DBC陶瓷基板表面覆铜的熔断电流模型研究
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摘要
为了优化设计直接覆铜(Direct Bonded Copper,DBC)陶瓷基板的表面覆铜层尺寸,并评估覆铜层的极限电流能力,利用有限元仿真分析方法,研究了不同尺寸的DBC陶瓷基板表面覆铜达到熔点时的电流变化,建立了DBC陶瓷基板表面覆铜的熔断电流模型。通过实际测试得到了3组不同DBC陶瓷基板表面覆铜的熔断电流,并与理论模型的计算值相比较。结果表明,理论模型与实测结果之间的误差在2%之内,模型求解的准确性和实用性得到了验证。
In order to optimize the dimension design for surface coating copper of Direct Bonded Copper (DBC)ceramic substrate,and to evaluate the limit current of it,with the help of finite elements simulation analysis method,the variations of current heating the surface bonding coppers of DBC with different dimensions to the fusion point are investigated to build the model of fusing current for DBC surface coating copper. Furthermore,the fusing currents of three different surface bonding copper of DBC are obtained by measurements and are compared with the calculated values of theoretical model. The results show that the error between the theoretical model and the measured result is within 2%. Therefore,the accuracy and the validity of the fusing current mode are verified.
In order to optimize the dimension design for surface coating copper of Direct Bonded Copper (DBC)ceramic substrate,and to evaluate the limit current of it,with the help of finite elements simulation analysis method,the variations of current heating the surface bonding coppers of DBC with different dimensions to the fusion point are investigated to build the model of fusing current for DBC surface coating copper. Furthermore,the fusing currents of three different surface bonding copper of DBC are obtained by measurements and are compared with the calculated values of theoretical model. The results show that the error between the theoretical model and the measured result is within 2%. Therefore,the accuracy and the validity of the fusing current mode are verified.
引文
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[2]Yu C,Buttay C,éric Labouré.Thermal Management and Electromagnetic Analysis for Ga N Devices Packaging on DBC Substrate[J].IEEE Transactions on Power Electronics,2016,32(2):906-910.
[3]刘建涛,王治华,王珂.不同结构电压源换流器损耗对比分析[J].电力系统保护与控制,2013,41(6):105-110.
[4]Teng L,Yue X,Yuxiong L,et al.Packaging and Integration of DBC-Based Si C Hybrid Power Module in 379 W/in3DC/DC Converter[C]//2017 IEEE 3rd International Future Energy Electronics Conference and ECCE Asia(IFEEC 2017-ECCE Asia),Gaoxiong.2017:2250-2255.
[5]米高祥,陈世锋,张建兴,等.一种大容量智能型能馈式蓄电池放电装置[J].电力系统保护与控制,2010(9):88-91.
[6]苏平,张靠社.基于主动式IGBT型Crowbar的双馈风力发电系统LVRT仿真研究[J].电力系统保护与控制,2010,38(23):164-171.
[7]Agata Skwarek,Beata Synkiewicz,Jan Kulawik,et al.High Temperature Thermogenerators Made on DBC Substrate Using Vapour Phase Soldering[J].Soldering and Surface Mount Technology,2015,27(3):125-128.
[8]Elger G,Hanss A,Schmid M,et al.Application of Thermal Analysis for the Development of Reliable High Power LED Modules[C]//11th China International Forum on Solid State Lighting,2014:158-164.
[9]Madenci E,Guven I.The Finite Element Method and Applications in Engineering Using ANSYS[M].Springer US,2006:1-2.
[10]于冰,张頔,刘斯扬,等.基于PDP扫描驱动芯片的LQFP封装热特性研究[J].电子器件,2013,36(4):437-442.
[11]Akhtar S S,Kareem L T,Arif A F M,et al.Development of a CeramicBased Composite for Direct Bonded Copper Substrate[J].Ceramics International,2017,43(6):5236-5246.
[12]Kulkarni S,Arifeen S,Patterson B,et al.Evaluation of Ceramic Substrates for High Power and High Temperature Applications[J].Stellenbosch Stellenbosch University,2011,2011 Ceramic Interconnect and Ceramic Microsystems Technologies:000199-000206.
[13]郑利兵,韩立,刘钧,等.基于三维热电耦合有限元模型的IGBT失效形式温度特性研究[J].电工技术学报,2011,26(7):242-246.
[14]Dong G,Lei G,Chen X,et al.Edge Tail Length Effect on Reliability of DBC Substrates under Thermal Cycling[J].Soldering and Surface Mount Technology,2009,21(3):10-15.
[15]赵东亮,高岭.功率模块用陶瓷覆铜基板研究进展[J].真空电子技术,2014(5):17-20.
[16]杨世铭,陶文铨.传热学[M].北京:高等教育出版社,2006:4-5.
[17]陈民铀,高兵,杨帆,等.基于电-热-机械应力多物理场的IGBT焊料层健康状态研究[J].电工技术学报,2015,30(20):252-260.
[18]Li J,Castellazzi A,Eleffendi M A,et al.A Physical RC Network Model for Electro-Thermal Analysis of a Multichip Si C Power Module[J].IEEE Transactions on Power Electronics,2017,33(3):2494-2508.