Mg对真空压力浸渗SiC_p/Al复合材料组织和性能的影响
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摘要
采用光学显微镜、X射线衍射仪和电子万能试验机等手段研究Mg含量对真空压力浸渗SiCp/Al复合材料组织和性能的影响。结果表明:Mg能提高Al合金的浸渗性能,Mg含量的增加使复合材料致密度升高。Mg促进SiC/Al界面反应的发生,当Mg含量为0~6%(质量分数)时,未观察到明显界面反应产物;当Mg含量为8%时,发生界面反应生成Mg_2Si和Al_4C_3。当Mg含量为0~6%时,由于复合材料致密度的提高及Mg对Al基体的固溶强化作用,导致复合材料强度提高;当Mg含量为8%时,生成的Al_4C_3降低Si C/Al界面结合力,使复合材料强度下降。当Mg含量为0~4%时,致密度的提高使复合材料热导率上升;当Mg含量为4%~8%时,过量的Mg使Al基体热导率降低,Al_4C_3的生成使界面热传导受阻,导致复合材料热导率下降。
The effect of Mg content on the microstructures and properties of Si Cp/Al composites prepared by vacuum pressure infiltration was investigated by optical microscopy, X-ray diffractometer and electronic universal testing machine. The results reveal that the addition of Mg enhances the infiltration ability of Al matrix, leading to the increase of relative densities of composites. The addition of Mg promotes the Si C/Al interface reactions, no obvious reaction products are observed when Mg content is 0-6%(mass fraction), while both Mg_2 Si and Al_4C_3 form at Mg content of 8%. The strength of composites increases with the increasing content of Mg when Mg content is among 0-6%, due to the increase of relative densities and strengthening of Al matrix by solid solution hardening. When Mg content is 8%, the formation of Al_4C_3 leads to the decrease the bonding strength of Si C/Al interfaces, undermining the bonding strength of composites. The thermal conductivity of composites increases with the increasing Mg content when Mg content is 0-4%, because of the increases of relative densities. When Mg content is 4-8%, the thermal conductivity of composites decreases as Mg content increases. It is explained by the combined action of excessive Mg undermining the thermal conductivity of Al matrix and Al_4C_3 weakening the heat transfer of interfaces.
The effect of Mg content on the microstructures and properties of Si Cp/Al composites prepared by vacuum pressure infiltration was investigated by optical microscopy, X-ray diffractometer and electronic universal testing machine. The results reveal that the addition of Mg enhances the infiltration ability of Al matrix, leading to the increase of relative densities of composites. The addition of Mg promotes the Si C/Al interface reactions, no obvious reaction products are observed when Mg content is 0-6%(mass fraction), while both Mg_2 Si and Al_4C_3 form at Mg content of 8%. The strength of composites increases with the increasing content of Mg when Mg content is among 0-6%, due to the increase of relative densities and strengthening of Al matrix by solid solution hardening. When Mg content is 8%, the formation of Al_4C_3 leads to the decrease the bonding strength of Si C/Al interfaces, undermining the bonding strength of composites. The thermal conductivity of composites increases with the increasing Mg content when Mg content is 0-4%, because of the increases of relative densities. When Mg content is 4-8%, the thermal conductivity of composites decreases as Mg content increases. It is explained by the combined action of excessive Mg undermining the thermal conductivity of Al matrix and Al_4C_3 weakening the heat transfer of interfaces.
引文
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[18]PECH-CANUL M I,KATZ R N,MAKHLOUF M M,PICKARD S.The role of silicon in wetting and pressureless infiltration of Si Cp preforms by aluminum alloys[J].Journal of Materials Science,2000,35(9):2167-2173.
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[20]邹爱华.电子封装Si Cp/Al复合材料热导率研究[D].南昌:南昌航空大学,2007:44-45.ZOU Ai-hua.Study on thermal conductivity of Electronic packaging Si Cp/Al composites[D].Nanchang:Nanchang Hangkong University,2007:44-45.
[21]KAWAI C.Effect of interfacial reaction on the thermal conductivity of Al-Si C composites with Si C dispersions[J].Journal of the American Ceramic Society,2001,84(4):896-898.
[2]张强,姜龙涛,武高辉.无压浸渗法制备氧化态Si C颗粒增强铝基复合材料[J].无机材料学报,2012,27(4):353-357.ZHANG Qiang,JIANG Long-tao,WU Gao-hui.Fabrication of oxidized Si C particles reinforced aluminum matrix composite by pressureless infiltration technique[J].Journal of Inorganic Materials,2012,27(4):353-357.
[3]王西涛,张洋,车子璠,李建伟,张海龙.金刚石颗粒增强金属基高导热复合材料的研究进展[J].功能材料,2014,45(7):7001-7015.WANG Xi-tao,ZHANG Yang,CHE Zi-fan,LI Jian-wei,ZHANG Hai-long.Review on the progress of diamond particles dispersed metal matrix composites with superior high thermal conductivity[J].Journal of Functional Materials,2014,45(7):7001-7015.
[4]熊德赣,程辉,刘希从,赵恂,鲍小恒,杨盛良,堵永国.Al Si C电子封装材料及构件研究进展[J].材料导报,2006,20(3):111-115.XIONG De-gan,CHENG Hui,LIU Xi-cong,ZHAN Xun,BAO Xiao-heng,YANG Sheng-liang,DU Yong-guo.Advances in research on aluminum silicon carbide electronic packaging composites and components[J].Materials Review,2006,20(3):111-115.
[5]WU J,ZHANG H,ZHANG Y,LI J,WANG X.Effect of copper content on the thermal conductivity and thermal expansion of Al-Cu/diamond composites[J].Materials&Design,2012,39:87-92.
[6]徐志锋,徐燕杰,余欢,王振军,周珍珍.基体合金对连续Si Cf/Al复合材料显微组织及拉伸强度的影响[J].中国有色金属学报,2015,25(2):392-400.XU Zhi-feng,XU Yan-jie,YU Huan,Wang Zhen-jun,ZHOU Zhen-zhen.Effect of matrix alloy in microstructure and tensile strength of continuous Si Cf/Al composite[J].The Chinese Journal of Nonferrous Metals,2015,25(2):392-400.
[7]BEFFORT O,LONG S,CAYRON C,KUEBLER J,BUFFAT P.Alloying effects on microstructure and mechanical properties of high volume fraction Si C-particle reinforced Al-MMCs made by squeeze casting infiltration[J].Composites Science and Technology,2007,67(3):737-745.
[8]REN S,SHEN X,QU X,HE X.Effect of Mg and Si on infiltration behavior of Al alloys pressureless infiltration into porous Si Cp preforms[J].International Journal of Minerals,Metallurgy,and Materials,2011,18(6):703-708.
[9]刘玫潭,凌嘉辉,刘家成,洪晓松,李国强.电子封装用Al Si C复合材料热导率影响因素探讨[J].半导体光电,2013,34(5):770-774.LIU Mei-tan,LING Jia-hui,LIU Jia-cheng,HONG Xiao-song,LI Guo-qiang.Influencing factors of thermal conductivity of Al Si C composite[J].Semiconductor Optoelectronics,2013,34(5):770-774.
[10]MOLINA J M,SARAVANAN R A,ARPON R,CARCIACORDOVILLA C,LOUIS E,NARCISO J.Pressure infiltration of liquid aluminium into packed Si C particulate with a bimodal size distribution[J].Acta Materialia,2002,50(2):247-257.
[11]HAN D,JONES H,ATKINSON H V.The wettability of silicon carbide by liquid aluminium:the effect of free silicon in the carbide and of magnesium,silicon and copper alloy additions to the aluminium[J].Journal of Materials Science,1993,28(10):2654-2658.
[12]刘玫潭,蔡旭升,李国强.高性能Si C增强Al基复合材料的显微组织和热性能[J].中国有色金属学报,2013,23(4):1040-1046.LIU Meier-tan,CAI Xu-sheng,LI Guo-qiang.Microstructure and thermal properties of high-performance Si C reinforced Al matrix composite[J].The Chinese Journal of Nonferrous Metals,2013,23(4):1040-1046.
[13]徐志锋,余欢,蔡长春,胡美忠,严青松,万红,郑玉惠.真空变压力浸渗法制备高体积分数Si Cp/Al复合材料[J].中国有色金属学报,2006,16(9):1551-1557.XU Zhi-feng,YU Huan,CAI Chang-chun,HU Mei-zhong,YAN Qing-song,WAN Hong,ZHENG Yu-hui.Preparation of high volume fraction Si Cp/Al composites by vacuum adjustable pressure infiltration process[J].The Chinese Journal of Nonferrous Metals,2006,16(9):1551-1557.
[14]樊子民,王晓刚,田欣伟,马宁强.Si C/Al基电子封装复合材料的无压浸渗法制备与热性能研究[J].铸造技术,2009,30(6):741-744.FAN Zi-ming,WANG Xiao-gang,TIAN Xin-wei,MA Ning-qiang.Pressureless infiltration and thermal-properties of Si C porous ceramics reinforced Al composites for electronic packaging[J].Foundry Technology,2009,30(6):741-744.
[15]REN S,HE X,QU X,HUMAIL S I,LI Y.Effect of Si addition to Al-8Mg alloy on the microstructure and thermo-physical properties of Si Cp/Al composites prepared by pressureless infiltration[J].Materials Science and Engineering B,2007,138(3):263-270.
[16]ROMERO J C,ARSENAULT R J.Anomalous penetration of Al into Si C[J].Acta Metallurgica et Materialia,1995,43(2):849-857.
[17]康炘蒙,程小全,郦正能,张纪奎,崔岩.微缺陷对高体积分数Si Cp/Al复合材料拉伸性能的影响[J].航空材料学报,2009,29(2):85-91.KANG Xin-meng,CHENG Xiao-quan,LI Zheng-neng,ZHANG Ji-kui,CUI Yan.Effect of microdefects on tensile properties of high volume fraction Si Cp/Al composites[J].Journal of Aeronautical Materials,2009,29(2):85-91.
[18]PECH-CANUL M I,KATZ R N,MAKHLOUF M M,PICKARD S.The role of silicon in wetting and pressureless infiltration of Si Cp preforms by aluminum alloys[J].Journal of Materials Science,2000,35(9):2167-2173.
[19]SHEN X,REN S,HE X,QIN M,QU X.Study on methods to strengthen Si C preforms for Si Cp/Al composites by pressureless infiltration[J].Journal of Alloys and Compounds,2009,468(1):158-163.
[20]邹爱华.电子封装Si Cp/Al复合材料热导率研究[D].南昌:南昌航空大学,2007:44-45.ZOU Ai-hua.Study on thermal conductivity of Electronic packaging Si Cp/Al composites[D].Nanchang:Nanchang Hangkong University,2007:44-45.
[21]KAWAI C.Effect of interfacial reaction on the thermal conductivity of Al-Si C composites with Si C dispersions[J].Journal of the American Ceramic Society,2001,84(4):896-898.