压电式锡膏喷射阀特性
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摘要
为了实现非接触式锡膏喷印以满足现代表面贴装技术中的精度高、速度快、灵活性强的要求,研制了一种压电式锡膏喷射阀。该系统利用压电叠堆作为驱动源,采用撞针与喷嘴相互分离的撞击式喷射技术实现锡膏的喷射。首先,对锡膏的喷射进行理论分析,并利用Fluent分析了撞针结构、喷嘴直径和撞针速度等参数对锡膏微滴喷射的影响;最后,搭建了喷射系统实验平台,对锡膏微滴喷射性能进行测试,得到了喷嘴与撞针之间间隙、开阀时间和驱动气压对锡膏微滴直径的影响规律。
In order to pursue non-contact solder paste jetting to meet the high precision,fast speed and strong flexibility requirements in modern electronic packaging technology,a solder paste jetting valve driven by piezostack is designed.The system uses piezostack as the driving source,and adopts the striking injection technology to jet solder paste.First,solder paste jetting is theoretically analyzed and the influences of needle structure,nozzle diameter and needle striking speed on the solder paste jetting are investigated using Fluent software.Then,the jetting testing system is set up and the effects of the gap between nozzle and needle,the valve opening time and the driving pressure on the diameter of solder paste droplet are obtained.
In order to pursue non-contact solder paste jetting to meet the high precision,fast speed and strong flexibility requirements in modern electronic packaging technology,a solder paste jetting valve driven by piezostack is designed.The system uses piezostack as the driving source,and adopts the striking injection technology to jet solder paste.First,solder paste jetting is theoretically analyzed and the influences of needle structure,nozzle diameter and needle striking speed on the solder paste jetting are investigated using Fluent software.Then,the jetting testing system is set up and the effects of the gap between nozzle and needle,the valve opening time and the driving pressure on the diameter of solder paste droplet are obtained.
引文
[1]周德俭.SMT组装质量检测与控制[M].北京:国防工业出版社,2007.
[2]王卫平.电子产品制造技术[M].北京:清华大学出版社,2005.
[3]Chen X B,Shoenau G,Zhang W J.Modeling of time-pressure fluid dispensing processes[J].IEEE Transactions on Electronics Packaging Manufacturing,2000,23(4):300-305.
[4]Chen C P,Li H X,Ding H.Modeling and control of time-pressure dispensing for semiconductor manufacturing[J].International Journal of Automation&Computing,2007,4(4):422-427.
[5]Jiang P,Deng G.Numerical simulations of 3Dflow in the archimedes pump and analysis of its influence on dispensing quality[C]∥International Symposium on High Density Packaging and Microsystem Integration,IEEE,2007:1-5.
[6]Ashley D,Adamson S J.Advancements in solder paste dispensing[J].Smt Surface Mount Technology,2008,22(7):10.
[7]Luo J,Qi L H,Zhong S Y,et al.Printing solder droplets for micro devices packages using pneumatic drop-on-demand(DOD)technique[J].Journal of Materials Processing Technology,2012,212(10):2066-2073.
[8]Lee T M,Kang T G,Yang J S,et al.Drop-on-demand solder droplet jetting system for fabricating microstructure[J].IEEE Transactions on Electronics Packaging Manufacturing,2008,31(3):202-210.
[9]Son H Y,Nah J W,Paik K W.Formation of Pb/63Sn solder bumps using a solder droplet jetting method[J].IEEE Transactions on Electronics Packaging Manufacturing,2005,28(3):274-281.
[10]Liu Q,Orme M.High precision solder droplet printing technology and the state-of-the-art[J].Journal of Materials Processing Technology,2001,115(3):271-283.
[11]金霞,郭建军,顾小龙,等.锡膏用助焊剂在钎焊过程中作用机理的探讨[J].焊接技术,2009,38(10):38-41.Jin Xia,Guo Jian-jun,Gu Xiao-long,et al.Discussion with the action of solder paste flux in the soldering process mechanism[J].Welding Technology,2009,38(10):38-41.
[12]陈龙春,赵朝辉,王瑞杰,等.焊粉对锡膏稳定性的影响[J].稀有金属,2010,34(6):77-81.Chen Long-chun,Zhao Chao-hui,Wang Rui-jie,et al.Effect of solder powder on stability of solder paste[J].Chinese Journal of Rare Metals,2010,34(6):77-81.
[13]鲜飞.焊膏印刷领域中的热门先进技术[J].表面安装技术,2008(4):63-65.Xian Fei.Popular advanced technique in the field of solder-paste printing[J].Surface Mounted Technology,2008(4):63-65.
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[15]William H,Kenth N,Johan B,et al.Jetting device and method at a jetting device[P].US Patent:US8215535,2011-01-27.
[16]Jens B,Hakan S,William H.Method for generating ajetting program[P].US Patent:US7912569,2004-11-15.
[17]龚晖.焊膏喷印技术[C]∥2008中国高端SMT学术会议,西安,2008.
[18]刘佳书.锡膏喷印机的设计及喷印机理分析[D].沈阳:沈阳理工大学机械工程学院,2015.Liu Jia-shu.Design of solder paste printing machine and analysis of printing mechanism[D].Shenyang:School of Mechanical Engineering,Shenyang Ligong University,2015.
[19]顾守东,杨志刚,江海,等.压电驱动液压放大式喷射系统[J].光学精密工程,2015,23(6):1627-1634.Gu Shou-dong,Yang Zhi-gang,Jiang Hai,et al.Piezoelectric driven hydraulic amplification jetting system[J].Optics and Precision Engineering,2015,23(6):1627-1634.
[20]范增华,荣伟彬,王乐锋,等.压电驱动微点胶器的控制与实验[J].光学精密工程,2016,24(5):1042-1049.Fan Zeng-hua,Rong Wei-bin,Wang Le-feng,et al.Control and experiment of micro-dispenser by piezoelectric drive[J].Optics and Precision Engineering,2016,24(5):1042-1049.
[21]王凯.非牛顿流体的流动、混合和传热[M].杭州:浙江大学出版社,1988.
[2]王卫平.电子产品制造技术[M].北京:清华大学出版社,2005.
[3]Chen X B,Shoenau G,Zhang W J.Modeling of time-pressure fluid dispensing processes[J].IEEE Transactions on Electronics Packaging Manufacturing,2000,23(4):300-305.
[4]Chen C P,Li H X,Ding H.Modeling and control of time-pressure dispensing for semiconductor manufacturing[J].International Journal of Automation&Computing,2007,4(4):422-427.
[5]Jiang P,Deng G.Numerical simulations of 3Dflow in the archimedes pump and analysis of its influence on dispensing quality[C]∥International Symposium on High Density Packaging and Microsystem Integration,IEEE,2007:1-5.
[6]Ashley D,Adamson S J.Advancements in solder paste dispensing[J].Smt Surface Mount Technology,2008,22(7):10.
[7]Luo J,Qi L H,Zhong S Y,et al.Printing solder droplets for micro devices packages using pneumatic drop-on-demand(DOD)technique[J].Journal of Materials Processing Technology,2012,212(10):2066-2073.
[8]Lee T M,Kang T G,Yang J S,et al.Drop-on-demand solder droplet jetting system for fabricating microstructure[J].IEEE Transactions on Electronics Packaging Manufacturing,2008,31(3):202-210.
[9]Son H Y,Nah J W,Paik K W.Formation of Pb/63Sn solder bumps using a solder droplet jetting method[J].IEEE Transactions on Electronics Packaging Manufacturing,2005,28(3):274-281.
[10]Liu Q,Orme M.High precision solder droplet printing technology and the state-of-the-art[J].Journal of Materials Processing Technology,2001,115(3):271-283.
[11]金霞,郭建军,顾小龙,等.锡膏用助焊剂在钎焊过程中作用机理的探讨[J].焊接技术,2009,38(10):38-41.Jin Xia,Guo Jian-jun,Gu Xiao-long,et al.Discussion with the action of solder paste flux in the soldering process mechanism[J].Welding Technology,2009,38(10):38-41.
[12]陈龙春,赵朝辉,王瑞杰,等.焊粉对锡膏稳定性的影响[J].稀有金属,2010,34(6):77-81.Chen Long-chun,Zhao Chao-hui,Wang Rui-jie,et al.Effect of solder powder on stability of solder paste[J].Chinese Journal of Rare Metals,2010,34(6):77-81.
[13]鲜飞.焊膏印刷领域中的热门先进技术[J].表面安装技术,2008(4):63-65.Xian Fei.Popular advanced technique in the field of solder-paste printing[J].Surface Mounted Technology,2008(4):63-65.
[14]Mohanty R.Solder paste jetting:a broadband solution[J].Printed Circuit Design&Fab:Circuits Assembly,2011,28(11):36.
[15]William H,Kenth N,Johan B,et al.Jetting device and method at a jetting device[P].US Patent:US8215535,2011-01-27.
[16]Jens B,Hakan S,William H.Method for generating ajetting program[P].US Patent:US7912569,2004-11-15.
[17]龚晖.焊膏喷印技术[C]∥2008中国高端SMT学术会议,西安,2008.
[18]刘佳书.锡膏喷印机的设计及喷印机理分析[D].沈阳:沈阳理工大学机械工程学院,2015.Liu Jia-shu.Design of solder paste printing machine and analysis of printing mechanism[D].Shenyang:School of Mechanical Engineering,Shenyang Ligong University,2015.
[19]顾守东,杨志刚,江海,等.压电驱动液压放大式喷射系统[J].光学精密工程,2015,23(6):1627-1634.Gu Shou-dong,Yang Zhi-gang,Jiang Hai,et al.Piezoelectric driven hydraulic amplification jetting system[J].Optics and Precision Engineering,2015,23(6):1627-1634.
[20]范增华,荣伟彬,王乐锋,等.压电驱动微点胶器的控制与实验[J].光学精密工程,2016,24(5):1042-1049.Fan Zeng-hua,Rong Wei-bin,Wang Le-feng,et al.Control and experiment of micro-dispenser by piezoelectric drive[J].Optics and Precision Engineering,2016,24(5):1042-1049.
[21]王凯.非牛顿流体的流动、混合和传热[M].杭州:浙江大学出版社,1988.