添加Bi对Cu-Sn合金电化学腐蚀性能的影响
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摘要
本文通过添加不同含量Bi研究了其对Cu-Sn合金组织及电化学腐蚀性能的影响,由于Bi的电负性较大,析出的富Bi相先发生腐蚀,保护了富Cu相及β-Sn相。此外,添加Bi后,β-Sn中固溶了一定量的Bi,改善了原来Cu-Sn异类原子团簇的偏聚状态,使β-Sn和Cu6Sn5组织不能连续析出,细化了合金组织,从而一定程度上提高了Cu-Sn合金的耐腐蚀性能。
Adding different amount of Bi to Cu-Sn alloys can change the corrosion resistance in this study. Electronegativity of Bi is larger than Cu and Sn components,Bi-riched micro-domains is dissolved first in 3. 5% Na Cl solution,which makes other ingredients safer. In addition,the corrosion resistance of the Cu-Sn alloys is improved,which might be attributed to appropriate amount of Bi addition changed the segregation of Cu-Sn heterogeneous clusters. β-Sn and Cu6 Sn5 phase can not be continuously precipitated,which makes the matrix finer.
Adding different amount of Bi to Cu-Sn alloys can change the corrosion resistance in this study. Electronegativity of Bi is larger than Cu and Sn components,Bi-riched micro-domains is dissolved first in 3. 5% Na Cl solution,which makes other ingredients safer. In addition,the corrosion resistance of the Cu-Sn alloys is improved,which might be attributed to appropriate amount of Bi addition changed the segregation of Cu-Sn heterogeneous clusters. β-Sn and Cu6 Sn5 phase can not be continuously precipitated,which makes the matrix finer.
引文
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[3] SURASKID. SEELIGK. The current status of lead. free solder alloys[J]. IEEE Trans Electron Packag Manage,2001,23:244-248.
[4] GAO Yan Fang,CHENG Cong Qian,ZHAO Jie,et al.Electrochemical corrosion of Sn-0. 75Cu solder joints in Na Cl solution[J]. Trans. Nonferrous Met Soc China,2012,22:977-982.
[5]张飞. Sn-Cu-Bi合金液-液结构转变及其对凝固和钎焊性的影响[D].合肥:合肥工业大学,2010.
[6]李克艳,薛冬峰.电负性概念的新拓展[J].科学通报,2008,53(20):2442-2448.
[7]LI Xiao Yun,ZU Fang Qiu,GAO Wen Long,et al. Effects of the Melt State on the Microstructure of Sn-3. 5%Ag Solder at Different Cooling Rates[J]. Applied Surface Science,2012,258:5677-5682.
[8] LI Dezhi,CONWAY Paul P,LIU Changqing. Corrosion characterization of tin-lead and lead free solders in 3. 5%Na Cl solution[J]. Corrosion Science,2008,50:995-1004.