新型耐高温PI胶粘剂用单体的合成及表征
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  • 英文篇名:Synthesis and characterization of monomer for new type polyimide adhesive with high temperature-resistance
  • 作者:宋育杰 ; 陈功
  • 英文作者:Song Yujie,Chen Gong(School of Materials Science and Engineering,Beijing University of Aeronautics and Astronautics, Beijing 100191,China)
  • 关键词:碳硼烷 ; 耐高温 ; 聚酰亚胺 ; 胶粘剂
  • 英文关键词:carborane;high temperature-resistance;polyimide(PI);adhesive
  • 中文刊名:GXLJ
  • 英文刊名:China Adhesives
  • 机构:北京航空航天大学材料科学与工程学院;
  • 出版日期:2013-02-28
  • 出版单位:中国胶粘剂
  • 年:2013
  • 期:v.22
  • 语种:中文;
  • 页:GXLJ201302006
  • 页数:5
  • CN:02
  • ISSN:31-1601/TQ
  • 分类号:18-22
摘要
为了提高聚酰亚胺(PI)胶粘剂的耐热性能,将碳硼烷引入PI分子链中,首次合成出一种新型含碳硼烷的PI单体,并采用红外光谱(FT-IR)法对其结构进行了表征。结果表明:含碳硼烷的PI单体在400~500℃升温过程中可交联固化;以此作为PI胶粘剂的基体,可赋予PI胶粘剂极佳的热稳定性能(500~1 300℃时热失重变化不大),从而为制备耐高温胶粘剂提供了新的途径和新的方法。
        In order to improve the heat-resistance of polyimide(PI) adhesive,a new type PI monomer with carborane was first synthesized by the carborane introduced into PI molecular chain,and its structure was characterized by infrared spectroscopy(FT-IR).The results showed that the PI monomer with carborane could be cured by crosslinking in heating process of 400-500 ℃.When it was used as a matrix of PI adhesive,the PI adhesive had excellent thermal stability(slightly change in hot weight-loss at 500-1 300 ℃).Thereby,a new route and new method for preparing adhesives with high temperature-resistance were offered.
引文
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