磷溴阻燃环氧树脂的制备及应用
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  • 英文篇名:Preparation and application of phosphorous-bromine flame retardant epoxy resins
  • 作者:林伟 ; 范华勇 ; 游江 ; 黄天辉
  • 英文作者:LIN Wei;FAN Hua-yong;YOU Jiang;HUANG Tian-hui;National Engineering Research Center of Electronic Circuits Base Materials,Shengyi Technology Co.,Ltd.;
  • 关键词:磷溴阻燃环氧树脂 ; 覆铜板 ; 协同阻燃 ; 耐热性 ; 相比漏电起痕指数
  • 英文关键词:phosphorous-bromine flame retardant epoxy resin;;copper clad laminate;;synergistic flame retardancy;;heat resistance;;comparative tracking index
  • 中文刊名:RGXS
  • 英文刊名:Thermosetting Resin
  • 机构:国家电子电路基材工程技术研究中心广东生益科技股份有限公司;
  • 出版日期:2019-03-30
  • 出版单位:热固性树脂
  • 年:2019
  • 期:v.34;No.172
  • 语种:中文;
  • 页:RGXS201902009
  • 页数:5
  • CN:02
  • ISSN:12-1159/TQ
  • 分类号:51-55
摘要
以双酚A型环氧树脂(E-51)、四溴双酚A、9,10-二氢-9-氧杂-10-磷杂菲-10-氧化物(DOPO)或10-(2,5-二羟基苯基)-10-氢-9-氧杂-10-磷杂菲-10-氧化物(DOPO-HQ)为原料,合成了2种磷溴阻燃环氧树脂(简称PB-1016、PBHQ-1016),然后与双酚A型酚醛树脂固化反应制备了覆铜板,采用红外光谱,凝胶渗透色谱,热重分析及阻燃性测试对磷溴阻燃环氧树脂和覆铜板进行了结构表征与性能研究。结果表明,磷溴阻燃环氧树脂具有明显的协同阻燃效应,并可提升含溴阻燃覆铜板的耐热性和相比漏电起痕指数(CTI)。PBHQ-1016具有良好的热稳定性,以其制备的覆铜板的阻燃性、耐热性、粘接性和CTI等性能表现较优,综合性能最佳。
        The two kinds of phosphorous-bromine flame retardant epoxy resins(PB-1016 and PBHQ-1016)were synthesized by the reaction of epoxy resin(E-51),tetrabromobisphenol A and DOPO(or DOPO-HQ),then the copper clad laminates were prepared by the curing reaction of flame retardant epoxy resins and BPA novolac resin. The structure of the phosphorous-bromine flame retardant epoxy resins and the properties of the copper clad laminates were characterized and investigated by Infrared spectroscopy,gel permeation chromatography,thermogravimetric analysis and flame retardancy test. The results showed that the phosphorous-bromine flame retardant epoxy resin had obvious synergistic flame retardant effect,and it could improve the heat resistance and comparative tracking index(CTI) performance of Br flame retardant copper clad laminate. The PBHQ-1016 had good thermal stability,and its copper clad laminate had the best overall performance with excellent properties in flame retardancy,heat resistance,adhesion,CTI,etc..
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