基于厚薄膜混合基板的超宽带垂直互联设计
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摘要
针对三维集成电路中基板层间信号垂直互联问题,基于厚薄膜基板的优良特性,设计了一种超宽带的同轴到带状线再到微带线的过渡结构,能够工作到80 GHz。这种垂直结构采用LTCC为基板,旋涂BCB膜层,适用于系统级封装。该结构利用"水滴"匹配的方法,并嵌入空气腔抑制寄生电容,有效地改善了互联结构的射频传输性能。仿真结果表明,其背靠背(同轴-带状线-微带线-带状线-同轴)结构在0～80 GHz频段范围内,回波损耗均低于-17 dB,插入损耗均优于-0.5 dB,驻波比均低于1.35,具有良好的超宽带传输特性。
In order to solve the problem of vertical interconnection of inter-layer signals in three-dimensional integrated circuits, based on the excellent characteristics of thick film substrates, an ultra-wideband coaxial to stripline to microstrip transition structure is designed, which can work up to 80 GHz. This vertical structure uses LTCC as the substrate and spin-coats the BCB film for system-in-package. The structure utilizes a "water droplets" matching method and is embedded in the air cavity to suppress parasitic capacitance, which effectively improves the RF transmission performance of the interconnect structure. The simulation results show that the back-to-back(coaxial-stripline-microstrip-stripline-coaxial) structure has a return loss of less than-17 dB in the frequency range of 0～80 GHz, and the insertion loss is better than-0.5 dB, and VSWR are lower than 1.35, which has good ultra-wideband transmission characteristics.
In order to solve the problem of vertical interconnection of inter-layer signals in three-dimensional integrated circuits, based on the excellent characteristics of thick film substrates, an ultra-wideband coaxial to stripline to microstrip transition structure is designed, which can work up to 80 GHz. This vertical structure uses LTCC as the substrate and spin-coats the BCB film for system-in-package. The structure utilizes a "water droplets" matching method and is embedded in the air cavity to suppress parasitic capacitance, which effectively improves the RF transmission performance of the interconnect structure. The simulation results show that the back-to-back(coaxial-stripline-microstrip-stripline-coaxial) structure has a return loss of less than-17 dB in the frequency range of 0～80 GHz, and the insertion loss is better than-0.5 dB, and VSWR are lower than 1.35, which has good ultra-wideband transmission characteristics.
引文
[1] 金雁冰,刘建勇.KU波段LTCC基板微带到带状线垂直互联设计[J].信息通信,2016(2):43-45.
[2] CHANCHANI R, BETHKE D T, WEBB D B, et al. Development and RF characterization of high density integrated substrate technology[J]. IEEE Transactions on Components and Packaging Technologies, 2007, 30(3): 478-485.
[3] STRANDJORD A, GARROU P E, IDA Y, et al. MCM-D fabrication with photosensitive benzocyclobute-ne: Processing solder bumping, systems assembly, and testing[C].Microelectronics 1995,1995(2946): 402.
[4] ALIMENTI F,MEZZANOTTE P,TASSELLI G,et al. Development of low-cost 24-GHz circuits exploiting system-in-package(SiP) approach and commercial PCB technology[J]. IEEE Trans actions on Components,Packaging and Manufacturing Technology,2012,2(8): 1265-1274.
[5] KORIYAMA S,KITAZAWA K,SHINO N,et al. Millimeter-wave ceramic package for a surface mount [C]. Proceedings of IEEE MTT-S International Microwave Symposium Digest,2000:61-64.
[6] HUANG X, WU K L. A broadband and vialess vertical microstrip-to-microstrip transition[J]. IEEE Transactions on Microwave Theory and Techniques, 2012, 60(4): 938-944.
[7] KIM Y, SIM S H, YOON Y C. Multilayer compact hybrid coupler based on vertical microstrip transition[C]. Asia-Pacific Microwave Conference (APMC), IEEE, 2013: 914-916.
[8] NELSON K J, LINDO A O, AANANDAN C K, et al. Broadband vertical transitions between double-sided parallel-strip line and coplanar waveguide[J]. Progress In Electromagnetics Research, 2018(75): 119-124.
[9] 王正伟. 基于LTCC技术的微波毫米波收发组件研究[D].成都:电子科技大学,2012.
[10] 凌天庆.无背钻孔的微波板间垂直互连研究[J].现代雷达,2014,36(6):65-68.
[11] 刘江洪,刘长江,罗明,等.基于毛纽扣的板级垂直互连技术[J].电子工艺技术,2016,37(3):135-137,186.
[12] 张先荣.一种低损耗毫米波垂直互联设计[J].电讯技术,2017,57(7):825-829.
[13] 陈寰贝,梁秋实,刘玉根,等. 厚薄膜混合氮化铝多层基板技术研究[J]. 真空电子技术,2015(4):9-10,20.
[14] CHAI L, SHAIKH A, STYGAR V. LTCC for wireless and photonic packaging applications[C]. 4th International Symposium on Electronic Materials and Packaging, IEEE, 2002: 381-385.
[15] 张兆华,崔鲁婧,李浩,等.基于BCB的薄膜多层基板在毫米波T/R组件中的应用[J].微波学报,2017,33(1):63-66.
[16] SCHMUCKLE F J, JENTZSCH A, HEINRICH W, et al. LTCC as MCM substrate: Design of strip-line structures and flip-chip interconnects[C]. IEEE MTT-S International Microwave Symposium Digest, 2001: 1903-1906.
[2] CHANCHANI R, BETHKE D T, WEBB D B, et al. Development and RF characterization of high density integrated substrate technology[J]. IEEE Transactions on Components and Packaging Technologies, 2007, 30(3): 478-485.
[3] STRANDJORD A, GARROU P E, IDA Y, et al. MCM-D fabrication with photosensitive benzocyclobute-ne: Processing solder bumping, systems assembly, and testing[C].Microelectronics 1995,1995(2946): 402.
[4] ALIMENTI F,MEZZANOTTE P,TASSELLI G,et al. Development of low-cost 24-GHz circuits exploiting system-in-package(SiP) approach and commercial PCB technology[J]. IEEE Trans actions on Components,Packaging and Manufacturing Technology,2012,2(8): 1265-1274.
[5] KORIYAMA S,KITAZAWA K,SHINO N,et al. Millimeter-wave ceramic package for a surface mount [C]. Proceedings of IEEE MTT-S International Microwave Symposium Digest,2000:61-64.
[6] HUANG X, WU K L. A broadband and vialess vertical microstrip-to-microstrip transition[J]. IEEE Transactions on Microwave Theory and Techniques, 2012, 60(4): 938-944.
[7] KIM Y, SIM S H, YOON Y C. Multilayer compact hybrid coupler based on vertical microstrip transition[C]. Asia-Pacific Microwave Conference (APMC), IEEE, 2013: 914-916.
[8] NELSON K J, LINDO A O, AANANDAN C K, et al. Broadband vertical transitions between double-sided parallel-strip line and coplanar waveguide[J]. Progress In Electromagnetics Research, 2018(75): 119-124.
[9] 王正伟. 基于LTCC技术的微波毫米波收发组件研究[D].成都:电子科技大学,2012.
[10] 凌天庆.无背钻孔的微波板间垂直互连研究[J].现代雷达,2014,36(6):65-68.
[11] 刘江洪,刘长江,罗明,等.基于毛纽扣的板级垂直互连技术[J].电子工艺技术,2016,37(3):135-137,186.
[12] 张先荣.一种低损耗毫米波垂直互联设计[J].电讯技术,2017,57(7):825-829.
[13] 陈寰贝,梁秋实,刘玉根,等. 厚薄膜混合氮化铝多层基板技术研究[J]. 真空电子技术,2015(4):9-10,20.
[14] CHAI L, SHAIKH A, STYGAR V. LTCC for wireless and photonic packaging applications[C]. 4th International Symposium on Electronic Materials and Packaging, IEEE, 2002: 381-385.
[15] 张兆华,崔鲁婧,李浩,等.基于BCB的薄膜多层基板在毫米波T/R组件中的应用[J].微波学报,2017,33(1):63-66.
[16] SCHMUCKLE F J, JENTZSCH A, HEINRICH W, et al. LTCC as MCM substrate: Design of strip-line structures and flip-chip interconnects[C]. IEEE MTT-S International Microwave Symposium Digest, 2001: 1903-1906.