半导体塑封模具浇口设计

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英文篇名：Gate design of semiconductor packing mould 作者：曹玉堂 ; 汪宗华 ; 陈斌 ; 汪宗宝 ; 丁宁 ; 田征 英文作者：CAO Yu-tang;WANG Zong-hua;CHEN Bin;WANG Zong-bao;DING Ning;TIAN Zheng; 关键词：半导体塑封模具 ; 对称设计 ; 注入角 ; 浇口 英文关键词：semiconductor packing mould;;symmetrical design;;injection angle;;gate 中文刊名：MJJS 英文刊名：Die and Mould Technology 机构：铜陵文一三佳科技股份有限公司技术部; 出版日期：2019-03-25 出版单位：模具技术 年：2019 期：No.218 语种：中文; 页：MJJS201902013 页数：3 CN：02 ISSN：31-1297/TG 分类号：52-54

摘要

半导体塑封模具是制造电子元器件后道工序的关键设备。研究了塑封模具浇口的深度、位置和注入角,分析了浇口残留的原因和浇口磨损缺陷并给出了解决方法。介绍了浇口平衡的方法。综合考虑各种因素后设计的浇口,其结构合理、加工方便,且便于维护。
        Semiconductor packing mould is the key equipment after manufacturing electronic components. The depth, position and injection angle of the gate of semiconductor packing mould were studied. The reason of gate residual and the wear of the gate were analyzed, and the solution was given. The method of gate balance was introduced. Considering various factors, the structure of the gate is reasonable, the processing and the maintenance is convenient.

引文

[1] 汪宗华.分立器件类模具设计[J].模具技术,2017(1):14-16.