内埋光纤L型夹芯复合材料结构渐进失效分析
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  • 英文篇名:Progressive Failure Analysis of Sandwich Composite L-joint with Embedded Fiber Bragg Grating Sensors
  • 作者:严仁军 ; 于启成
  • 英文作者:YAN Renjun;YU Qicheng;Key Laboratory of High Performance Ship Technology of Ministry of Education,Wuhan University of Technology;School of Transportation, Wuhan University of Technology;
  • 关键词:夹芯复合材料结构 ; 光纤光栅传感器 ; L型节点 ; 渐进失效分析
  • 英文关键词:sandwich composites structure;;fiber bragg grating sensor;;L-joints;;progressive failure analysis
  • 中文刊名:JTKJ
  • 英文刊名:Journal of Wuhan University of Technology(Transportation Science & Engineering)
  • 机构:武汉理工大学高性能船舶技术教育部重点实验室;武汉理工大学交通学院;
  • 出版日期:2019-02-15
  • 出版单位:武汉理工大学学报(交通科学与工程版)
  • 年:2019
  • 期:v.43
  • 语种:中文;
  • 页:JTKJ201901003
  • 页数:5
  • CN:01
  • ISSN:42-1824/U
  • 分类号:15-19
摘要
针对内埋光纤L型夹芯复合材料接头结构,通过有限元仿真,研究了内埋光纤夹芯结构的损伤失效问题.建立了含内埋光纤和不含内埋光纤的L型夹芯复合材料接头的三维有限元模型,编制用户子程序进行渐进失效分析.通过与文献中的试验结果进行对比验证了有限元方法的有效性.在此基础上,讨论了含内埋光纤夹芯复合材料结构的损伤失效机制,并研究了内埋光纤形成的树脂富集区的高度对结构损伤失效的影响.结果表明,埋入光纤引起夹芯结构圆弧肘板上面板应力集中系数超过1.10,使面板处的材料提前发生失效,导致夹芯结构强度降低约3%;当树脂富集区高度大于1.5 mm时,埋入光纤对夹芯结构的损伤失效影响增大.
        Aiming at the L-shaped sandwich composite joint structure of the embedded optical fiber, the damage and failure problem of the embedded optical fiber sandwich structure was studied through finite element simulation. The three-dimensional finite element models of sandwich structures with and without embedded FBG sensors were established, and the progressive failure analysis was carried out by developing user subroutines. The validity of the finite element method is verified by comparing with the experimental results in the literature. On this basis, the damage and failure mechanism of the sandwich composite structure containing embedded optical fibers was discussed, and the influence of the height of resin enrichment region formed by embedded optical fibers on the damage and failure of the structure was studied. The results show that the embedded optical fiber causes the stress concentration coefficient of the panel on the arc elbow plate of the sandwich structure to exceed 1.10, leading to the premature failure of the material at the panel, resulting in a reduction of the sandwich structure strength by about 3 %. When the height of resin pockets is greater than 1.5 mm, the influence of embedding FBG sensors on the damage and failure of sandwich structures is increased.
引文
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