摘要
回流焊炉温在线路板的贴装生产中起着至关重要的作用,直接影响电子产品的焊接效果及产品的可靠性,温度测试点位置选取的合理性决定了测试结果的有效性。提出一种车灯用软板带载具(元器件相对分布均匀)过炉测试时的测试点选择的方式,该方法在类似的炉温测试中可以更加快捷准确地确定选点位置。
Reflow oven temperature plays an important role on SMT process,which influences the soldering and the stability of electrical products directly. Whether the test point location is reasonable determines the validity of the test result. This article proposes a method to choose test points for FPC with vehicle before reflow oven temperature test. With the method,test points can be chosen faster and more accurately.
引文
[1]邓北川,申良. SMT回流焊工艺分析及其温控技术实现[J].电子工艺技术,2008(1):30-32.
[2]朱涛.表面组装(SMT)回流焊工艺论述[J].电子电路与贴装,2007(4):41-42.
[3]王文龙.回流焊焊接关键工艺的研究[J].科技视界,2015(22):99.