摘要
为了提高聚酰亚胺(PI)胶粘剂的耐热性能,将碳硼烷引入PI分子链中,首次合成出一种新型含碳硼烷的PI单体,并采用红外光谱(FT-IR)法对其结构进行了表征。结果表明:含碳硼烷的PI单体在400~500℃升温过程中可交联固化;以此作为PI胶粘剂的基体,可赋予PI胶粘剂极佳的热稳定性能(500~1 300℃时热失重变化不大),从而为制备耐高温胶粘剂提供了新的途径和新的方法。
In order to improve the heat-resistance of polyimide(PI) adhesive,a new type PI monomer with carborane was first synthesized by the carborane introduced into PI molecular chain,and its structure was characterized by infrared spectroscopy(FT-IR).The results showed that the PI monomer with carborane could be cured by crosslinking in heating process of 400-500 ℃.When it was used as a matrix of PI adhesive,the PI adhesive had excellent thermal stability(slightly change in hot weight-loss at 500-1 300 ℃).Thereby,a new route and new method for preparing adhesives with high temperature-resistance were offered.
引文
[1]XU Y X,CHEN C X,ZHANG P X,et al.Pervaporation pro-perties of polyimide membranes for separation of ethanol+water mixtures[J].Journal of Chemical&Engineering Data,2006,51(5):1841-1845.
[2]王喜梅,拓锐,柴娟.耐高温有机胶粘剂研究进展[J].化学与黏合,2008,30(6):60-64.
[3]安颢瑗,詹茂盛,王凯.含芴共聚聚酰亚胺胶粘剂的合成与性能研究[J].材料工程,2010(2):17-20.
[4]廖学明,吕兴军,佘万能,等.聚酰亚胺合成方法的比较研究[J].绝缘材料,2008,41(4):33-37,41.
[5]杨彩娟,李笃信,雷霆.耐高温聚酰亚胺结构胶改性研究进展[J].化工新型材料,2011,39(10):14-16,22.
[6]陈平,廖明义.高分子合成材料学[M].北京:化学工业出版社,1998.
[7]霍海涛,孙宏杰,莫松,等.耐高温聚酰亚胺胶粘剂的研究进展[J].材料工程,2010(增刊I):352-355.
[8]DAVIS A R,PETERSON J J,CARTER K R.Effect ofo-carborane on optoelectronic and device-level propertiesof poly(fluorene)s[J].ACS Macro Letters,2012,1(4):469-472.
[9]NUNEZ R,GONZALEZ A,VINAS C,et al.Approachesto the preparation of carborane-containing carbosilanecompounds[J].Organic Letters,2005,7(2):231-233.
[10]ARMSTRONG A F,VALLIANT J F.Microwave-assisted syn-thesis of tricarbonyl rhenacarboranes:Steric and electroniceffects on the 1,2-1,7 carborane cage isomerization[J].Inorganic Chemistry,2007,46(6):2148-2158.
[11]赵娟,黄鹏程,陈功,等.碳十硼烷及其衍生物的反应性及应用[J].化学进展,2012,24(4):556-567.