摘要
用恒电位仪测定了不同次氯酸钠浓度和pH的条件下金阳极溶解极化曲线,拟合得到自腐蚀电位(Ecorr)、自腐蚀电流密度(Icorr)以及线性极化电阻(Rp),并进行难浸金矿的搅拌浸出验证实验。结果表明,在不同浓度条件下金腐蚀速率先增大后减小,在浓度0.75 mol/L时金阳极开始钝化,浸出实验结果与电化学研究结果一致;不同pH实验条件下金的腐蚀速率随pH增加而逐渐增大,但pH超过12后浸出率稍有下降,浸金结果与电化学研究结论略有不同。
The polarization curves of gold anodic dissolution under different concentration conditions of sodium hypochlorite and pH values were measured by using a potentiostat,and the self-corrosion potential(Ecorr),the self-corrosion current density(Icorr) and the linear polarization resistance(Rp) were calculated by the curve-fitting method.These parameters were subjected to the verification of actual leaching process of a refractory gold ore.The results showed that the gold corrosion rate first increased and then decreased with the augment of sodium hypochlorite concentrations.The gold anode started to passivate at the concentration of 0.75 mol/L.The outcomes of the actual leaching experiments were in good agreement with the electrochemical profile.The corrosion of gold accelerated with the increase of pH values,resulting in an increase of the leaching rate.However,the leaching rate would decreased slightly after the pH value exceeded 12,which is slightly different from the results of the electrochemical studies.
引文
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