添加SAC微粒对SnBi锡膏焊后性能的影响
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摘要
采用机械混合的方法,向Sn58Bi(Sn Bi)共晶锡膏中添加不等量的Sn-3.0Ag-0.5Cu(SAC)微粒,制备Sn Bi-SAC复合锡膏。在不改变Sn Bi锡膏低温焊接工艺的前提下,改善Sn Bi锡膏焊后合金硬脆缺陷。实验结果表明:Sn Bi-SAC复合锡膏中SAC微粒含量分别为质量分数0,3%,5%,8%时,采用180℃低温焊接均可获得良好的钎焊效果。与Sn Bi共晶锡膏焊后合金相比较,Sn Bi-SAC复合锡膏中SAC微粒含量的增加促使焊后合金微观组织中的β-Sn相含量与晶粒尺寸增大,改善了Sn Bi焊后合金中富Bi相的致密网状结构。当锡膏中SAC微粒含量由0增大至质量分数8%时,合金硬度从213.9 m Pa下降到117 m Pa,对Sn Bi锡膏焊后合金硬脆缺陷起到改善效果。
The Sn Bi-SAC composite solder pastes were prepared by adding various amount of Sn-3.0Ag-0.5Cu(SAC) particles into the Sn58Bi(Sn Bi) eutectic solder paste using a mechanical mixing method. The aim of this study was to suppress the hardness and brittleness of the as-reflowed Sn Bi solder paste without any change of the soldering process. Experimental results show that the Sn Bi-SAC composite solder pastes can be well soldered by the low-temperature soldering at 180 ℃ when the concentration of SAC particles is 0, 3%, 5%, and 8% mass fractions in the solder pastes, respectively. Compared with the Sn Bi solder paste, the addition of SAC particles in the Sn Bi-SAC composite solder pastes significantly improves the concentration as well as the grain size of β-Sn phase in the as-reflowed solder alloys. Meanwhile, the compact net structure of the Bi-rich phase is suppressed because of the addition of the SAC particles in the solder pastes. As the concentration of SAC particles increases from 0 to 8%(mass fraction) in the composite solder paste, the hardness of the as-reflowed alloys decreases from 213.9 m Pa to 117 m Pa. It means that the hardness and brittleness of the Sn Bi solder alloy are suppressed by the addition of SAC particles into the solder paste.
The Sn Bi-SAC composite solder pastes were prepared by adding various amount of Sn-3.0Ag-0.5Cu(SAC) particles into the Sn58Bi(Sn Bi) eutectic solder paste using a mechanical mixing method. The aim of this study was to suppress the hardness and brittleness of the as-reflowed Sn Bi solder paste without any change of the soldering process. Experimental results show that the Sn Bi-SAC composite solder pastes can be well soldered by the low-temperature soldering at 180 ℃ when the concentration of SAC particles is 0, 3%, 5%, and 8% mass fractions in the solder pastes, respectively. Compared with the Sn Bi solder paste, the addition of SAC particles in the Sn Bi-SAC composite solder pastes significantly improves the concentration as well as the grain size of β-Sn phase in the as-reflowed solder alloys. Meanwhile, the compact net structure of the Bi-rich phase is suppressed because of the addition of the SAC particles in the solder pastes. As the concentration of SAC particles increases from 0 to 8%(mass fraction) in the composite solder paste, the hardness of the as-reflowed alloys decreases from 213.9 m Pa to 117 m Pa. It means that the hardness and brittleness of the Sn Bi solder alloy are suppressed by the addition of SAC particles into the solder paste.
引文
[1]MASLINDA K,ANASYIDA A S,NURULAKMAL M S.Effect of Al addition to bulk microstructure,IMC formation,wetting and mechanical properties of low-Ag SAC solder[J].J Mater Sci-Mater Electron,2016,27(1):489-502.
[2]高鹏,林健,雷永平,等.SAC系无铅钎料中银含量对接头抗冲击性能的影响[J].电子元件与材料,2014,33(10):67-71.
[3]刘洋,孙凤莲.Ni和Bi元素对Sn Ag Cu钎焊界面金属化合物生长速率的影响[J].中国有色金属学报,2012,22(2):133-137.
[4]MORRIS J W,GOLDSTEIN J L F,MEI Z.Microstructure and mechanical properties of Sn-In and Sn-Bi solders[J].JOM,1993,45(7):25-27.
[5]ABTEW M,SELVADURAY G.Lead-free solders in microelectronics[J].Mater Sci Eng R,2000,27(5):95-141.
[6]LIU Y,FU H F,SUN F L,et al.Microstructure and mechanical properties of as-reflowed Sn58Bi composite solder pastes[J].J Mater Process Technol,2016,238:290-296.
[7]REN G,WILDING I J,COLLINS M N.Alloying influences on low melt temperature Sn Zn and Sn Bi solder alloys for electronic interconnections[J].J Alloys Compd,2016,665:251-260.
[8]LI X Z,MA Y,ZHOU W,et al.Effects of nanoscale Cu6Sn5particles addition on microstructure and properties of Sn Bi solder alloys[J].Mater Sci Eng A,2017,684:328-334.
[9]MOKHTARI O,NISHIKAWA H.Correlation between microstructure and mechanical properties of Sn-Bi-X solders[J].Mater Sci Eng A,2016,651:831-839.
[10]SILVA B L,GARCIA A,SPINELLI J E.Cooling thermal parameters and microstructure features of directionallysolidified ternary Sn-Bi-(Cu,Ag)solder alloys[J].Mater Charact,2016,1 14:30-42.
[2]高鹏,林健,雷永平,等.SAC系无铅钎料中银含量对接头抗冲击性能的影响[J].电子元件与材料,2014,33(10):67-71.
[3]刘洋,孙凤莲.Ni和Bi元素对Sn Ag Cu钎焊界面金属化合物生长速率的影响[J].中国有色金属学报,2012,22(2):133-137.
[4]MORRIS J W,GOLDSTEIN J L F,MEI Z.Microstructure and mechanical properties of Sn-In and Sn-Bi solders[J].JOM,1993,45(7):25-27.
[5]ABTEW M,SELVADURAY G.Lead-free solders in microelectronics[J].Mater Sci Eng R,2000,27(5):95-141.
[6]LIU Y,FU H F,SUN F L,et al.Microstructure and mechanical properties of as-reflowed Sn58Bi composite solder pastes[J].J Mater Process Technol,2016,238:290-296.
[7]REN G,WILDING I J,COLLINS M N.Alloying influences on low melt temperature Sn Zn and Sn Bi solder alloys for electronic interconnections[J].J Alloys Compd,2016,665:251-260.
[8]LI X Z,MA Y,ZHOU W,et al.Effects of nanoscale Cu6Sn5particles addition on microstructure and properties of Sn Bi solder alloys[J].Mater Sci Eng A,2017,684:328-334.
[9]MOKHTARI O,NISHIKAWA H.Correlation between microstructure and mechanical properties of Sn-Bi-X solders[J].Mater Sci Eng A,2016,651:831-839.
[10]SILVA B L,GARCIA A,SPINELLI J E.Cooling thermal parameters and microstructure features of directionallysolidified ternary Sn-Bi-(Cu,Ag)solder alloys[J].Mater Charact,2016,1 14:30-42.