(5):758-762.)
[13]TSAI C C,CHENG Y S,HUANG T Y,et al. Design of microstrip-to-microstrip via transition in multilayered LTCC for frequencies up to 67 GHz[J]. IEEE Transactions on Components,Packaging and Manufacturing Technology, 2011,1(4):595-601.
[14]LIU Z H,WU M Y. Technical trends and challenges of integration of microsystems function modules[J]. Electronic Technology,2015,36(4):195-198.
[15]MANCUSO Y,GREMILLET P,LACOMME P. T/R-modules technological and technical trends for phased array antennas[C]//2005 European Microwave Conference. Paris,France:IEEE, 2005:614-617.
[16]白锐,高长征.基于微波多层板的小型化多通道接收前端设计[J].电讯技术, 2014,54(11):1544-1548.(BAI Rui,GAO Changzheng. Design of a miniaturized multi-channel receiver front-end based on microwave multilayer[J]. Telecommunication Engineering, 2014,54(11):1544-1548.)