某天线装配焊接技术攻关
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摘要
某天线需要将绝缘子、微带板与镀银基板进行装配、焊接。文章采用回流焊接工艺方法作为焊接方案,通过试验逐一验证装配方案的可行性,并对焊接后的天线进行外观及焊点检测,结果证明工艺方法可满足图纸设计要求,成功完成了天线的攻关。
A certain array of antenna needs to be assembled and welded with insulators micro-strip boards silver plating substrate. This paper uses the methods of reflow soldering as a welding scheme through the experiment one by one to verify the feasibility of the scheme. It detects the exterior and solder joint, and the results show that the methods of process can meet the design requirements, and can successfully complete the technology tackling of the antenna.
A certain array of antenna needs to be assembled and welded with insulators micro-strip boards silver plating substrate. This paper uses the methods of reflow soldering as a welding scheme through the experiment one by one to verify the feasibility of the scheme. It detects the exterior and solder joint, and the results show that the methods of process can meet the design requirements, and can successfully complete the technology tackling of the antenna.
引文
[1]徐浩平,薛衫,胡宁.铜基微带板加工技术[J].印制电路信息,2013,10(4):64-64.
[2]樊融融.现代电子装联工艺过程控制[M].北京,电子工业出版社,2010:284-285.
[3]黄宗顺.SMD焊接温度曲线的探讨和分析[J].电子工艺技术,2003(1),16-18.
[4]李岩,赵立博,张伟,邱兆义.对回流焊炉温度设定的分析与优化[J].船电技术,2010(7):44-46.
[5]樊融融.现代电子装联焊接技术基础及其应用[M].北京,电子工业出版社,2015.
[2]樊融融.现代电子装联工艺过程控制[M].北京,电子工业出版社,2010:284-285.
[3]黄宗顺.SMD焊接温度曲线的探讨和分析[J].电子工艺技术,2003(1),16-18.
[4]李岩,赵立博,张伟,邱兆义.对回流焊炉温度设定的分析与优化[J].船电技术,2010(7):44-46.
[5]樊融融.现代电子装联焊接技术基础及其应用[M].北京,电子工业出版社,2015.