反射杯影响COB封装LED的光、热性能的模拟仿真与实验研究
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摘要
通过应用多物理多尺度有限元软件COMSOL及光学追踪设计软件Tracepro分别模拟仿真了不同发射杯结构COB封装的LED芯片的散热和出光性能,并对结温和光效等模拟计算结果进行了实验验证。结果表明:COB封装散热性能优于SMT封装,去掉散热基板上的绝缘层会显著降低结温和热阻;通过优化COB封装情况下的反射杯结构,发现:当反射杯杯口、杯底直径、深度分别为3. 0 mm、1. 6 mm、0. 6 mm时,出光效率为48. 36%,比无反射杯的光效提高20%,辐照强度增加1倍;铝基板上封装的LED,模拟与实测结温之间的相对误差约为4. 42%,表明模拟与实验结果一致。出于经济和成本考虑,建议优选带反射杯的铝基板进行COB封装。
The heat dissipation and light output performance of COB-packaged LED chips with different emitter cup structures were simulated by using COMSOL,a multi-physical and multi-scale finite element software,and Tracepro,an optical tracking design software,respectively. The simulation results of junction temperature and light efficiency were experimentally verified. The results show that the heat dissipation performance of COB package is better than that of SMT package,and the junction temperature and thermal resistance can be significantly reduced by removing the insulation layer on the heat dissipation substrate. By optimizing the structure of the reflector cup under COB package,it is found that when the diameter of mouth and bottom,and depth of the reflector cup are respectively 3. 0 mm,1. 6 mm and 0. 6 mm,the output light efficiency of LED is 48. 36%,20% higher than that of the non-reflector cup,and the irradiation intensity is doubled. The relative error between the simulation and measured junction temperature of Al-MPCB packaged LED is about 4. 42%,indicating that the simulation results are in agreement with the experimental ones. For economic and cost considerations,it is suggested that Al reflector cup is preferred for COB packaging.
The heat dissipation and light output performance of COB-packaged LED chips with different emitter cup structures were simulated by using COMSOL,a multi-physical and multi-scale finite element software,and Tracepro,an optical tracking design software,respectively. The simulation results of junction temperature and light efficiency were experimentally verified. The results show that the heat dissipation performance of COB package is better than that of SMT package,and the junction temperature and thermal resistance can be significantly reduced by removing the insulation layer on the heat dissipation substrate. By optimizing the structure of the reflector cup under COB package,it is found that when the diameter of mouth and bottom,and depth of the reflector cup are respectively 3. 0 mm,1. 6 mm and 0. 6 mm,the output light efficiency of LED is 48. 36%,20% higher than that of the non-reflector cup,and the irradiation intensity is doubled. The relative error between the simulation and measured junction temperature of Al-MPCB packaged LED is about 4. 42%,indicating that the simulation results are in agreement with the experimental ones. For economic and cost considerations,it is suggested that Al reflector cup is preferred for COB packaging.
引文
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[2] ARIK M,WEAVER S. Chip scale thermalmanagement of high brightness LEDpackages[C]. Proc. of SPIE,2004,5530:214-223.
[3] ZHMAKINA I. Enhancement of light extraction from lightemitting diodes[J]. Phys. Rep.,2011,498(4-5):189-241.
[4] HU J.,YANGL.,AND SHINM W. Thermal and mechanicalanalysis of high-power LEDs with ceramic packages[J].IEEETrans. Device Mater. Reliab.,2008,8(2):297-303.
[5]李华平,柴广跃,彭文达,等.大功率LED的封装及其散热基板研究[J].半导体光电,2007,28(1):47-50.
[6]宁磊,史永胜,史耀华,等.LED封装结构对出光效率的影响[J].液晶与显示,2010,25(6):823-825.
[7]龙兴明. In Ga N/Ga N发光二极管的数学物理模型和特性及最优驱动电流研究[D].重庆:重庆大学博士学位论文,2012.
[8] LONG X,LIAO R,ZHOU J,Numerical simulation on electrical-thermal properties of Ga N-based light-emitting diodes embedded in board[J]. Advances in Opto-Electronics,2012,2012:495981
[9] LONG X,LIAO R,ZHOU J,Development of streetlighting system-based novel high-brightness LED modules[J]. IET Optoelectron.,2009,3(1):40-46
[10] LONG X,LIAO R,ZHOU J,et al. Multiple-chip package embedded on compound board for light emitting diode[J].Electron. Lett.,2011,47(20):28-31.
[11]屠大维,吴仍茂,杨恒亮,等. LED封装光学结构对光强分布的影响[J].光学精密工程,2008,16(5):832-838.
[12]姜斌,宋国华,缪建文,等.基于板上封装技术的大功率LED热分析[J].电子元件与材料,2011,30(6):48-52.
[13]兰海,邓种华,刘著光. LED的COB封装热仿真设计[J].光学学报,2012,33(5):535-549.
[14]马建设,贺丽云,刘彤,等.板上芯片集成封装的发光二极管结构设计[J].光学精密工程,2013,21(4):904-910.
[15] TAN JT,ZHANG SF,QIAN MC,et al. Effect of graphene/Zn O hybrid transparent electrode on characteristics of Ga N light-emitting diodes[J]. Chin. Phys. B,2018,27(11):114401-1~7
[16] QIAN MC,ZHANG SF,LUO HJ,et al. Simulation on effect of metal/graphene hybrid transparent electrode on characteristics of Ga N light emitting diodes[J].Chin. Phys.B,2017,26(10):104402
[17] YAN QX.,ZHANG SF.,LONG XM.,etal.Numerical simulation on thermal-electrical characteristics and electrode patterns of Ga N-LEDs with graphene/Ni Ox hybrid electrode[J]. Chin. Phys. Lett. 2016,33(7):078501,
[18] XUE SJ,FANG L,LONGXM,et al. Influence of ITO,graphene thickness and electrodes buried depth on led thermal-electrical characteristics using numerical simulation[J].Chin.Phys. Lett. 2014,31(2):028501
[19]祁姝琪,丁申冬,郑鹏,等. COB封装对LED光学性能影响的研究[J].电子与封装,2012,107(3):6-9.