摘要
本文通过对片式多层陶瓷电容器失效原因进行模拟、验证,总结出片式多层陶瓷电容器的各种失效机理,并将其失效机理应用于过程排查,从而锁定产生不良的最终原因,进而消除隐患,使电容器正常运行。
By simulating and verifying the failure reasons of chip multilayer ceramic capacitors, this paper summarized various failure mechanisms of chip multilayer ceramic capacitors, and applied them to process investigation, so as to lock in the final cause of bad, and then eliminated hidden dangers, so as to make the capacitors operate normally.
引文
[1]王磊.MLCC在平板电源中的断裂原因分析与改进措施[J].电子元件与材料,2013(1):42-44.
[2]王天午.MLCC电容失效分析总结[J].电声技术,2018(2):39-43,73.
[3]张晓芳,杜磊,何亮,等.多层陶瓷电容器热应力损伤检测方法的研究[J].电子元器件应用,2012(2):1-3.