Ag-4wt%TiB_2复合材料复压复烧工艺
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摘要
采用粉末冶金法制备了Ag-4%TiB2复合材料,研究了复压复烧工艺对Ag-4%TiB2复合材料组织和性能的影响。结果表明:复压复烧可改善第二相增强颗粒在基体银中的分布,使组织更加致密。随着保压时间的延长,Ag-4%TiB2复合材料的致密度、硬度和导电率呈先上升后下降的趋势;保压120s时,该复合材料的致密度、硬度和导电率达到最大值,分别为85%、115HB和50%IACS。与未复压复烧相比,Ag-4%TiB2复合材料的致密度、硬度和导电率分别提高了5.6%、6.48%和11.53%。
Ag-4%TiB2 composite was prepared by powder metallurgy technique,and the effects of recompacting and resintering process on the microstructure and properties of the composite were studied.The results show that the recompacting and resintering technique can improve the distribution of second phase particles in the matrix silver,and the composite can be more dense.The density,hardness and electric conductivity of the composite first increase and then decrease with the increase of pressure holding time.When the holding time is 120 s,the density,hardness and electric conductivity of the composite reach the maximum values of 85%,115 HB and 50%IACS,respectively.Compared with Ag-4% TiB2 composite without recompacting and resintering process,the density,hardness and electric conductivity of recompacted-resintered Ag-4%TiB2 composite increases by 5.6%,6.48% and 11.53%,respectively.
Ag-4%TiB2 composite was prepared by powder metallurgy technique,and the effects of recompacting and resintering process on the microstructure and properties of the composite were studied.The results show that the recompacting and resintering technique can improve the distribution of second phase particles in the matrix silver,and the composite can be more dense.The density,hardness and electric conductivity of the composite first increase and then decrease with the increase of pressure holding time.When the holding time is 120 s,the density,hardness and electric conductivity of the composite reach the maximum values of 85%,115 HB and 50%IACS,respectively.Compared with Ag-4% TiB2 composite without recompacting and resintering process,the density,hardness and electric conductivity of recompacted-resintered Ag-4%TiB2 composite increases by 5.6%,6.48% and 11.53%,respectively.
引文
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[13]古映莹,宋丰轩,杨天足,等.Ag/SnO2电接触材料的制备及烧结条件对密度的影响[J].粉末冶金材料科学与工程,2007,12(1):39-42.
[2]郑冀,高晶,李松林,等.新型银氧化锡电接触材料[J].稀有金属材料与工程,2005,34(3):483-485.
[3]谢明,杨有才,黎玉盛,等.常用银基电工触头材料及无镉新材料的开发[J].贵金属,2006,27(4):61-66.
[4]郭自鹏,董亮,王豫.银基金属氧化物电触头材料的发展与现状[J].电工材料,2007,(2):35-39.
[5]陈敬超,孙加林,张昆华,等.银氧化镉材料的欧盟限制政策与其他银金属氧化物电接触材料的发展[J].电工材料,2002,(4):41-44.
[6]叶家健,熊惟皓,徐坚,等.低压继电器用AgSnO2触头材料的研究进展[J].材料导报,2007,21(2):87-90.
[7]郑冀,李松林,张勇,等.纳米掺杂SnO2粉末材料的研究[J].电工材料,2003,(3):12-15.
[8]Ronald G.Material properties of titanium diboride[J].Journalof Research of the National Institute of Standards andTechnology,2000,105(5):709-720.
[9]张宝霞,Ngai Tungwai,郑伟,等.复压复烧对烧结减摩Cu-Ti3SiC2导电材料性能的影响[J].稀有金属,2012,36(3):380-384.
[10]邓景泉,吴玉程,王文芳,等.高强高导纳米复合材料CuCrZr/AlN的组织与性能[J].中国有色金属学报,2007,17(3):428-433.
[11]Wang X H,Li G J,Zou J T,et al.Investigation onpreparation,microstructure,and properties of AgTiB2 composite[J].Journal of Composite Material,2010,45(12):1285-1293.
[12]李桂景,王献辉,邹军涛,等.添加剂对Ag/TiB2复合材料组织与性能的影响[J].粉末冶金技术,2010,28(6):411-414.
[13]古映莹,宋丰轩,杨天足,等.Ag/SnO2电接触材料的制备及烧结条件对密度的影响[J].粉末冶金材料科学与工程,2007,12(1):39-42.